Serial communication protocols play a significant role in technology. These protocols are vital frameworks of an embedded system. They control the transmission of data over the bus. There are several types of serial communication protocols. Each of these protocols has its unique functions.
When creating a development board, there are protocols for relating with active components. In this article, we will be comparing SPI vs I2C vs UART. These hardware interfaces are commonly used in microcontroller development.
What is SPI?
spi
The SPI means Serial Peripheral Interface. It is a protocol that features four wire-based full-duplex communication. The SPI is one of the most common serial protocols well-suited for faster data rates. It uses four wires which are:
MISO (Master Out Slave)
SS/CS (Chip Select)
SCK (Serial Clock Line)
MOSI (Master In Slave Out)
The SPI interface makes use of the master-to-slave format to regulate several slave devices with a master. Unlike UART that is asynchronous, SPI is synchronous. SPI utilizes a built-in clock from the master. This helps to ensure the slave and master devices are operating on the same frequency.
The serial peripheral interface is specifically designed for the connection of microcontrollers. This interface functions at full-duplex and operates at faster data transmission rates. SPI is commonly used in SD cards and display modules.
SPI has continued to take on several forms over the years. Speed is the greatest evolution in SPI. This protocol is now used in applications featuring speeds greater than 100MHz. SPI can send data in various formats like Quad, Dual, and Single I/O SPI. Data transmissions can be faster if more I/O is being used.
SPI communicates in two different ways. Firstly, it selects every device with a CS line. Each device needs a separate CS line. The second method involves daisy chaining. Here, every device is connected to another via its data out to the data in line. The number of SPI devices you can connect has no limit.
In the SPI, there is master and slave communication. The master always starts the communication. During the communication, data shifts out from the master and then shifts into the slave. SPI supports multi-slave communication.
SPI works in a different way. It makes use of separate lines for data. This protocol features a higher bus range speed. The SPI is a synchronous serial data transfer between the peripheral device and the CPU. This protocol is ideal when you need a fast and reliable interface.
When working with this protocol you need to have the appropriate set of tools. The inclusion of logic analyzers and oscilloscopes is helpful in the development process. An oscilloscope is a great tool to use when designing the SPI bus.
Pros and Cons of SPI
Pros
Supports full-duplex
Utilizes a master’s clock. So, it doesn’t require precision oscillators in slaves
Faster data transmission rate
Features simple software implementation
Has no stop and start bits
Features no complex slave addressing system
Cons
There will be complex wiring when more than one slave is in communication
I2C is one of the serial communication protocols. It means inter-integrated –circuit. This protocol is ideal for modules and sensors. 12C is a bidirectional synchronous serial bus. It needs two wires for data transmission between devices linked to the bus.
I2C protocol is ideal for applications that require various parts. 12C can have several masters and slaves. You will find I2C in consumer electronics and industrial equipment. 12C can maintain a vivid communication pathway while linking up about 128 devices to the mainboard.
This protocol features two pins. These pins are the Serial Clock Line (SCL) pin and the Serial Data Line (SDL) pin. The SDL transfers and receives data. Meanwhile, the SCL functions as a clock. I2C is a protocol that offers support to slow devices. Here, the master can transmit and receive data from the slave. The master controls the clock bus. However, in some cases, slaves can suppress the clock signal.
I2C protocol connects low-speed, short-distance peripherals on circuit boards. This protocol is commonly used in reading hardware sensors and reading memory.
How does I2C work?
In the I2C protocol, the master transmits a start bit from its SDA pin. After this, the seven-bit address chooses the slave. After it receives the address and start bit, the slave transmits an acknowledge bit to the master. The slave listens to the SDA and SCL for any incoming transmissions.
The master will know if the connection makes it to the correct slave once it gets the transmissions. Then, the master chooses which memory it wants to access from the slave. It achieves this by sending eight bits that specify which register to use.
After the address has been received, the slave prepares the select register. This is done before it sends another ‘acknowledge bit’ to the master. The master transmits the data bit to the slave after choosing the specific slave. After sending the data, the slave sends a final acknowledge bit to the master.
I2C connects devices like microcontrollers with peripheral devices in an embedded system. The peripheral devices serve as the slave devices. The microcontroller serves as the master device. All devices must feature a distinct address to detect it on the bus. This address enables the master devices to exchange communication between the two wires.
The relationship between the slave and master devices isn’t constant. The sending and receiving of data depend on the direction of data transmission at the time. The master must address the slave before it transmits data. It must also address the slave if it wants to get data from the slave.
The host receives the information the slave has sent. Then, the receiver ends the receiving process. The host generates the timing clock. It also terminates data transfer. Also, it is important to link up the power supply via a pull-up resistor.
Pros and Cons of I2C
Pros
Features a low signal/pin count even with several devices on the bus.
Supports several masters.
Supports multi slave and multi-master communication.
Uses two wires to create communication among several devices.
It can adapt to the demands of different slave devices.
Cons
It becomes complicated when there are more master and slave devices
A UART refers to Universal Asynchronous Receiver Transmitter. It is a form of device-to-device digital communication. A UART is a microchip that controls the interface of a computer to its attached serial devices. It is a protocol used for full-duplex serial communication. The UART is a chip designed to carry out asynchronous communication.
This hardware peripheral converts the outgoing and incoming data into the serial binary stream. UART functions when an application doesn’t require high-speed data transmission. This communication device features a single receiver/transmitter. It needs a single wire for data transmission and another wire for receiving data.
With the help of an RS232-TTL converter, you can interface a URT with a personal computer. This is because a UART and an Rs232 don’t need a clock for receiving and transmitting data. The UART frame features a 1or 2 stop bits and 1 start bit for serial data transfer.
The UART features two core components; the receiver and transmitter. The receiver has a control logic, receiver shift register, and a receive hold register. The transmitter features the control logic, transmit hold register, and transmit shift.
The mode of transmission in a UART is in the form of a packet. A packet features a data frame, stop bits, start bit, and a parity bit. The UART enables the receiver to communicate with the auxiliary device. This protocol can deal with synchronization management problems between external serial devices and computers.
How does the UART work?
A UART can function between devices in three different ways. These include the simplex, half-duplex, and full-duplex. In simplex, the transmission of data is in one direction. The half-duplex transmits data in either direction. The full-duplex transmits data in both directions simultaneously.
There is data flow from TX of transmitting UART to RX of receiving UART. The TX is the transmit data while the RX is the receiving data. A transmitting UART will get data from a data bus sent by another component. After the UART receives the information from the data bus, it will create the data packet. It needs to include a stop bit, parity bit, and a start bit to create the packet.
The data packet then transmits at the transmit data pin. Here, the receiving UART will interpret the data packet as its receiving data pin. Data transmission continues until data in the transmitting UART finishes.
For data transmission to occur, the receiver and the transmitter must agree with some configurations. These are:
Start bit
Baud speed
Parity bit
Stop bit
Data length
UART requires no clocks. It includes stop and start bits being transferred to indicate the beginning and end of a message. With this, the receiving UART will know when bits should start and stop reading. The receiving UART identifies a start bit and reads the bits at the BAUD rate. This rate is the data transmission speed and is always set to 115,200.
Both the receiving and transmitting UARTs must operate at almost the same baud rate. If the BAUD rate’s difference is above 10%, the bits’ timing may go off. This may render the data useless. You must be certain that UARTs can transfer and receive data from the same packet.
UART, SPI, and 12C are serial communication protocols. However, these serial protocols are different in terms of how they operate. Here, we will be comparing the difference between these three protocols.
Pin designations
For a UART, TxD and RxD are the pin designations. The TxD refers to transmit data while the RxD is the receive data. The pin designations for SPI include MISO, SS, SCLK, and MOSI. The MISO refers to Master Input and Slave Output. SS refers to slave select and SCLK refers to a serial clock. MOSI refers to master output and a slave output. The pin designations for I2C are serial data (SDA) and serial clock (SCL).
Type of communication
UART is asynchronous communication. It is a form of device-to-device digital communication. SPI and I2C are synchronous.
Clock
UART doesn’t use a common clock signal. Here, both devices utilize their independent clocks. In an SPI, there is only one common clock signal between the slave and master devices. In I2C protocol, there is a common clock signal between multiple slaves and multiple masters.
Software
UART features a one-to-one connection between devices. It doesn’t need addressing. The SPI protocol uses slave select lines to address any slave linked with the master. For I2C, there are multiple masters and multiple slaves. Also, all masters can communicate with slaves. I2C can allow about 27 slave devices to connect to its interface.
Communication Protocol
In terms of protocol, the UART uses a stop bit and a start bit for 8 bits of data. I2C uses stop and start bits. For 8 bits of data I2C uses ACK. This indicates if data has been received.
Number of wires
UART features 1 wire while SPI features 4 wires. On the other hand, I2C features 2 wires.
Conclusion
SPI vs I2C vs UART has been discussed in this article. Each of these communication protocols has its unique features. As a user, it is important you choose a protocol that meets your project’s requirements. For instance, the SPI is an ideal choice if you want the fastest protocol. Meanwhile, if you need to connect several devices, the I2C is the best option.
Circuit boards play an essential role in the electronics industry. This is because they are widely used to play various roles in devices such as computers, televisions, and power systems. Printed circuit boards consist of conductive tracks that interconnect components on the board. They include potentiometers, resistors, capacitors, and switches with various voltage or current levels. They are also typically used for electrical safety testing or verification.
According to JIS C5017, the Japanese industrial standard for measuring the mechanical properties of printed circuit boards, a flexible printed circuit (FPC) is a PCB with a cylindrical or rectangular shape that can change its dimensions depending on the requirements of its application. The standard classifies FPCs into two categories: rigid-type and flexible-type. Rigid-type FPCs help connect parts mechanically but cannot bend. The flexible-type FPC is a double-sided PCB that can withstand bending forces. Additionally, we mainly use it in electrical interconnection applications.
FPCs have become popular among engineers due to their easily modified and customized without any solder joints. The flexibility of the FPC allows for different retrofit solutions. It significantly reduces the cost of printing new boards for a specific application. For example, adding functionality onto the face of an existing board is easier than creating a whole new board from scratch.
The composition of an FPC material depends on its intended application and end-use. The flexibility of the FPC relies on the material’s ability to resist cracking, warping, and mechanical damage while maintaining high conductivity. As a result, manufacturers tend to make FPC flexible printed circuits from fiberglass or FR-4 materials. It consists of a mixture of epoxy resins and glass fibers. FR-4 is a rigid board that combines both thermal and electrical properties.
1. Insulating film
It is a layer of high-density polyethylene, which is made by extruding resin through a nozzle and applying it over the substrate. The HDPE film eliminates capacitive coupling between the substrate. It also eliminates other circuits to electrically shield interconnections on top of the board. The HDPE layer also serves as a vapor barrier to prevent moisture from entering the circuit during curing.
2. Electrostatic adhesion layer
After applying the HDPE film, an adhesion layer may attach components. These components may include potentiometers and LEDs to the circuit board to improve performance or decrease cost. The adhesion layer is acrylic or polyimide and allows LEDs to bond directly to the FPC, saving materials and assembly time.
3. Conductor
We then add a conductive layer over the top of the adhesion layer. This layer could be a polyimide or epoxy resin or a printed circuit board itself. To avoid warping, we can apply the conductor to a solution that is 100 °C.
4. Enhanced board
Lastly, we add the second layer of adhesion over the conductor to further decrease flexural or cracking problems. We usually make this layer using cellulose or acrylic.
FPC circuit board fabrication
To fabricate an FPC PCB, the components are first pre-assembled onto the board and then cut to size. The FPC material is then placed inside a mold to bend without breaking. Typically, we heat the FPC material to 120 °C for approximately 1 hour. Do this to achieve the necessary stiffness, which allows the material to resist flexors and bend easily. Components are then added to the mold and subjected to pressurization, which causes them to become embedded into the FPC.
Next, we apply a layer of conducting ink over the top of the components. It helps create a smooth surface that prevents electrical resistance and improves performance.
5. Coverlay
A coverlay is a top plate made from either polyimide or acrylic. The coverlay protects the underside of the FPC material. It also serves as insulation to prevent moisture from entering the FPC material. The coverlay also has high-temperature resistance, allowing us to use it in ovens and heaters.
We use FPCs in applications when we require flexibility and conductivity. However, we do not use it when we need mechanical strength. Since FPCs are thin and lightweight, we use them in portable devices such as cell phones, digital cameras, and walkie-talkies. We can use them in larger devices such as peripheral and power supplies.
RayMing PCB and Assembly developed FPCs to create light products that one can design quickly without adding much weight.
1. Reduce weight and space
Since FPCs do not have terminals for electrical connectors, we can use them in devices that need to be light but need to connect the output of many components. For example, a portable GPS device can use an FPC to connect a small battery to the main unit. The main unit has an internal rechargeable battery. However, the GPS receiver also needs a power source and several other functions such as a display and buttons. The FPC provides all these components, connecting them.
2. Easy customization
FPCs are flexible, and we can cut them to the desired size. Since they are not soldered, they can be easily removed from the circuit board and modified for new uses. You can make a whole new electronic product by adding an FPC with additional components onto a board already used for another purpose. For example, we can add an FPC to connect an external battery to an existing product. They include a car radio, increasing its functionality without completely replacing it.
3. Meet dynamic flexing requirements
We use FPCs primarily on portable devices with their flexibility and low weight. They can conform to flexible products like a cell phone or cut them to the desired size for a new circuit board. These properties make them an ideal choice for use in consumer electronic products.
4. Flexing for easier installation and service
We use FPCs in solar panels for homes and buildings, satellites, power generators, and electric vehicles. One can install solar panels easily in places where they cannot build a roof, or the landscape makes it difficult. The flexibility of these FPCs means they can conform to many different environments while still providing an electrical pathway between the various components. We also use FPCs in electric vehicles. This is because they have a lightweight structure while maintaining the required strength to ensure they will not break when driven.
5. Impedance control
Manufacturers make FPCs of high-quality materials and have high electrical conductivity. So, we also use them in consumer electronic products that require impedance control. The main advantage of using FPCs instead of soldered connections is that we can easily control the impedance, which is necessary for mobile devices like cell phones.
6. Expandability
We need to expand some electronic devices such as solar panels or electric vehicles later. This is due to technological advances or improving user needs. These products can use an FPC to connect to various other components that we can add later as we require new functions.
7. Increase reliability and repeatability
When we use FPCs in solar panels, we weigh the FPCs and mechanically test them to remain steady once installed. This process ensures that the product will be reliable and operate smoothly in many different environments.
Products that we can design use FPCs with good thermal management. Since we cannot solder an FPC to the main board, we can move and replace it with another one to change its thermal properties. This process ensures that the product will always perform well.
9. Improve aesthetics
We can design FPCs to be very thin to reduce the size of the final product and make it look very nice. By printing components on a thin film instead of inside an FPC, one can achieve this. Manufacturers print the components on top of the FPC. It still appears connected to it while retaining its function and appearance.
10. Eliminate connectors
FPCs can eliminate the need for connectors because they can be easily removed and reconnected to other boards. Since there are no connectors and terminals, you do not need to disassemble the product every time you access a cable. You can then reconnect the FPC later, reducing production costs and ensuring that the product looks clean.
11. Reduce assembly cost
FPCs can reduce the assembly cost in many cases. For example, semiconductor companies need to add new components to their production lines. We can use the FPC with other components to create a circuit board. This increases the product’s functionality while decreasing production costs.
12. Increase scalability
FPCs can connect many components onto a central board to create a larger device. Since they are flexible and have low weight, we can assemble these boards into a large product that provides high-performance features.
13. Provide uniform electrical characteristics for high-speed circuitry
Since companies manufacture FPCs using the same high-quality materials and techniques as optical fiber, they provide reliable electrical characteristics for high-speed circuitry. As a result, these circuits can operate at very high speeds without becoming unstable.
14. Improve signal integrity
We can design FPCs to improve signal integrity by reducing noise and reflection. They can also enhance transmission performance and resistance to electromagnetic interference (EMI).
The text above demonstrates that FPCs are ideal for various applications. Also, we can replace traditional circuit boards. The polyester (PET) and polyimide (PEEK) materials used in FPCs are conductive. So, they can connect to other circuits and components. They also provide mechanical protection for more robust products. The 1oz thick, Type-V-PET substrate used in the FPC is flexible and can carry large amounts of current. It also withstands high-temperature variations at the same time. This makes it ideal for high-power applications such as solar panels.
Layer 1
We form the “graphic overlay” at this stage. One first cleans the surface, prints the screen, and then cures it to ensure a high-quality printing process with repeatable properties. Layer 1 is where most of the modifications take place. We print the silkscreen or other overlay patterns. We do this usually in a CMYK format, using high-quality inkjet printers to ensure the sharpest possible image.
Layer 2
The lamination stage involves adding the electrical traces. This layer is an electrically conductive adhesive, laminated with the first layer to form the final FPC product. The adhesive must provide a smooth surface to achieve electrical and mechanical stability. We can achieve this via vacuum or pressure lamination, depending on how rigid or flexible the final product needs.
Layer 3
This is the essential layer, as it provides a strong mechanical bond between the first and second layers. One of the most popular adhesive options is a thin ceramic-based adhesive that provides excellent mechanical properties. We can apply this using either hand or automated systems to ensure consistent production quality at each location.
Layer 4
The final layer determines the physical look and feel of the FPCs. The thickness of this layer can vary depending on various factors. They include material type, application requirements, and production location.
We use Flexible Printed Circuits (FPCs) in many different applications such as solar panels, electric cars, and aircraft. Also, we use them in new applications such as aerial drones and wearable electronics. So, FPCs must provide reliable electrical characteristics for high-speed circuitry. The makers of FPCs use more than 20 different chip types and a wide range of specialized components to create the final product.
PET is a polymer that we commonly use in FPCs. PET has a low thermal expansion, and it is also transparent, which means we can use it for solar panels or as display panels. On the other hand, FPCs are flexible for high-performance display screens or indoor uses.
Flexible Printed Circuit Board (FPC) is a flexible circuit board with low cost and significant saving of transportation space. When we apply the PCB with many components, their size becomes large. Because of the flexible key feature, the manufacture and construction of the FPC become easy.
Flexible Printed Circuit Card (FPC) combines integrated circuit (IC) and thin-film printed circuit traces. We use them to make a flexible circuit board. A flexible printed circuit card is an electronic device used to house an integrated circuit (IC).
Flexible Printed Circuits (FPC) are thin plastic sheets that we can use in applications. Some examples include solar panels, electric cars, aircraft, and new applications such as aerial drones. We make FPCs from electrically conductive, flexible plastic. One etches and prints the top layer of the plastic with various circuits and components. This helps to create circuitry that is thin enough to be flexible while also being durable.
Flexible Printed Circuit Cards (FPCs) are helpful in many different applications. They include solar panels, electric cars, and aircraft. We also use them in new applications such as aerial drones and wearable electronics. So, FPCs must provide reliable electrical characteristics for high-speed circuitry.
Trace Width Benefits
One of the enormous benefits of FPC technology is maintaining high line widths, which leads to increased performance. This performance improvement is significant for wireless applications. There is a critical difference between the time it takes for radio signals to travel from one point on the board to another and the time it takes for the signal to become disrupted by noise and interference. Higher line width allows for greater signal integrity by reducing these delays while increasing data rate and transmission range.
Another benefit of FPC technology is low dielectric constants (low εr). Compared to other materials, such as FR-4, PET allows for smaller trace widths and increased performance. Using a low εr in FPC traces also reduces line width variation, which results in improved signal integrity.
FPCs offer several electrical benefits that are largely due to the use of PET. As previously mentioned, PET is a low dielectric material, and, as a result, FPCs using PET can achieve lower line width variation. Reducing line width variation leads to improved noise immunity and signal integrity.
FPCs also allow for easy routing, which results in improved manufacturing yields. Low temperature co-fired ceramics (LTCC) and silicone is also helpful in the FPC process. It provides circuitry with enhanced thermal performance.
The most common FPC fabrication method is transfer printing. This is because it involves transferring electronic ink onto a surface. Then the etching away portions of the surface to create circuitry. Transfer printing allows for very high-speed processing capabilities. We might need circuits that support wireless communication (e.g., WiFi).
Manufacturing Processes
FPC manufacturing is a complex process that involves the use of many different materials and processes. We can make FPCs by transferring ink onto a flexible substrate. This creates circuits and removes substrate portions to expose the circuitry. We then transfer the ink using an ultra-sensitive printer that applies 500-800 g/cm² of pressure.
The ink used in FPC manufacturing includes a mixture of photoinitiators and photoresists. This allows for high-speed propagation. We can print the desired areas of the circuit first. Then we deposit a thin layer on top of the printed area as an etching mask. The exposed areas are then etched away using oxygen plasma to produce the desired circuitry.
The final step of the FPC manufacturing process involves cutting the circuit into appropriate shapes. The circuit must be thin enough to flex with any movement and thick enough to maintain durability and functionality. The thickness of FPCs typically ranges between 0.031 mm and 0.065 mm. However, it can also be as thin as 0.01 mm or even thinner for special applications (e.g., wearable electronics).
FPCs have numerous applications in multiple different fields. We use FPCs in solar power cells, cell phones, vehicles, and aircraft. Many of these applications require flexible sheets that are thin and durable. So, they can survive bending, folding, or rolling.
1. Hybrid Electronics
These are a type of electronics with both organic and inorganic components. Hybrid electronics are helpful clothing or building materials with embedded electronic devices.
2. Wearable Electronics
Wearable electronics include everything from fitness trackers to glasses and other products we wear on the body. We have been using FPCs for wearable electronics. This is because of their extremely thin, flexible, and transparent properties. It makes them perfect for integrating clothing and other clothing items.
3. Wireless Communication
We have been using FPCs in many different types of wireless communication. They are good since they offer very high speed and low-power capabilities. They are essential on portable devices such as cell phones, laptops, tablets, smartphones, and more. Many of these products require flexible sheets that can bend without damaging the circuitry. Flexible FPCs enable these products to be ultra-thin and durable. They also offer a range of benefits, such as easy routing and simplified designs.
4. Connectors
We use FPCs in all connectors, including low, high and ultra-high temperature versions. FPC connectors are also essential high-speed cables. They include fiber optic cables and miniature radio frequency coaxial cables (e.g., CAT6).
5. Connector & Housings
FPCs are essential in the connector and housing industry because of their versatility and ease of use. Many companies use FPCs to connect many products, including cell phones and other portable devices. Others also use FPCs to house components such as LEDs and capacitors.
6. Printed Circuit Board
FPCs are essential in printed circuit boards (PCBs). They also work best in sheets of circuitry printed onto a flexible substrate usually made with PET or laminated silicon dioxide. FPCs are ideal for PCBs because they can withstand high temperatures. They can also easily integrate into the board and provide excellent flexibility.
7. Portable Devices
FPCs are applicable in the portable device market because of their thin and durable properties. One of the essential properties of FPCs for this market is that we can fold, roll or bend without damaging them.
8. Solar Power
FPCs are perfect for solar power because of their flexibility, thinness, and environmentally friendly properties. We use them in electronics that convert light into energy. They include solar cells, photoelectrochemical cells, and more. These cells are flexible, thin, and durable and provide high efficiency for solar power.
Most producers and sellers determine FPC pricing by the type of application, component, and quantity. For example, a small FPC order for a cell phone used as a business card we can price individually. On the other hand, if we use FPCs in solar cells or an aircraft control system, we could price a larger order that includes more components as one order. The FPC pricing is also affected by the type of product or component. For example, flexible FPC PCBs are essential in smaller orders than rigid FPCs. This is because of their lower setup costs and the smaller quantity of the order.
F-LGA and L-CUP are two common flexible printed circuit board types, which are perfect for various applications.
F-LGA is a type of connector commonly referred to as a micro-connector for its small size. This connector has a unique design suitable for applications. They require reliable, low-cost, and lightweight connections. F-LGA is a type of flex PCB used for high-frequency connections in mobile phones, pagers, portable telephones, video cameras, and more.
L-CUP is a connector with an LC interface designed for signal transfer between fiber optic cables used in network equipment such as routers, hubs, and switches. This connector features a high transmission rate with excellent repeatability. L-CUP is a type of flex PCB used in photovoltaic solar cells, medical devices, and aerospace equipment.
Conclusion
FPC is a flexible component used in a wide range of applications. Because of FPC’s versatility, we can use it in many different applications that need an embedded component with high durability and low cost. This flexibility and capability make FPC circuit an ideal component for many items, including solar cells and cell phones.
FPGA boards are relatively new hot items in the electronics circuit market. With FPGA boards, the hardware design engineer can field-test their designs quickly and cheaply. You can do this by running them on experimental hardware. Rather than waiting weeks or months for prototypes to arrive overseas, they can now do that on FPGA boards. They are incredibly versatile pieces of hardware that can do anything from buffering data to communicating with other nodes. All this does not need additional software development. They are cheap and small, making them perfect for the hobbyist scene.
The Xilinx Spartan-6 FPGAs come in several variations, including the LX9, LX10, and LX110 devices. One can equip the LX9 devices with larger memories than the LX100 and LX110 devices. They also have a different processor architecture than the other two devices.
History
FPGA boards have been around for a while, but they have only recently hit the mainstream. The FPGA prototyping board came to the market in the early 90s and became commercially available in 1995. Xilinx Inc. made the first commercial product. It is still one of the leading companies in the FPGA industry today. This product had an onboard memory base of 8MB SRAM, 10MB of flash memory for data logging. It also has two serial ports for communications with computers. It could communicate using SPI, JTAG, and dual-port RAM. The data rate varied from 55Mbit/s to 875Mbit/s. The board was also capable of operating at temperatures between 0 and 70 degrees Celsius.
The price of these boards varied widely depending on the features included. At the time, the Xilinx board cost about CAD 25,000 in 2001 dollars. Other companies produced cheaper alternatives at around CAD 5000 for a 4MB memory board with no flash memory or communications ports. The cost of the boards has decreased dramatically since then, with the cheapest boards costing less than CAD 60 today. The FPGA prototyping board is now a standard in electronic design testing and prototyping.
The Xilinx Spartan-6 FPGA Boards, a new line of FPGA boards from Xilinx, was officially launched in 2007. Their design is compatible with Xilinx’s latest Spartan-6 FPGAs, which are low power and smaller than the Spartan-3 series. With these new FPGAs, lower power requirements and smaller size came at the cost of decreased processing speed and complexity. The Spartan-6 FPGA boards include all the ports necessary to communicate with other computers or devices through USB or RS232.
The Xilinx Spartan-6 FPGA Boards have no onboard memory, but they have a small RAM and flash memory for data logging. We can access this data through the four serial ports and the two USB ports. It uses an SPI Flash memory device, which the boards can operate at speeds of up to 400MHz. The Flash memory device can store about 8MB of data, written four times a second. This allows the boards to have a maximum data throughput of 400Mbit/sec. The board does not have any RAM for the temporary storage of information. However, it has a few kilobytes of Flash memory to store data that you need to save long term. 2. I/O Ports
The Xilinx Spartan-6 FPGA boards include all the necessary ports for interfacing with computers or other devices. The board has two USB ports, two RS232 serial ports, and four GPIO (General Purpose Input/Output) pins for handling signals. We can use these to connect it directly to other devices utilizing this interface. The serial ports are capable of speeds of up to 6Mbps. The I/O ports can communicate with other devices, log data, or even send messages to the other computers connected via USB.
3. Resources
The Xilinx Spartan-6 FPGA Boards provide several useful resources for software engineers and hardware designers. The board’s design offers a minimum of 4MB of Co-Processor Cache memory. We can optimize the cache for data-intensive applications by directly connecting with the onboard SPI Flash memory. The net effect is a significantly increased efficiency when dealing with large amounts of data. The boards also include several dedicated I/O pins. It can communicate with other devices without the need for additional software development.
4. Design Resources
The Xilinx Spartan-6 FPGA Boards contain all the essential design resources that are available with other boards. They include a 3x1mm socket for the Spartan-6 FPGA, an SPI Flash memory device, and at least 2MB RAM. The board is therefore capable of performing any development. Their design makes them easy to use by both hardware designers and software engineers.
5. Cost
The Xilinx Spartan-6 FPGA Boards are extremely cost-effective. They cost less than USD 60 in 2008 and less than USD 45 today. This enormous savings over other boards can reach upwards of CAD 20,000 for the cheapest boards. The low price of the Xilinx Spartan-6 FPGA Boards greatly increases their value. It makes them ideal for either hobbyists or production users.
6. Datasheets
The Spartan-6 FPGA Boards structure follows the various datasheets created by Xilinx. These datasheets detail the board’s specifications. They include the exact size of the FPGA and its various peripherals. The manufacturer publishes the specifications in pdf format on the manufacturer’s website and complete information on how to get started with development.
The Xilinx Spartan-6 FPGA Boards have a vibrant support community. They often post questions and discussions to the Xilinx forum and answer new users’ questions with detail and patience. They also run Q&A sessions where users can ask complicated questions and receive an instant reply. Because of their newness, the board has a lot of room for growth in this area.
8. Production Capabilities
One can produce the Xilinx Spartan-6 FPGA Boards in volume. They manufacture the board by applying the standard FPGA manufacturing process. It involves several carefully controlled steps that ensure a quality result. One can also produce the board using a configuration that doesn’t require the board to support USB or RS232 interfaces. It is useful in applications where those features aren’t necessary. This would make it much less expensive and smaller as well.
9. Reliability
The Xilinx Spartan-6 FPGA Boards have a low failure rate for individual units. There have been less than five failures of all the boards sold in just the last two years. Their reliability is excellent. The design is sound, and the manufacturing process includes several components that reduce damage due to physical damage or interference.
10. Networking Capabilities
The Xilinx Spartan-6 FPGA Boards are capable of operating in both standalone modes and through an Ethernet network. They include several network interfaces chips. It allows them to communicate directly with other computers and devices. This is useful for development and debugging purposes.
The Spartan-6 FPGA Boards are extremely cost-effective. While they are still more expensive than many other FPGA boards, the Xilinx Spartan-6 FPGA Boards can offer significant savings over boards. They can reach upwards of CAD 20,000 for the cheapest boards. The low price of the Xilinx Spartan-6 FPGA Boards greatly increases their value. It makes them ideal for either hobbyists or production users.
2. Spartan 6 FPGA ICs
The Spartan-6 FPGA is a very high-quality piece of hardware with many advanced features. The FPGAs are high speed, allowing them to operate at speeds of up to 400MHz. They have a large memory capacity, making them ideal for use in large-scale designs. In addition to their internal memory, they directly access external memory through components. A good example is the SPI Flash memory chip. The Spartan-6 FPGA ICs have a high density of logic cells, providing a high processing power. The Xilinx Spartan-6 FPGA boards can operate as standalone devices or as part of a network.
3. Configuration
The Spartan-6 FPGA ICs are very easy to configure using the Xilinx WebPACK software V4.0 and higher. Its configuration is entirely automated, taking only seconds to complete from beginning to end. We can configure the Spartan-6 FPGAs through a simple web interface. This allows both hardware designers and software engineers to make changes easily and quickly.
4. Resources
The Xilinx Spartan-6 FPGA Boards include several useful resources for software engineers and hardware designers. The board can provide a minimum of 4MB of Co-Processor Cache memory. The cache is perfect for data-intensive applications by using a direct connection with the onboard SPI Flash memory.
5. Design Ease
The design of the Spartan-6 FPGA boards is efficient and flexible. The board has several convenient features, like the JTAG header, which allows it to debug. It also includes an accurate temperature sensor. It makes better decisions about what voltage to use when powering the device. The Spartan-6 FPGA Boards have a high density of user I/O pins, allowing them to interface with various devices and peripherals.
6. Datasheets
Manufacturers make the Spartan-6 FPGA boards following the various datasheets created by Xilinx. These datasheets detail the board’s specifications. They include the exact size of the FPGA and its multiple peripherals. It enables designers such as RayMing PCB and Assembly to use advanced data structures. For instance, dynamic arrays and hash tables, to increase performance, improve task throughput and compression.
7. Availability
The Spartan-6 FPGA Boards are readily available from the manufacturer. A company offers the board as a pre-assembled design, ready for immediate production use. Each unit includes a full documentation package and all the components needed to develop. An example is a Spartan-6 LX150 FPGA and associated peripherals.
8. Community
The Xilinx Spartan-6 FPGA Boards have a vibrant support community. They posts questions and discussions to the Xilinx forum and answer new users’ questions with detail and patience. They also run Q&A sessions where users can ask complicated questions and receive an instant reply. Because of their newness, the board has a lot of room for growth in this area.
9. Reliability
The Xilinx Spartan-6 FPGA Boards have a low failure rate for individual units. There have been less than five failures of all the boards sold in just the last two years. Their reliability is excellent. The design is sound, and the manufacturing process includes several components that reduce damage due to physical damage or interference.
10. Networking Capabilities
The Xilinx Spartan-6 FPGA Boards are capable of operating in both standalone modes and through an Ethernet network. They include several network interfaces chips. It allows them to communicate directly with other computers and devices. This is useful for development and debugging purposes.
The Spartan-6 FPGA is a very high-quality piece of hardware with many advanced features.
The Spartan-6 FPGA boards are not very well documented in terms of resources, datasheets, or information on using the Xilinx WebPACK software. The manufacturer does provide a small amount of documentation with the board. However, it is usually enough to get someone started with development. It will leave users without prior knowledge of the hardware is a bit of a lurch when they are trying to make basic changes or updates to their project’s configuration using WebPACK.
2. 3.3V Only Power Supply
The power supply of the Spartan-6 FPGA boards is only designed to draw 3.3V from a computer’s USB port or a wall adapter that outputs 3.3V. This means that it cannot ship with a 5V power supply without causing damage to the computer and board itself. The 5V power supplies that it comes with are usually enough for simple demos and basic experiments. Still, they can be challenging to work with when developing larger circuits or more complicated designs.
3. Size
We cannot use the Spartan-6 FPGA boards for huge designs or systems that require many logic cells or other resources. The boards run the Spartan-6 FPGA ICs manufactured by Xilinx. Because of their size, they cannot use memory components with similar specifications.
4. Missing Resources
The Spartan-6 FPGA Boards do not have useful peripherals like clock oscillators and phase-locked loops (PLL). They have a few valuable peripherals. They include a clock oscillator and a PLL, but they could have been more conveniently implemented. For example, the only way to adjust the frequency of the clock oscillator is by using the FPGA pins. This makes it much more challenging to make changes when compared with an external circuit board.
5. Limited Input Devices
The Spartan-6 FPGA boards only come with a limited number of input devices for use with their FPGAs or I/O pins. As the FPGAs are not designed to work with external resources, they will not work with devices that require more than 1 or 2 I/O pins. The board only has 8 I/O pins that we can use in conjunction with a digital interface, and 4 of these are for use by the FPGA interface. The remaining four pins would generally operate as a clock signal, but they also need to go through a buffer to be helpful.
6. Internal Resources
The Spartan-6 FPGA boards do not have a lot of internal resources. It only has 128 KB of internal RAM, which is not enough to run many high-resolution simulations or to use for very granular timing analysis. The FPGA chips come with 96 MB of onboard memory, so it is possible to squeeze in some resources if needed, but this will take up valuable space on the board.
7. Single-Ended I/O Pins
The Spartan-6 FPGA Boards do not come equipped with any differential I/O pins. It makes interfacing with other devices or Oscilloscopes quite difficult. They work with the Xilinx FPGA chip itself, so they only have single-ended I/O pins. For this reason, users should only use the devices with other chips on the same board.
8. Cost
The Spartan-6 FPGA boards are expensive, and their prices can climb quickly when users need to buy things like cables and development kits. The base price of the boards is usually reasonable. However, custom cables and other peripherals will add a substantial amount of money to the cost.
We can connect the Spartan-6 FPGA boards to several analog components and use them for high-speed data acquisition. one can also connect them to various sensors and transducers. They use it as a control device for applications like motion control and robotics. The Xilinx devices are also capable of running applications with real-time constraints. It is helpful for this application.
2. Motion Control
The Xilinx FPGA boards are also designed to support motion control. It allows for simple applications like the rotation of motors, adjustment of stepper motors, or movement of servo motors. We can use them in conjunction with other High-Speed Motion Control devices. They create very compact control systems that we can manipulate using just a computer mouse. The FPGAs even contain their user interface for this purpose.
3. Digital Signal Processing
The Spartan-6 FPGA boards are also beneficial for digital signal processing. We can use them to perform complex tasks in a fraction of the time it takes a computer to do the same thing. The Spartan-6 FPGA is a high-quality device with many high-speed parallelisms, perfect for running this type of application.
4. High-Speed Computing
The Spartan-6 FPGA boards are also great for solving problems using high-speed computing techniques. For example, the boards can implement large, complex neural networks and DSPs that run at speeds that we can consider high-speed. The FPGAs also have a lot of additional hardware. For instance, drivers, power amplifiers, and other helpful hardware for these types of applications.
5. FPGA Neural Networks
The Spartan-6 FPGA boards are also ideal for neural networks. We can configure the modules to run at very high speeds and execute a wide range of tasks. We can use the boards to process video, audio, and analog data streams using a variety of neural network algorithms.
6. DSP
The Spartan-6 FPGA boards are also often used to implement several different digital signal processing algorithms. They work very well for audio processing applications and multimedia applications.
7. FPGA System-on-Chip (SoC)
We can also combine the Spartan-6 FPGA boards with other devices to make an FPGA System on Chip. This type of board is excellent for incorporating a wide range of peripherals. It includes connecting an Ethernet cable and running software. This allows the board to communicate with other devices on the network.
XC6SLX45: 4 CMTs, 50 Maximum user I/O pins (Board), 218 Maximum user I/O pins (Device), 58 DSP Slices, 2,088 Total Block RAM Bits (Kbits), 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
XC6SLX45: 4 CMTs, 50 Maximum user I/O pins (Board), 218 Maximum user I/O pins (Device), 32 DSP Slices, 2,088 Total Block RAM (Kbits), 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
XCM-306] Xilinx Spartan-6 LX TQG144 FPGA board
XC6SLX9: 576 K Total Block RAM Bits, 56 Maximum user I/O pins (Board), 200 Maximum user I/O pins (Device), 90 K Maximum Distributed RAM Bits, 9,152 Logic Cells, and 1430 Slices
XC6SLX4: 216 K Total Block RAM Bits, 56 Maximum user I/O pins (Board), 132 Maximum user I/O pins (Device), 75 K Maximum Distributed RAM Bits, 3,849 Logic Cells, and 600 Slices
[XCM-019Y] Xilinx Spartan-6 FGG484 FPGA board (5 V Tolerant)
XC6SLX75: 132 DSP Slices, 3,096 Total Block RAM Bits, 100 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 692 Maximum Distributed RAM (Kbits), 74,637 Logic Cells, and 11,662 Slices
XC6SLX45: 58 DSP Slices, 2,088 Total Block RAM Bits, 100 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
[EDX-301] Xilinx Spartan-6 USB-FPGA board
XC6SLX16-2CSG225C: 576 K Total Block RAM bits, 56 Maximum user I/O pins (Board), 232 Maximum user I/O pins (Device), 136 K Maximum Distributed RAM bits, 14,579 Logic Cells, and 2,278 Slices
[XCM-111] Xilinx Spartan-6 LXT FGG484 FPGA board
XC6SLX150T: 4,824 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 540 Maximum user I/O pins (Device), 180 DSP Slices, 1,355 Maximum Distributed RAM (Kbits), 147,443 Logic Cells, and 23,038 Slices
XC6SLX100T: 4,824 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 498 Maximum user I/O pins (Device), 180 DSP Slices, 976 Maximum Distributed RAM (Kbits), 101,261 Logic Cells, and 15,822 Slices
XC6SLX75T: 3,096 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 348 Maximum user I/O pins (Device), 132 DSP Slices, 692 Maximum Distributed RAM (Kbits), 74,637 Logic Cells, and 11,662 Slices
XC6SLX45T: 2,088 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 296 Maximum user I/O pins (Device), 58 DSP Slices, 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
XC6SLX16: 2 CMTs, 50 Maximum user I/O pins (Board), 232 Maximum user I/O pins (Device), 32 DSP Slices, 576 Total Block RAM Bits, 136 Maximum Distributed RAM Bits, 14,579 Logic Cells, and 2,278 Slices
[XCM-206Z] Xilinx Spartan-6 FGG676 FPGA board
XC6SLX150: 180 DSP Slices, 4,824 Total Block RAM Bits, 296 Maximum user I/O pins (Board), 576 Maximum user I/O pins (Device), 1,355 Maximum Distributed RAM (Kbits), 147,443 Logic Cells, and 23,038 Slices
XC6SLX100: 180 DSP Slices, 4,824 Total Block RAM Bits, 296 Maximum user I/O pins (Board), 480 Maximum user I/O pins (Device), 976 Maximum Distributed RAM (Kbits), 101,261 Logic Cells, and 15,822 Slices
XC6SLX75: 132 DSP Slices, 3,096 Total Block RAM Bits, 296 Maximum user I/O pins (Board), 408 Maximum user I/O pins (Device), 692 Maximum Distributed RAM (Kbits), 74,637 Logic Cells, and 11,662 Slices
[XCM-019] Xilinx Spartan-6 FGG484 FPGA board (5 V I/O)
XC6SLX75: 132 DSP Slices, 3,096 Total Block RAM Bits, 100 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 692 Maximum Distributed RAM (Kbits), 74,637 Logic Cells, and 11,662 Slices
XC6SLX45: 58 DSP Slices, 2,088 Total Block RAM Bits, 100 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
[XCM-206] Xilinx Spartan-6 FGG676 FPGA board
XC6SLX150: 180 DSP Slices, 4,824 Total Block RAM Bits, 296 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 1,355 Maximum Distributed RAM (Kbits), 147,443 Logic Cells, and 23,038 Slices
XC6SLX100: 180 DSP Slices, 4,824 Total Block RAM Bits, 296 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 976 Maximum Distributed RAM (Kbits), 101,261 Logic Cells, and 15,822 Slices
XC6SLX150: 4,824 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 180 DSP Slices, 1,355 Maximum Distributed RAM (Kbits), 147,443 Logic Cells, and 23,038 Slices
XC6SLX100: 4,824 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 326 Maximum user I/O pins (Device), 180 DSP Slices, 976 Maximum Distributed RAM (Kbits), 101,261 Logic Cells, and 15,822 Slices
XC6SLX75: 3,096 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 280 Maximum user I/O pins (Device), 132 DSP Slices, 692 Maximum Distributed RAM (Kbits), 74,637 Logic Cells, and 11,662 Slices
XC6SLX45: 2,088 Total Block RAM Bits, 128 Maximum user I/O pins (Board), 316 Maximum user I/O pins (Device), 58 DSP Slices, 401 Maximum Distributed RAM (Kbits), 43,661 Logic Cells, and 6,822 Slices
Conclusion
By considering all the aspects of this board, there is no doubt that the Spartan 6 FPGA Board is the ideal and best for prototyping and rapid design. It is inexpensive, versatile, and easy to configure, so it is the best choice.
RS485 and RS232 are widely used serial interface standards for communications in embedded systems, industrial automation and other applications requiring simple point-to-point or multi-drop connectivity.
While both RS485 and RS232 transmit data serially over twisted pair cabling, there are important distinctions between the two interfaces in regards to capabilities, performance and use cases.
This article provides a technical overview and comparison of RS485 vs RS232 in terms of electrical characteristics, timing, cabling, maximum distance, data rates, number of nodes supported, interference immunity, routing topologies and more. Real world examples illustrate optimal application scenarios for each standard.
RS485 Overview
RS485, also known as TIA-485 or EIA-485, is a serial communications standard defined by the TIA/EIA in 1983. It specifies the electrical characteristics and timing requirements for robust transmission of digital data over twisted-pair cabling.
Some key attributes of RS485:
Balanced differential signaling helps reject noise and interference
Supports multipoint networks via daisy chaining up to 32 or more nodes
Operates at data rates up to 10 Mbps over distances up to 4000 feet
Widely used for industrial sensor networks, building automation, transportation and other applications requiring moderate data speeds and noise tolerance over twisted pair cable
RS485 uses differential balanced transmission and receipt of voltages to enable noise immunity and reliable communication in noisy environments. It can be implemented using simple transceiver chips that convert the single-ended logic levels found on most digital devices to differential signals on the transmission medium.
Now let’s look at some of the technical details behind RS485 and how it supports multi-drop networking.
RS485 Electrical Interface
RS485 signals are carried over a twisted pair of wires to achieve data transmission and receipt. One wire carries the differential bus signal labeled A (+), while the other wire carries the inverted bus signal labeled B (-):
By transmitting signals differentially over the two wires, noise and other common-mode interference gets cancelled out at the receiver. This enhances noise immunity significantly compared to single-ended interfaces.
The driver sends logic 0 by driving A low and B high. Logic 1 is indicated by driving A high and B low. Receivers determine the logic value based on comparing the differential voltage A – V
RS485 transceiver chips handle the conversion between single-ended logic levels and the differential signaling. They also manage the bus transmissions.
Multidrop Support
A major advantage of RS485 is the ability to connect multiple nodes (up to 32) on the same twisted pair through multi-drop bus connections:
The transmitters use tri-state outputs to enable multiple driver connections to the shared bus pair. Only one driver is active during a transmission, while all others are in a high impedance (Hi-Z) state.
This allows all nodes to share access to the same transmission medium. Slave nodes filter out messages not addressed to them based on higher protocol layers.
Differential Signal Immunity
RS485 provides robust interference rejection by leveraging differential signaling where the receiver determines logic value based on the voltage difference between the two wires rather than their absolute voltages.
This renders the interface much less susceptible to common mode noise events like ESD strikes, ground shifts and electromagnetic interference. Both wires are affected approximately equally, so the differential voltage remains steady.
Overall RS485 enables reliable serial communication in challenging electrical environments. It is far more robust than single-ended interfaces.
RS232 Overview
RS232, also referred to as EIA232, is an older serial interface standard introduced in 1960. It specifies connections between DTE (Data Terminal Equipment) and DCE (Data Communication Equipment) using a single-ended transmission scheme.
Some key characteristics of RS232:
Single-ended signaling rather than differential
Point-to-point communication between one transmitter and one receiver
Typical applications include computer serial ports, test equipment and industrial controllers
Data rates less than 20 Kbps up to distances of 15-50 feet
Voltage levels ranging from -15V to +15V
While RS232 has been mostly superseded by USB for computer peripherals, it remains popular for simple low speed serial connections over shorter distances. However, noise immunity and maximum distance are both significantly less than differential signaling standards like RS485.
Now let’s take a closer look at the electrical interface used in RS232.
RS232 Electrical Interface
Unlike RS485 which uses differential pairs, RS232 is a single-ended interface with different voltage levels used to signify logic high versus logic low bits.
The diagram below illustrates RS232 voltage levels specified at the driver:
A logic 0 is represented by a voltage between +3V to +15V, while a logic 1 corresponds to a voltage between -3V to -15V. Receivers determine logic value based on these voltage thresholds.
This single-ended signaling provides much less noise immunity compared to differential schemes. Any noise or ground shifts can corrupt the absolute voltage levels leading to communication errors.
Point-to-Point Topology
Unlike RS485 which enables multi-drop networks, RS232 is designed for simple point-to-point communication between two devices:<img src=”https://drive.google.com/uc?export=view&id=1R7vwcSy38l6GzJv-6xdoZnp_LUOW2jpQ” alt=”RS232 point-to-point” width=”350″>
There is one dedicated transmitter and receiver on each end. No concept of bus sharing or collision detection is required. This makes RS232 unsuitable for multi-node topologies.
Limited Distance and Speed
The single-ended design and lack of advanced termination and equalization techniques also severely limit the maximum distance and speed achievable with RS232 compared to differential alternatives:
Maximum distance limited to 50 feet at lower speeds
Maximum speed limited to 20 Kbps at short distances
Typical reliable rates only 2 Kbps up to 15 feet
Thus RS232 is only appropriate for relatively low throughput applications over shorter cable runs. More demanding applications require RS422, RS485 or other interfaces.
RS485 vs RS232 Comparison
Now that we’ve covered the key characteristics of both RS485 and RS232, let’s summarize some of the key differences between them:
As the comparison shows, RS485 provides substantial advantages for high noise environments and applications needing to span longer distances or support multiple node connections.
The only advantage of RS232 is minimal component count for very simple point-to-point links. For all other applications, RS485 is generally preferable.
Real World Application Examples
To better understand the optimal use cases for each standard, let’s look at some real-world examples of RS485 vs RS232 interfaces in practice:
RS485 Example Applications
Industrial Sensors: Connecting multiple temperature, pressure or flow sensors over twisted pair in a factory through daisy-chained RS485 links. Allows spanning large facilities over thousands of feet.
Building Automation: Interconnecting multiple HVAC controllers and devices using RS485 in a large commercial building for sending control and telemetry data across the facility.
Robotics: Connecting controller area network (CAN) or other serial buses between multiple servos, actuators and sensors in a robotics system using RS485’s multi-drop capability.
SCADA Systems: Implementing connections between field devices like RTUs and master controllers in utilities and other SCADA applications usingRS485 for long range communication.
POS Systems: Networking multiple point-of-sale terminals together using RS485’s noise rejection in a busy retail environment with magnetic stripe readers generating interference.
RS232 Example Applications
Computer Peripherals: Simple serial mouse, modem or printer connections to a PC using legacy RS232 ports. Low speed and distances involved match RS232 capability.
Lab Equipment: Instrumentation controllers and devices interconnected over short RS232 links rather than more complex fieldbuses. Suits low density of nodes.
** attenuated RS232 sending radio telemetry
Either RS485 or and
CNC Machines: Some CNC systems use RS232 for basic serial communication between drives, controllers and tactile feedback devices over short distances in electromagnetically noisy environments.
As these examples illustrate, optimal applications of RS485 vs RS232 align closely with their technical characteristics and trade-offs. Understanding these use cases helps apply the right standard during system design.
Conclusion
In summary, RS485 and RS232 represent two serial interface standards optimized for different applications:
RS485 provides robust noise immunity and multi-drop connectivity ideal for industrial data links spanning long distances
RS232 offers simple point-to-point communication over shorter ranges in less noisy environments
Engineers should consider parameters like data throughput needs, cable runs, number of nodes, and interference sources when selecting between RS485 vs RS232 during the design process.
For the majority of industrial, building and automation use cases where multiple node connections are needed, RS485 is the superior choice. RS232 remains suitable for basic legacy systems with minimal length and data rate requirements.
By matching interface capabilities closely with application requirements, optimal system reliability and cost can be achieved. Both standards continue to fill important niches for serial data transfer in embedded systems and automation.
RS485 vs RS232 FAQ
Here are some frequently asked questions regarding comparing RS485 and RS232 serial interfaces:
Q: Can RS485 devices communicate with RS232 devices?
A: Yes, with a protocol and electrical level converter that can translate between the different voltages and data formats. Native interoperation is not possible.
Q: What kind of cabling is used with RS485 and RS232?
A: Both typically use shielded twisted pair cabling, though RS485 is also robust over unshielded twisted pair. Coaxial cable can be used for RS232.
Q: Is RS485 full duplex or half duplex?
A: RS485 is half duplex, so data can only flow in one direction at a given time. RS232 supports full duplex communication.
Q: What is slew rate and does it impact RS485 vs RS232?
A: Slew rate limits how fast voltage levels can change. RS485 handles faster slew rates which helps enable higher data rates.
Q: How many RS485 nodes can connect to each other?
A: Up to 32 unit loads can be supported depending on power budget and data rate needs. More devices require repeaters.
Data transfer is getting faster and faster. It was once a feat to download a large file, but now, you can easily move gigabytes of data in seconds. GIGABYTES.
It was also once a feat to transfer data over long distances, but now with the FT600/FT601 series of 4G LTE modems, that is no longer a problem. These two devices are one-of-a-kind and versatile in their ability to transfer data on the go and still be affordable for all home users. They are truly revolutionary for the 21st century!
The FT600 and FT601 are both a product of QUALCOMM, Inc. They offer several distinct features that set them apart from other mobile modems. For example, moving data over long distances and at fast speeds. Let’s talk about just how revolutionary these products are.
The FT600 and FT601 are the first modems to provide 4G LTE on a plane in the sky. Traditional data transfer had a hard time finding a way to move over long distances, but with FT600/FT601, all you have to do is turn it on, and you’re ready to go!
The FT600 utilizes UMTS, WCDMA, CDMA2000 1XRTT, EV-DO Rev.
Data Transfer Semantics
This series has many more features. They include Business Card Transfer, Contact Sheet, and Landscape Writing. These new features allow users to make data transfer easier and safer. It also enables users to print contacts on the same paper as their contact information. This would make it easier for other people to find their contact information.
The FT60X series has a wide vocabulary because it can work with various fonts, sizes, and styles.
We can customize most styles of fonts to suit the user’s needs. The FT60X series supports a wide variety of font styles and size options.
For instance, users can increase the size of their data and maximize their transfer speed. The FT60X series can also print different fonts when they are printing data. For example, you can choose to print your name in italic, which is easier to read at a glance and looks better on printed materials than regular text.
Compared to its predecessor, a notable improvement of the machine is that you don’t have to remove the paper from the cartridge before it prints. Previously, you would have to take out the cartridge for the machine to print. This feature makes it easier for people with multiple pages on their machines or those trying to print labels and stuff.
Size
The ft600 is about the size of your average cell phone. The ft601 is about twice as small as that of a cell phone. So small, it is only about 1/4 inch thick and will fit in your pocket comfortably.
Display
The ft600 and ft601 display reads differently depending on the function. The FT600 displays the signal strength, while the FT601 displays the mode of operation or power.
Design
The ft600 and FT601 are both a product of QUALCOMM, Inc. They offer several distinct features that set them apart from other mobile modems. For example, moving data over long distances and at fast speeds.
The ft600 utilizes UMTS, WCDMA, CDMA2000 1XRTT, EV-DO Rev.1.
The ft601 utilizes WCDMA, CDMA2000 1XRTT, EV-DO Rev.1
UMTS:
UMTS is the primary mobile broadband data network in Japan and other countries such as India and China. WCDMA is the first mobile broadband data network to provide megabit rate (Mbps) data transfer speeds on a major global scale.
This is a network used in Europe, the United States, Canada, and Puerto Rico. CDMA2000 1xRTT allows high-speed data transfer rates up to 28.8Mbps. It provides enhanced voice and video services with more capacity for mobile internet than earlier networks. EVDO Rev.1:
EV-DO Rev.1 is the first mobile broadband data network to provide speeds of 7.2Mbps using a single radio access technology. Broadband Forum has endorsed it and is the preferred mobile broadband technology in Japan, South Korea, and China.
WIFI:
You can wirelessly transfer your data to your PC or laptop using wifi!
GPS:
Allows you to use google maps and view your location on google maps on your computer.
Speeds
Speed depends on carrier and location, so that is Fast Enough for anyone from anywhere! A great note about speed is the transfer rate, and you want it to be fast and reliable, this modem can do that! In other words, there is no “normal” speed for these modems as everybody has a different environment and network to deal with. The FT600 and the FT601 can reach speeds of up to 5.76 Mbps download, up to 384 kbit/s uploads in the downlink, and 384 kbit/s in the uplink. The networks can handle even more data than that. However, they have a limit on spec depending on the upload speed.
Present with parallel FIFO interface that is either 16/32bit wide:
The ft600 and the FT601 are present with a parallel FIFO interface that is either a 16 or 32 bit wide, which means that large files will transfer faster. The large parallel FIFO interface helps increase the throughput of long data transfers. Here, we need to transfer multiple small files simultaneously.
TPE (User Interface)
The ft600 and the FT601 utilize a GUI-based user interface that makes it easy for users to control their modems. This software provides access to all modem functions. The GUI-based interface enables the FT600 and the FT601 we need to use as a modem without any configuration. The ft600 supports a configurable site, preferred access mode, and data transfer speed.
The ft601 does not have a GUI-based user interface, and they lock it to carrier settings.
Data Rate
The ft600 and the FT601 can limit data transfer speeds. Your carrier’s network determines this, meaning you cannot go over 7.2Mbps in download or 384 kbit/s uploads. The ft600 and the FT601 only handle the minimum data transfer rate specified by the carrier you purchase from.
As of now, there are no plans to release any new mainline firmware for the ft600and the ft601.
Up to 8 configurable endpoints:
The ft600 and the FT601 can handle up to 8 configurable endpoints. It means that you can set up your device with multiple connections.
You can also use an over-the-air configuration to configure your modem with any parameters you want. This will allow users to customize their modem.
Users can access 4G LTE worldwide, as long as a carrier supports 4G LTE in the area where they reside.
The ft600/601 is also network-dependent and needs activation. It requires an account with the carrier or other service provider.
Users of the modem will need to purchase a USB cable. The ft600 and the FT601 will connect through a standard-A USB cable.
Built-in 16kB FIFO data buffer RAM
The ft600 and the FT601 have a built-in 16kB FIFO data buffer RAM. This allows users to store data while they are transferring new files. This will enable users to partially complete file transfers without stopping and restarting the process.
The ft600 and the FT601 operate using USB 1.1, which is not USB 2 compatible. Most USB 2 devices will work with the ft600 and the FT601. However, older USB 1 devices and some types of external hard drives will not function properly.
Capability of Supporting multi-voltage I/O: the 1.8V, the 2.5V, and the 3.3V
The ft600 and the FT601 both support multi-voltage I/O, and this means that your computer can operate on the 1.8V, the 2.5V, or 3.3V power sources. This is great if you have a device that requires different power voltages to work properly. For example, a battery-operated device or an external hard drive needs a higher voltage than the computer provides.
The ft600 and the FT601 both support 1kbit/s full-duplex speeds.
Configurable GPIO support
The ft600 and the FT601 both support configurable GPIO, which means that you can use your modem to control external devices. The GPIO port is an input/output port similar to the ports on a computer. Also, the user can configure this port to control almost anything battery-operated.
Configurable power mode
The ft600 and the FT601 have configurable power modes; you can control how your device powers up when it’s turned on. If your modem isn’t powering on when you turn on your computer, you can set it to begin powering up as soon as you plug in the USB cord.
The ft600 and the FT601 have many similarities, such as:
USB 1.1 interface and thus not USB 2 compatible; transfer rates have less capability due to the carrier networks. Both modems support up to 8 configurable endpoints; both modems utilize 1kbit/s full-duplex speeds.
The ft600 is capable of handling up to 5.
Provides USB Battery Charger Detection
The ft600 and the FT601 both provide USB Battery Charger Detection. This allows users to charge their devices while connected to either modem.
The ft600 and the FT601 both charge via the USB interface, meaning that you need a USB cable when using either modem.
The ft600 and the FT601 are identical in hardware, and they have a FIFO buffer of 16kB RAM, a fast USB 1.1 interface, and multi-voltage I/O (1.8V to 3.3V). The ft600 has a GUI-based user interface, supports eight configurable endpoints, and an energy-saving mode that suspends current activity once the modem is inactive for a long period (configurable timeout). Neither the ft600 nor the FT601 supports a boot loader.
The ft600 and the FT601 both utilize USB 1.1. It means that USB 2 devices will not work with either modem.
The modem firmware controls the I/O functions, meaning that a user’s device does not directly control these functions.
Both modems support an energy-saving mode. However, when in energy-saving mode, both modems automatically disable their power outputs if you connect them to a computer where you power off the activity.
The ft600 can handle up to 5 while limiting the ft601 to 4.
Both modems do not support boot loading, meaning that the modem will not retain settings when a power cycle occurs.
The FT600 and the FT601 share similar features such as:
When a modem is active, there are several different power modes that the modem can be in. This allows the user to save energy when they are not using it.
The ft600 and the FT601 each have an energy-saving mode, allowing users to suspend power output until needed.
This is useful if a user needs to conserve power with their modem.
Some manufacturers like RayMing PCB and Assembly have a TCP/IP-based data port that allows the modem to work as a router and bridge. This is useful if you want to route data through multiple modems and use a device that already has an IP address but does not need to use the modem’s IP address (i.e., accessing the internet from a laptop).
Some manufactures offer a GUI-based user interface. This is necessary if you want to configure your modem in any other way than through your computer’s operating system.
The ft600 and the FT601 both support an optional GUI-based user interface. This user interface allows users to access their devices as long as they have a connection to the internet. It is helpful for users who want quick access to their devices and do not wish to search online for configuration options or information.
We can configure the ft600 and the FT601 to connect to a computer with a connected modem. You must follow instructions specific to your operating system.
This is useful for connecting your modem to a different computer or utilizing the same internet connection.
This may allow the modem to use its MAC address as an identifier. However, this depends on the individual configuration of each device.
We can also use this series to make short writing and word processing durations. This series can process various fonts, including Arial, Tahoma, Times New Roman, and other common fonts. It can also handle spaces between words and paragraphs correctly, making the writing experience easier than ever before.
This series isn’t very popular in this era of technology because newer models can hold a larger amount of memory and take up less space than these machines.
2. High Bandwidth Data Transfer
This series can transfer a wide range of data, including high-definition images. It has features that allow users to transfer data quickly and easily.
This series is not very popular because newer models can hold more data than these machines can handle.
3. Building Control and Security
This series helps build control and security to transfer information between sensors. The machine will print signs and security passes, making it easier for the user to get a stamp or signature on those documents.
4. Data Logging
We use this series in the shipping industry to log data on the documents one is sending. It can record the weights and readings of any documents, making it easy for people to keep track of their shipments.
This series isn’t very popular because newer models can hold more data than these machines can handle.
5. Environmental Control
We use this series in the oil and gas industry to print out environmental documents. It can record the quality of air and emissions for all shipments.
This series isn’t very popular because newer models can hold more data than these machines can handle.
6. Medical and Laboratory
We use this series in the medical industry to transfer information between documents. It can take accurate readings of any samples and has many features that allow safer data transfers. This includes features like a safety device that prevents exposure to radiation if you contaminate the sample.
7. Home Automation
We use this series in the home automation industry to transfer information between light switches and thermostats. We can connect the machine to other devices like a refrigerator and air condition.
This machine isn’t very popular because these machines aren’t as widely spread in homes as these models are.
8. I/O Expansion
We use this series to expand the machine’s capabilities without buying new cartridges. It can also be helpful to connect the printer to other USB devices.
This series isn’t very popular, partly because newer models can handle more data than these machines can handle.
We use this series in the industrial control and monitoring industry to transfer information between documents. Machines like these help monitor factories’ environments and prevent catastrophes by providing an early warning. This machine isn’t very popular, mainly because newer models can handle more data than these machines can handle.
Companies use this series to transfer information from sensors. We can also connect the FT60X to a temperature sensor or a light sensor. It can also connect other devices, like pressure gauges or water level monitors.
11. High-Resolution Video Transfer
We use this device in the film industry. It allows you to transfer high-definition videos through Bluetooth. It makes it easier for people to send videos over long distances without losing quality.
12. Retail
Major retail companies like Target, Best Buy, and Staples use this series. It allows them to transfer data from security tags with barcode readers. This machine is not very popular because some newer models can hold more data than these machines can handle.
FT600/FT601 series boards
Key Device Features include:
Extended operating temperature range: -40°C to 85°C
10CL0120YF780C8G: 100 Maximum user Input/Output pins(Board), 525 Maximum user Input/Output pins(Device), 4 PLLs, 288 18 by 18 multipliers, 432 Memory: M9K (kb), and 119088 Logic Elements/Parts
10CL080YF780C8G: 100 Maximum user Input/Output pins(Board), 423 Maximum user Input/Output pins(Device), 4 PLL, 244 18 by 18 multipliers, 305 Memory: M9K (kb), 81264 Logic Elements/Parts
Altera 5CEBA4F23C8N: 100 Maximum user Input/Output pins(Board), 224 Maximum user Input/Output pins(Device), 16 Global Clock Systems/Networks, 4 PLLs, 132 18 by 18 multipliers, 3,383 Embedded memory (Kbits), and 49 K Logic Elements/Parts
[EDX-009] Xilinx Kintex-7 USB-FPGA board, FTDI USB 3.0 FT600
XC7K160T-1FBG484C: 100 Maximum user Input/Output pins(Board), 400 Maximum user Input/Output pins(Device), 8 CMT (MMCMx1+PLLx1), 600 DSP Slice, 11,700 Max Block RAM (kb), 2,188 Max Distributed RAM (kb), 25,350 Slice, and 162,240 Logic Cell
XC7K70T-1FBG484C: 100 Maximum user Input/Output pins(Board), 300 Maximum user Input/Output pins(Device), 6 CMT (MMCMx1+PLLx1), 240 DSP Slice, 4,860 Max Block RAM (kb), 838 Max Distributed RAM (kb), 10,250 Slice, and 65,600 Logic Cell
[USB-107] FT601 Evaluation Board and [USB-106] FT600 Evaluation Board
Specifications (USB-107/106)
Made In Japan
Non-use of 6 Restricted substances of RoHS directive
Extended operating temperature range: -40°C to 85°C
Integrated power-on-reset circuit
Provides USB Battery Charger Detection
Supports Remote Wake-up capability
Configurable GPIO support
Support for multi-voltage Input/Output: the 1.8V, the 2.5V, and the 3.3V
Built-in 16kB FIFO data buffer RAM
Up to 8 configurable endpoints (pipes)
Supports multi-channel FIFO interface
Supporting 2 parallel slave FIFO bus protocols, that have to 400Mbps max of data bursting rate
Obtainable with a parallel FIFO interface that has a width of either 16bit/32bit
Supporting the USB3.0 SuperSpeed (5Gbps), 12Mbps USB 2.0 Full Speed, and 480Mbps USB High Speed transfer
Conclusion
The ft600 and the FT601 are almost identical, the difference being the GUI and the energy-saving mode. They add GUI for user convenience but can be a hassle if your computer requires you to use a different port than your modem. I would recommend an ft600 if you want up to 8 endpoints. However, if you want to power off your computer without powering your modem, I would go with the FT601.
The ft600 and the FT601 are excellent choices for anybody looking for a cheap, portable modem. With either modem, you can access the internet anywhere, as long as you have service.
The ft600 and the FT601 will provide a lifetime of maintenance-free, on-the-go internet access. They are reliable and rugged even in harsh environments. You will get a fast connection and connect to multiple devices with both modems.
If you are planning to make an electronic device, it is essential to know how thick the PCB will be. This includes knowing how much time and money you will save when using thin flex PCBs.
To choose the perfect thickness, there are a few things that you will need. They include a measurement tool, an understanding of what thickness is suitable for your product, and the number of components on your PCB design. It is also wise to ask the following questions:
1. What is the product going to use it for?
This is an essential question that dictates the material of your PCB. If you plan to use it for hiking, you need a very sturdy material that you can use outdoors under any weather conditions. On the other hand, thin material is sufficient if you use it for a diy flex PCB.
When selecting a PCB application, PCB board thickness is an important consideration. Flex Circuit thickness determines how many layers of circuitry can reside on a single board. It also determines how tough the material is to withstand environmental stresses such as high temperature and vibration. Electronic devices will often use multiple PCBs. So, managing the thickness is a design consideration, especially if the device is large and requires many boards. That is why you should know the standard thicknesses for PCB material. Also, it is why you should know how to calculate the correct-sized board for your specific application.
Flexible circuit boards are a great way to create flexible electronics, and we can use them in more ways than making them up of rigid PCBs. We can bend them into various shapes and form them into layers, which helps us use them in many different environments. Flexible PCBs are best suited for the kinds of applications that will always be under their power. A good example is a highly battery-powered sensor.
We can determine the flex PCB thickness by the desired size and type of circuit board. A very common choice for a PCB manufacturer is a 1.6mm-thick flexible PCB, which we also refer to it as an EEB (Extruded Etched Board) or single-sided PCB. These boards are shorter than the 1.8mm thick boards often used in other applications. Although thinner, they are also more expensive because of the thicker material. It makes them much longer and more challenging to manufacture.
Understand the bendability/flexibility of your flex PCB
The flex PCB you have chosen will significantly determine how you will use your product. One can determine the required flexibility based on the amount of movement your application will need to make and the restrictions.
Allowing your board to flex too much can lead to it bending or denting under pressure, which can cause problems over time. This is especially if it is in an environment with many fluctuations. To calculate the amount of bending you will need to allow, start by using this formula:
The formula is “bending deflection” times the “board thickness,” divided by the “radius of gyration.” This gives you a rough estimate of how much each part can bend before breaking. Here is an example of how to use it:
For 1/10-inch-thick boards, the maximum bending deflection would be 1/10 x 1/10 = .1 inches. If a board is .125 inches thick, you would have to multiply .1 x .125 to get a deflection of .0015625. The maximum amount the material can bend in any direction before it breaks. Flexible Circuit Boards are a Different Species
Traditional rigid PCBs are for non-flexible applications. They comprise a special material that’s both stiff and strong, and one can create them in many different thicknesses.
Experts usually give the thickness of the material in units of ounces per square foot (oz/ft²), with the most common thickness being 1 oz/ft² or 32 oz/ft². (We should note that a few more recent rigid PCB models have an inscription of the numbers that translate to different thicknesses in decimal weight units. For example, 0.06 oz/ft² is 6 ounces per foot squared, but you really can’t use these units directly in our calculations.)
When choosing a PCB thickness for your application, we must consider how many layers of circuitry you are going to have on the board. It’s important to note that the thickness of each layer is material-dependent and based on how one will use the PCB will. While the thickness of each layer is a design consideration, it’s essential to understand that having thicker layers will typically allow for more applications on a board. Thus, we can pack more devices on a single PCB.
Ultimately, one calls out the thickness of each layer on a PCB in a particular standard called “ounce per square foot.” The most common number you’ll see is 1 oz/ft², and this will allow for nine metal layers on the board. (True, you can get more metal layers by using thinner material. However, that makes the board stiff, like a piece of plywood or MDF (medium-density fiberboard).
The standard thickness of two-layer PCB:
PCB boards come in various thicknesses. A standard two-layer board has a minimum thickness of 14 mils and a maximum of 32 mils. Each layer of the PCB has a minimum thickness and must maintain the total thickness established for the entire circuit board.
14 mil is the ideal substrate for most projects. We commonly refer to this as short-run PCB, and it is available from most electronic design houses in various sizes.
This thickness is well suited for many applications, such as audio circuits and PCBs that one will mount in an electric guitar.
A minimum of 10 mils of PCB will prevent warping problems when soldering boards in a tight space.
If you plan to use UV-curing, ten mils are your best bet, and you should order at least one extra layer of PCB. This will increase the overall thickness to 16-18 mil, allowing you to place UV circuits on opposite sides of your board.
14 mil is ideal for a small run of boards intended as prototypes or engineering samples. You may wish to explore using thinner substrates such as one oz-in these cases. You can purchase this in smaller quantities than 14 mils and provide a good balance between strength and cost. If a small quantity of boards is what you need, we recommend looking at our small quantity PCB buying guide.
The standard thickness of four-layer PCB:
When you need four-layer boards, you can choose a flex circuit thickness of 32 mils for your design. These come in various sizes and may be single or double-sided. The thickness of the board is dependent on how many layers you need to accomplish your design goals.
Maximum board thicknesses:
Thirty-two mils are the maximum thickness of a four-layer board. Keep in mind that this will typically have three solid layers plus one ground plane that you can etch away or mill off the assembled boards.
Thirty-two mils are a relatively thick substrate, but they can be appropriate for many applications. For example, we use printed circuit boards with four layers and 32 mils in various circuits. Some examples include audio amplifiers and electronics designed to withstand high temperatures.
For more information on using a board this thick, check out our guide to designing UV circuits.
When choosing the right thickness for your specific project, consider several points. The thickness of the material and the substrate are two significant factors that will impact your final design decision.
Copper PCB thickness
For most electronics, an 8oz copper PCB is sufficient. The thickness of the copper board affects board appearance, cost, size, and flexibility of the PCB’s connections. Copper is the primary application of PCBs, so the copper thickness is essential.
A thicker copper PCB may be necessary for electronic devices that require extremely flexible connections. Thick copper PCBs usually do not restrict the electrical current, as thinner boards typically do. However, heavier boards can be expensive and take up too much space in a device.
Example: A 14 mil board with 8 oz copper is standard for most electronics.
Trace PCB thickness
Trace board thickness will influence the overall size of your device. Thicker traces will add the PCB area required for shielding and components. For devices that require very few traces, a thinner trace thickness may be an option. Experts recommend using at least a five-mil trace for most designs. Example: A 10 mil trace is typical for general-purpose PCBs.
Generally, one can require a larger diameter to use thicker copper, like a thicker copper wire. A device’s power ratings and critical components may limit the device’s size. If your electronic device requires very high current or critical components, you’ll want to choose a thick copper PCB. Look at your application and use this metric to inform your purchasing decisions.
Design factors
The thickness of the PCB that you choose should depend on the needs of your design. If you have a large project, you may wish to consider a thicker PCB or substrate so that your board is strong enough to stand up to damage. But if you have a small circuit project, you might prefer a thinner board that one can manufacture more quickly and cost-effectively.
Quality factors
When buying materials for your circuit board, there are several quality factors that you should consider. For example, is there any impurity in the material? Is it bio-degradable? Does it contain any harmful substances that could be harmful to our environment or the health of people who use your product?
Some examples of PCB materials include:
PCB Type Thickness (mil) Minimum Order Quantity Surface Treatment 1 Oz. 4 oz. Solder-free No 2 Oz. 6 oz. Solder-free No 4 Oz. 10 oz. Solder-free No 4oz (thin) 14 mil High temperature, high wear resistance Copper foil, silver overlay printed circuit board with black coatings
One of the most important factors to consider when purchasing PCB material is to choose the right substrate for your design. If you mount your circuit in an electrical device, such as an electronic guitar, you should use a thicker substrate at 1 or 2 oz.
Manufacturing factors
When you are ready to create the physical circuit board, you will need to order the appropriate PCB material. One can do this through several methods. They include sending your design out to a manufacturer or purchasing materials from a local store.
A company specializing in circuit manufacturing will have professional engineers and technicians to assist you with your design. They generally help from creating the schematic diagram to creating specifications for your circuit board. When selecting your material, you should use those specifications as guidelines for ordering the right PCB thickness for your design. RayMing PCB and Assembly is one of the leading flex PCB China producers that satisfy all manufacturing factors.
Choosing the Correct Thickness for Flex PCB Prototype
flex-circuit-manufacturer
The size of your prototype determines the thickness of the PCB and any design considerations that you have for your electronics. When experimenting with a prototype, remember that flexibility is excellent for creating prototypes. However, flexibility also costs money. If you need to experiment with different flex board PCB thicknesses to see which one performs best for your specific application, you can use a board thickness calculator like this one to help figure out what size board you’ll need.
Board weight
The thickness of flex printed circuit materials influences the overall weight of the board. A thinner material may be cheaper, but it’s also lighter, affecting some assemblies. Thicker material will be heavier, but it’s going to be stiffer. This may affect the electrical characteristics of the board at times (especially as the board gets hot).
Heat sink
We use heat sinks to dissipate heat away from electronic circuit boards while functioning. One can make heat sinks from any material. However, they must have a high heat transfer coefficient. Additionally, they have low thermal resistance to ensure heat transfer. This method transfers heat away from the circuit location.
We use a heat sink to dissipate heat, but it must have low thermal resistance and heat transfer coefficient. A thicker PCB will be able to dissipate more heat and thus be able to handle higher temperatures.
Cost
The final flex PCB price of a board will depend on the cost of the materials used in making it. The more layers you want on your PCB, the thicker each layer will need to be, which will drive up the price per square foot.
Power
A PCB that’s too thick will require more power to keep the circuit running and may need to get power from a different source. For example, having a board with six conductors will require two or more traces. This means that the power supply can work harder to generate the required current for all the circuit’s components.
Reliability
Choosing a thinner material can create a more flexible board and withstand bending and pounding during use. However, that adds weight and thus adds cost to the board.
A flexible substrate makes up a flexible PCB and allows the board to bend without fracturing or breaking. Before a few years ago, making a flexible PCB was not an option because of the amount of strain one needs to put on the boards during bending. Layers that were too thin could have cracked from even a slight bend or swing.
Footprint size
If your design uses microcontrollers or chips with a tiny footprint, you might have difficulty making it fit on a thick PCB. If you’re working with smaller components, you might need to increase the thickness of your PCB to accommodate the larger parts on it.
Electrical performance
It is also important to note that a PCB that’s too thick may affect the electrical performance of the board. This can happen if the traces on the board are too close together. It can also happen if there is not enough room between traces to ensure that they don’t affect each other with capacitance or inductance. A thin board will be more likely to allow good connectivity between traces and components. However, it will not support as many parts as a thicker one.
Flexibility
The most flexible PCBs are less than 1 oz/ft². The thicker the board is, the less flexible it will be, but the more it will support and allow for a wider range of functions and devices to go on it. The standard thickness for flat flex PCB material is between 0.3-0.45 oz/ft². Also, while they may not be as flexible as ultra-thin PCB material, they can still withstand bending without fracturing or breaking.
Benefits of flex PCB
The major benefit of a flex PCB is that one can bend and use it in applications where rigid PCBs are not useful. Many applications that require a board to be movable, flexible, and even curved can use a flex PCB while rigid boards cannot. Because of their flexibility, we can use a flex board PCB in many different applications and industries. On the other hand, we can use rigid boards generally limited to the electronics industry. Flex PCBs are beneficial for these industries because they allow for tight spaces and movements that rigid boards cannot.
Flexible Circuits
This is a material and circuit design technique to make circuits that can bend or curve when needed or needed. Flex circuits comprise a flexible substrate and conductive or semiconductive material or array. Typically, flex circuit boards will have a substrate that can bend easily. However, it is still strong enough to support other components like resistors or capacitors. By changing the thickness of the flexible substrate and using different layers for different circuit designs, we can make various flex circuits. In addition, manufacturers make flex printed circuits more durable from heavier materials and strong enough. This enables them to support other components like those mentioned above.
Reduced Space and Weight
A significant benefit of using a flex printed circuit board is that they can be thinner while making up the same space as rigid PCBs. This can be a helpful feature when you need to pack more circuits into tighter spaces, and low-cost, rigid PCBs are impossible. Another benefit of using a flexible circuit board is that it can truly move with the fingers on the hand rather than twist and turn components and wires to make it move as rigid boards do.
Increased usability
This is a significant benefit of flex PCBs because it allows for the creation of user-friendly PCBs. It creates PCBs that have more space available for soldering and easy access to all the components on the board. This can lead to fewer errors in soldering and less frustration for the user. It can also save time by allowing for easier movement and better solder connections.
Higher Density
Flex PCBs are generally easier to work with than rigid PCBs. one can also lay them down closer together without diminishing quality or performance. This higher density allows for one to put more components on a board. In addition, as mentioned previously, the thinner nature of flex PCBs allows for the use of more components in one design.
Durable Flex printed circuit board
The flexibility and durability of the flexible substrate make it very useful in situations where a rigid PCB would be prone to break. For example, storing these boards in a backpack or purse can cause damage to rigid PCBs that cannot withstand pressure as flex boards do. Also, flex circuits can survive harsh weather conditions where rigid PCBs easily become potholes and break from the elements.
We use flex circuits for many different applications. This is because of their ability to bend and move easily without damaging or fracturing. It is essential in mobile applications where one would damage components by bending rigid boards but still need to move with the user.
Monitors
We use flex circuits to make displays that can bend easily and move with the body to make them very thin while still supporting multiple layers of electronic components. This is great for smartphones, tablet computers, tablets, and televisions.
Smartphone and Tablet Computers
We use flex circuits in smartphones, tablets, and other mobile devices. It allows for easy bending and moving of components without breaking. This is very useful for people who use their phones or tablets as navigational tools. If a user needs to change the settings on their phone, they can bend it around a cup or other object. It helps avoid using screws or clips that would damage their device.
Ultrasound
We can use flex circuits as an alternative to rigid PCBs in ultrasonic equipment. The thin nature of flex circuits allows for more sensitive transmitters and receivers.
Ultrasonic Transmitters
As mentioned previously, ultrasonic transmitters are very thin but can still handle the high-frequency vibrations needed for ultrasonic equipment. Flex circuit boards allow for the creation of transmitters that we can easily place where they need to go while still being thin and flexible.
Ultrasonic Receivers
We use flex circuits to make the transmitters more sensitive. Due to this high sensitivity, we can stack flex circuits together to create extremely small ultrasonic receivers. They can help detect even the smallest vibrations.
Car Electronics
We use flex circuit boards in cars to adjustable mirrors and other easily movable components. This is perfect for drivers who need to mount their phones or other devices while driving.
Conclusion
Flex PCBs are an often-overlooked option in the world of electronics. The thickness of a PCB is crucial. This is because it determines how many layers of circuitry we can pack onto the material and how long-lasting the board will be. Because of this, you must stay on top of the thicknesses of your board and know what thickness to use for your needs. You may also want to consider using flexible circuit boards in some cases, such as environmental sensors that are always under power and will rarely ever see any direct sunlight or harsh elements.
You can hardly do without some form of tech in this highly technological world. Take, for instance, your smartphone; it rules most aspects of life, considering the myriad of vital apps you can access through it. Moreover, devices like smartphones, computer keyboards, etc., rely on flexible circuit boards for proper function.
To satisfy the high demand for flexible printed circuits, flexible printed circuit board manufacturers must play their role effectively. Predictably, the high number of flex circuit board manufacturers globally can make it difficult for you to choose the right partner for your flex PCB manufacturing needs.
But since it is of the essence to get the right partner for your flex PCB manufacturing needs, you must understand how to go about it. Additionally, it helps to know the top 10 flexible printed circuit board manufacturers globally. So please read on to get it right when you are looking for your next flex circuit manufacturer.
How to Pick a Suitable Flex PCB Manufacturer
Flex circuits, despite some history, have become popular in recent times. Flex PCBs have a complicated manufacturing process compared to conventional rigid circuit boards. It arises because of their intricate nature. You, therefore, need to get the ideal manufacturer possessing the right manufacturing equipment, highly skilled staff, the correct processes (including quality assurance and testing), an acceptable industry pedigree, etc., to get it right. The high number of manufacturers also complicates your selection process further. But as always, you can always navigate this minefield if you consider the following.
Do they Possess the Correct Flex PCB Fabrication Equipment?
If you want to identify the correct manufacturing partner for your flex PCB, check whether they have the latest equipment and technologies. Such a capacity helps in producing high-quality flexible PCBs for your needs. Most reliable flex PCB makers endeavor to maintain quality and enhance efficiency. As a result, such companies invest in their production facilities. Check for drilling tools, place board testers, surface finishing tools, imaging equipment, etc.
Standards and Certifications
The ideal flex circuit manufacturer will comply with ISO, UL, and IPC regulations. Therefore, it becomes prudent to check for compliance with the relevant certification and standards for potential manufacturing partners. An example of accreditation to look out for includes the UL 94V-O for fire-resistance conformance.
Do they Possess a Flex PCB Technician?
Flexible PCBs require advanced processes when it comes to their manufacturing. Further, plenty of steps get into the manufacturing process, and not every manufacturer qualifies in producing high-quality flex PCB.
Most reputable manufacturers have skilled technicians who can handle your flex PCB manufacturing needs. Therefore, if a potential manufacturer lacks such a group of skilled technicians, you had a better look elsewhere.
Quality of the Flex Circuit Company
Quality is significant when it comes to flex PCBs. Therefore, check and ascertain that your potential flex PCB partner produces high-quality flex circuits of the desired standards. The flex PCB products should have long-term durability, high-speed communication lines, high-density design, high conductivity, etc. Further, you can always resort to E-tests to ensure the quality of the flex PCB boards.
The Price of their Flex PCB
Design standards and quality often determine the production cost of flex PCBs. Additionally, some factors like base material or solder mask material can vary. Such factors can heavily weigh on your final product’s price or cost. Therefore, you must find a decent balance between cost and quality before placing your order. Therefore, do not pay or contract a manufacturer before considering this.
What is their Capability to Develop your Flex PCB (In-Line with your Desired Shape)
Flex PCBs have the uncanny ability to fit most applications. It, therefore, implies that it comes in diverse sizes and shapes. When it comes to your flex circuit manufacturing needs, your ideal partner must demonstrate the capacity to produce your desired form. For example, if you want a flexible PCB for military applications, you will need a flex circuit markedly different from a medical application. Most standup manufacturers will have the capacity to manufacture various forms and sizes of flex PCB for your use.
Flex PCB Testing
One vital step in the manufacturing process entails testing. For your Flex printed circuit, the company needs to have robust and updated techniques to ensure the integrity and functionality of the board upon deployment. A lack of elaborate testing can lead to mass failures of Flex PCBs. In testing the Flex printed circuit boards, the manufacturer identifies faults and corrects them early.
Capability to Supply Diverse Component Types
You can always get different flexible PCB designs from manufacturers. However, this primarily depends on your needs. It can entail multi-layer flex PCBs, double-sided flex PCBs, and single-sided flex circuits. But for a top-tier manufacturer, the type of flex PCB should never become an issue. The manufacturer needs to demonstrate the capacity to fabricate all the types based on your needs.
Proof of a Solid Model for Successful Production
Most reputable companies ensure the development and testing of a prototype before the mass production of a flex PCB. The cost of identifying an error later in post-production can prove grave and costly. As an engineer or designer, it can work best for you if you get a prototype from the company before production. In this manner, you can suggest and have them incorporate ideas.
If you want a top-quality flexible PCB, you may want to consider hiring a top-tier flex PCB manufacturer. But armed with the knowledge of the aspects to consider in picking a quality PCB manufacturer, it is time to narrow down and zero in on the ideal option. However, to save you from all the hustle, we have sampled the best ten FPC manufacturers all over the world.
#1. Unimicron
It is a famous and industry-setting flex PCB manufacturer. Unimicron also gets inferred to be a World-leading PCB Company. The company prides itself in guaranteeing you its commitment to delivering quality flex PCBs. You also get to enjoy the manufacturer’s extra focus on quickening the manufacturing process.
The manufacturer has its headquarters in Taiwan and a demonstrated history of 31 years since 1990. It possesses a global pedigree and provides world-class facilities, machinery, and workforce to serve its international clientele diligently. The company not only fabricates flexible PCBs but offers integrated circuit carriers, rigid-flex PCBs, HDI or high-density interconnections, testing, and burn-in services.
Features
Multi-certified
Multilocational with manufacturing sites in China, Taiwan, Japan, and Germany
30 years plus years of industry experience
Deals with all PCB types, IC carriers (FCCSP, CSP, Memory Module, FCBGA), ELIC, high-density interconnector circuit board, etc.
Efficient and quick turnover fabrication of flex PCBs regardless of the flexible PCB thickness
RayMing PCB & Assembly is an excellent option you can choose when it comes to your flexible printed circuit. The RayMing PCB and Assembly company, unlike other manufacturers, provide full turnkey services ranging from prototyping to assembly and packaging. Additionally, if you want a customization of your flex PCB, you can always rely on the company.
Features
Multiple certifications on quality and other considerations, including UL and IPC certifications
Multiple production sites around the world, with its headquarters in China
Provide fabrication and assembly for both partial and full turnkey flexible printed circuits. The layer number of flex PCB includes 1-12 layers with diverse material choices and board thickness.
Performs other PCB fabrication and assembly types, including rigid-flex PCBs and hardboard PCBs
Collaborative approach in the manufacturing and assembly process of your flexible PCB board
Over 15 years of industry experience when it comes to flex, rigid-flex, hardboard PCB fabrication, and assembly processes
Highly skilled workforce, latest equipment, and modern technologies of manufacturing and assembly
Service and Product Application of the Manufacturer
Full and partial turnkey flex PCB fabrication while also encompassing assembly for your printed circuit board design. Partial turnkey flex production entails providing the boards and some components for your flex PCB design. But beyond this point, the company carries out all the other activities to ensure a functional and efficient flex PCB product. On the other side, full turnkey will involve the company undertaking all the activities from procurement, design, testing, and quality monitoring of PCB production.
DSBJ comes as a unique flex PCB manufacturer that understands the meaning of diversification into different sectors like AI. It is an important quality that acts as its main selling point. DSBJ has a long industry experience spanning over 40 years since 1980, when it started as a small stamping and sheet metal factory. It then morphed into Suzhou Dong Shan Ban Jin company eight years later. As they say, everything from this point onwards is history.
The company has continued evolving over the last few years through consistent innovations and concepts in designing, manufacturing, and prototype PCBs. The realization of this can also get credited to meaningful collaborations and the acquisition of some franchises and companies. In addition, it helped expand DSBJ’s manufacturing services in diverse areas of the globe. For instance, the acquisition of Multek in 2018 expanded the scope of manufacturing in terms of global geographical locations.
Features
Over 40 years of industry experience in PCB and other electronic product and service provision
Has production factories in over 15 countries
Deals in diverse electronic product manufacturing, including flex and rigid board fabrication and assembly, though specialization features telecommunication equipment, metal precision, interconnect solutions, and LED technologies.
Flexible approach and receptivity to current ideas and innovation remain relevant now and in the future.
Sensitive to corporate social responsibility and thus involved in environmental and safety responsibility. It has also invested in academic collaboration as part of its innovation and social corporate responsibility programs.
Multi-certified in the production of diverse types of printed circuit boards (including flex PCBs)
Service and Product Applications of the Manufacturer
A diverse range of PCB types includes Flex printed circuit boards, rigid printed circuit boards, and rigid-flex circuit boards.
Air gap construction
Stiffeners
Cover lays
Low-cost FPC systems
Intermediate component density through the traditional plated through-hole and micro-via interconnect.
The Taiwan-based company comes as a reputable flex PCB manufacturer specializing in designing, fabrication, and assembly of rigid printed circuit boards. It is equipped with world-class manufacturing processes that ensure high-quality PCBs.
Tripod Technology deals in other electronic back-end equipment products despite primarily indulging in PCB development and manufacture. It includes a topping machine, test handler, target hole drilling, etc. It prides itself on sustainable environmental protection, especially in the production process. You will find its business model unique as it is developed around R&D (research and development). Such a strategy propels it above competitors in global PCB manufacturing, which is a notch higher.
Features
Over 15 years of industry experience, primarily in the semiconductor sector
The company has multiple certifications, including ISO 9001:2015, IECQ QC 080000:2012, IATF 1649:2016, TL9000-H R6.2/R5.7, etc. In addition, the company also conforms to ISO 45001, ISO 27001:2013, and ISO 14000.
The company offers multiple services, including the fabrication and assembly of rigid-flex PCBs.
Global manufacturing with multiple fabrication stations in China, thus guaranteeing better overall prices for flex PCB products.
The company also models its business on environmental sustainability.
Service and Product Application of the Manufacturer
TFT-LCD is also a thin film transistor liquid crystal display that provides quality imagery. It comes as large, small, NB, tablet, and DT.
Memory products by usage include DDR, Flash PCB, and SSD-client
HDD, mostly used in computer or PC hard disks. It comes in 2.5 and 3.5 options
Buried inductor
Multilayer board
Semi-flexible boards
Mixed pressure, etc.
#6. Zhen Ding Tech
The company has a remarkable reputation for manufacturing incredible and quality flex printed circuits. Zhen Ding Tech believes in investing in more materials to better facilitate Flex and other PCB design types. In addition, it combines the IoT (Internet of Things), Internet of Vehicles, AI, and 5G technology to offer several customized solutions.
You get to enjoy simplifying their printed circuit board fabrication or manufacturing process into vital aspects. The first step entails the design phase before further research through the R&D department. After this, the Flex or other PCB type gets manufactured before delivery for your use.
Features
The company puts a premium on the innovation and efficiency of diverse PCBs.
Combines different technologies in delivering quality flex PCBs, HDI (high-density interconnection), and ICS or integrated circuit substrates
Manufactures and supplies multiple PCB products
Provides PCB manufacturing services for diverse application areas
It uses advanced technology to thin, manufacture, and automate the fabrication of PCB products for diverse applications.
Located in Taiwan with an industry experience of over 15 years
Different manufacturing sites with expert staff, latest technology, and modern equipment.
The company models its business around rationalization, efficiency, unmanned and computerized production.
Multiple quality certifications to guarantee the quality of products and processes
Service and Product Application of the Manufacturer
Fabrication and assembly of Flex, rigid-flex, and rigid printed circuit boards
Various application areas include automobiles/vehicles, NetCom, wearable devices, and cell phones. It also applies to consumer electronics and computer information.
Excellent customer care service for all your inquiries besides manufacturing, packaging, and delivery of PCB products
#7. Kinwong
The company has a distinct collaborative approach to developing or manufacturing flex circuit boards for you. Kinwong comes as one of those manufacturers that will not rest until your PCB needs to get met. Further, it prides itself on excellent craft with attention to your design to provide a true-to-type or improved version of your expectations.
Kinwong has five production sites in China with over 11 factories. It is certified and provides quality PCB products and services.
Features
Design, fabricate and assemble conventional and modern printed circuit board types. It also deals in the research and development of PCBs.
Adheres to industry quality assurance measures and certifications to ensure high reproducibility and quality
Committed to making your design requirements of lighter, thinner, and smatter flex PCBs a reality
Targets and serves diverse application areas, including the medical and industrial sector, consumer electronics, telecommunications, etc.
Multiple factories are equipped with expert technicians, modern machines, and innovative technologies to serve your Flex and other PCB-type needs.
Over 28 years of industry experience with over 14000 staff world-over
Concentrates on client or customer demands in terms of innovation besides encouraging product upgrade
Service and Product Application of the Manufacturer
Research and development, fabrication, and delivery of PCB products and top-tier electronic materials
Products include Flex printed circuits, conventional PCBs, rigid-flex PCBs, HDI PCB, copper inlay, RF PCB, etc.
If you have not encountered the bizarre, this company will shock you slightly. It is not your standard PCB order and manufacturing company, but one that specializes in designing and evolving new PCB design trends to fruition. Shennan Circuits got incepted in 1984 and have over 37 years of experience in the field. It is global, with production sites in China and North America. It also has R&D sites located in Europe as an integral aspect of its commitment to manufacturing.
Features
Over three decades of industry experience designing, innovating, and manufacturing diverse types of PCBs.
Multiple manufacturing and R&D locations in China and North America besides Europe, respectively
Focuses on innovation, research, and development, besides manufacturing of Flex and other PCB types
Diverse approaches in providing world-class electronic circuit solutions and technology include a 3-in-1 PCB design process encompassing design, substrate packaging, and assembly. The approach can also involve a full PCB value chain, including scheme design, micro-assembly, PCB testing, manufacturing, etc.
Service and Product Application of the Manufacturer
Design, innovation, and manufacturing of diverse PCB types
PCB testing
#9. Suntak PCB
If you have a large flex PCB order, then Suntak PCB can prove the ideal solutions partner for you. The company has a demonstrated history and pedigree of manufacturing PCBs since 1995. Coupled with a skilled staff of over 4500 and a 3 million sq. m factory space, you will hardly get disappointed. What is more? The company commits to providing high-caliber PCBs to its clients or customers.
Features
Large factory space measuring 3 million sq. m
A skilled staff of over 4500 to cater to your Flex and other PCB type needs
Mostly targets electronic manufacturers and information sectors, though caters for other sectors as well.
Service and Product Application of the Manufacturer
Application areas include industrial control, communications, medical, and automotive electronics.
Services offered include prototyping, high-volume production, and assembly of diverse PCBs.
#10. China Fast Print
The company is an industry leader when it comes to PCB technology innovation. The belief entails using the correct technology whenever the desire encompasses getting more opportunities in the industry. Because of this, the manufacturer prides on this mantra for the two decades it has existed. Further, customer satisfaction ranks highly, thus their commitment to ensuring quality PCB service delivery.
Features
Research and development, manufacturing, and collaboration prove critical for the company’s business model.
Targets and supplies diverse industries, including telecommunications, automotive electronics, rail transit, medical electronics, semiconductors, industrial control, and computers, besides other peripherals
Why do we have a lot of Flexible PCB China Manufacturers?
China has emerged as a global powerhouse when it comes to PCB manufacturing. Additionally, the labor is highly skilled and cheap compared to North American and European companies. As a result, the quality of PCBs by Chinese manufacturers proves high and with lower costs which rank them highly.
Final Thoughts
If you want a quality flexible PCB, finding the correct flexible printed circuit board manufacturer becomes of the essence. It thus becomes prudent to understand the aspects discussed to pick the best-suited manufacturer for your flex PCB needs. But starting your discrimination with the highlighted flex PCB manufacturers will make it easier for you, would it not? Best of luck.
Field Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs) are two types of programmable logic devices that allow engineers to implement custom digital circuits. Both offer flexibility and rapid prototyping capabilities for digital systems. However, there are some key differences between the two that make each more suitable for certain applications.
What is an FPGA?
An FPGA is an integrated circuit designed to be configured by the customer or designer after manufacturing. FPGAs contain programmable logic components called logic blocks and a hierarchy of reconfigurable interconnects that allow the logic blocks to be connected. Logic blocks can be configured to perform complex combinational functions or simple logic gates like AND and XOR gates.
FPGAs typically contain a large array of logic blocks and rich interconnect resources to implement very complex digital circuits. The programmable logic blocks and interconnects configuration is generally specified using a hardware description language like VHDL or Verilog.
Some key capabilities of FPGAs include:
Implementing any digital circuit up to hundreds of thousands of gates
Reconfigurability – circuits can be changed after manufacturing
Rapid prototyping and design iteration
DSP and math-intensive functions with dedicated DSP slices
Parallel processing with a large number of logic blocks
FPGAs are commonly used for digital signal processing, software-defined radio, aerospace and defense systems, ASIC prototyping, medical imaging, computer vision, cryptography and other compute-intensive tasks. Leading FPGA vendors include Xilinx and Intel (formerly Altera).
A CPLD or Complex Programmable Logic Device is also a programmable integrated circuit containing logic blocks and interconnects. However, CPLDs have a much simpler overall architecture compared to FPGAs.
CPLDs consist of a small number of macrocells connected through a programmable interconnect matrix. Each macrocell is more complex than a typical FPGA logic block and can implement medium-sized logic functions. The interconnect matrix provides routing between macrocells.
Some of the key characteristics of CPLDs are:
Contains a few tens to hundreds of macrocells
Each macrocell has wide input/output capability
Interconnect is less flexible than FPGA routing
Limited clocking and I/O resources compared to FPGAs
Programming is via logic equations instead of hardware description languages
CPLDs are best suited for:
Glue logic and interfacing between components
Small to medium complexity logic implementation
Cost-sensitive simple designs
Some examples applications of CPLDs include:
Front panel button and LED interfacing
State machine control logic
Counter/timers
Parallel data processing
Major CPLD manufacturers include Lattice Semiconductor, Microchip (formerly Atmel) and Intel (formerly Altera).
Although both FPGAs and CPLDs are programmable logic devices, there are some key differences between the two architectures:
Logic Capacity
The most fundamental difference is logic capacity. FPGAs offer much higher capacity with hundreds of thousands of logic gates while CPLDs have hundreds to a few thousand gates.
For implementing complex digital circuits with large gate counts, FPGAs are preferable. CPLDs are suitable for simple glue logic functions.
Architecture and Flexibility
The overall architecture and configurability of both devices is very different. FPGAs have a sea of small logic blocks interconnected by a flexible routing structure. This allows very complex custom architectures to be realized.
CPLDs have a coarser overall architecture with a small number of larger macrocells connected by a simple interconnect structure. This limits the range of designs that can be implemented compared to FPGAs.
Design Entry Methods
FPGAs are configured using hardware description languages like VHDL or Verilog. This gives designers full control over the architecture and behavior.
CPLDs are programmed using logic equations that define the function of each macrocell. This is more restrictive than HDL-based design entry.
Performance
The abundant interconnect and separate memory blocks of FPGAs allow much higher performance for designs with lots of parallelism or requiring high memory bandwidth. Special DSP slices can accelerate signal processing algorithms.
CPLD performance is more limited in comparison due to the simpler architecture.
Cost
Owing to their architectural simplicity, CPLDs tend to be lower cost than FPGAs for smaller logic capacity needs. High-density FPGAs can be quite expensive.
Clock Management
FPGAs provide sophisticated clock management tiles that allow many clock domains with frequency synthesis and clock skewing. This is useful for complex synchronous digital circuits.
CPLD clock management capabilities are quite limited in comparison.
Development Tools
The design toolchains for FPGAs and CPLDs are very different. FPGA vendors offer advanced software for design simulation, timing analysis, layout, placement & routing and programming.
CPLDs are programmed using logic compilers that are simpler to use but offer less verification capability.
Summary of Differences
Application Differences
The architectural differences between FPGAs and CPLDs make them suitable for different classes of applications:
FPGAs are ideal for:
Compute-intensive algorithms like video processing, encryption, bioinformatics
Complex systems requiring high data throughput and parallelism
Advanced interfacing protocols like PCIe, Ethernet, SATA
Prototyping ASIC/SoC designs before tapeout
CPLDs are ideal for:
Simpler glue logic, control logic and interfacing
Low-cost designs not requiring advanced features
Small form factor designs (CPLDs have smaller packages)
FPGA vs CPLD Example Designs
Xilinx Zynq fpga
To better illustrate the differences in applications suited for FPGAs and CPLDs, let’s compare a few example digital systems typically implemented using each type of programmable logic device.
FPGA Design Examples
High-Speed Network Router
A network router for high-end infrastructure has the following requirements:
Packet forwarding at up to 400 Gbps
Routing table lookup using TCAM
Traffic shaping algorithms
Buffering with high memory bandwidth
Multiple network interfaces up to 100Gbps
An FPGA would be an ideal fit for implementing a high-performance router like this. The flexible logic blocks and DSP slices can implement the data plane forwarding functions. Large embedded memory blocks provide packet buffering. The I/O blocks support high-speed interfaces like 100Gbps Ethernet.
Real-Time Video Processing
A real-time video processing pipeline has the following functionality:
Pixel processor for image enhancement
Motion estimation for video compression
Image pyramid generation
Neural network-based object detection
The highly parallel nature of video processing maps perfectly to an FPGA. The dedicated DSP blocks handle pixel processing and motion estimation. The FPGA’s logic fabric implements generate image pyramids efficiently in hardware. Theobject detection neural network can also be mapped to programmable logic.
Encryption Accelerator
An encryption accelerator card offloads processing for algorithms like AES, SHA, RSA from the host CPU. It requires:
High-bandwidth I/O to transfer data
Parallel encryption engines
Low-latency request processing
FPGAs are widely used for encryption due to their performance benefits over software. The reconfigurable fabric implements parallel encryption pipelines to achieve very high throughput. Low-latency access to the encryption engines can also be guaranteed when using an FPGA compared to software.
CPLD Design Examples
LED Controller
An LED controller drives a set of eight RGB LEDs for mood lighting based on user input. It requires:
Debounced button inputs for mode select
PWM generation for LED intensity control
LED enable signals
A small CPLD with eight to sixteen macrocells can easily implement the glue logic for the LED controller. The parallel I/O capability enables driving multiple LEDs simultaneously. Timers implemented in logic generate the PWM waveforms.
Motor Controller
An electric motor controller coordinates six motors. It requires:
Individual speed and direction control for each motor
The glue logic and interfacing in the motor controller maps well to a mid-size CPLD. Macrocells can generate the necessary control signals for enabling and driving each motor. Additional logic processes the feedback and monitor inputs.
SDRAM Controller
A simple SDRAM controller interfaces to a 64MB SDRAM with a 16-bit data bus. Key requirements are:
SDRAM command timing
Refresh cycle generation
Bank/row/column addressing
Data bus buffering
A CPLD can implement the basic timing and control functionality needed for the SDRAM controller using its predictable timing performance and parallel I/O capability. More advanced memory controllers are better suited for FPGAs however.
Choosing Between FPGAs and CPLDs
So when should you choose an FPGA over a CPLD, and vice versa? Here are some guidelines for selecting between the two types of programmable logic:
When to Use an FPGA
For complex logic functions requiring thousands of gates/logic cells
If DSP capabilities like multipliers are needed
For designs requiring lots of memory and wide memory buses
Fast processing of parallel data is required
Multiple high-speed serial I/O standards are required
HDL-based design entry is preferable
Advanced debugging capabilities are desired
When to Use a CPLD
Only simple glue logic or interfacing is needed
Low cost is critical
Small packaging is required
Low power operation is prioritized
Simple logic equations can specify the design adequately
Minimal debugging capabilities are sufficient
For the vast majority of complex, high-performance designs FPGAs will be the best choice. CPLDs excel in simpler glue logic applications where their low cost and small form factor are beneficial.
Conclusion
FPGAs and CPLDs both provide user-programmable logic capability but are suited for very different types of applications. FPGAs offer higher logic density, more flexibility, advanced features and superior performance. CPLDs trade off capability for a simpler architecture, smaller footprint and lower cost.
Engineers should carefully consider the requirements of their application and determine which type of programmable logic device better suits their design needs. As a rule of thumb, FPGAs tackle complex logic problems requiring high data throughput while CPLDs handle simpler glue logic and interfacing tasks.
Understanding the architectural differences between FPGAs and CPLDs will ensure the best choice is made when starting a new programmable logic design. Both families offer unique benefits spanning a wide range of digital systems.
FPGA vs CPLD FAQ
Here are answers to some frequently asked questions about FPGA and CPLD differences:
Q: Can an FPGA replace a CPLD in a design?
Yes, an FPGA can readily implement the same functions as a CPLD owing to its greater logic density and flexibility. Replacing a CPLD with an FPGA may also allow you to add more functionality and performance.
Q: Do FPGAs and CPLDs require different CAD tools?
Generally yes. FPGA vendors provide advanced toolchains for simulation, synthesis, place and route, timing analysis and programming. CPLDs use simpler logic compilers and do not require intensive timing analysis.
Q: How do FPGA and CPLD programming differ?
FPGAs are programmed using hardware description languages like VHDL or Verilog. CPLDs are programmed by defining Boolean equations or state machines to specify logic functions.
Q: Can unused FPGA logic cells be powered down to save energy?
Yes, FPGA architectures support selective power down of unused sections. This can provide substantial energy savings in designs not requiring the full FPGA gate capacity.
Q: Which has higher performance – FPGA or CPLD?
FPGAs offer superior performance thanks to abundant routing, DSP blocks, memory bandwidth and hard processor cores. CPLD performance is constrained by the macrocell/interconnect architecture.
Key Takeaways
FPGAs have higher logic density and more advanced features compared to CPLDs
CPLDs trade off capability for simpler architecture and lower cost
FPGAs are ideal for complex, high-performance applications
CPLDs are well-suited for simple glue logic and interfacing
FPGA design is HDL-based while CPLDs use logic equations
When selecting programmable logic, consider requirements carefully before choosing between FPGA and CPLD
The Xilinx Spartan-7 family delivers an optimal balance of low cost, power efficiency and features in a small form factor FPGA. Built on an advanced 28nm manufacturing process, Spartan-7 provides high density logic, abundant IOs, integrated memory and DSP slices to address diverse embedded applications.
This article provides a comprehensive overview of the Spartan-7 architecture, available devices, key resources, datasheet specifications and reference design details. Comparison to previous Spartan generations is also included to illustrate the enhancements Spartan-7 delivers.
Spartan-7 Family Overview
The Spartan-7 family spans from 10K logic cells to over 200K logic cells across twelve device sizes to meet various application requirements:
This range of densities combined with low cost BGA packaging made Spartan-7 suitable for applications like display/camera interfacing, motor control, IoT edge nodes, industrial automation, and functional safety systems.
Now let’s explore the key resources and capabilities in more detail.
Spartan-7 Architecture Innovations
Building upon the popular Spartan-6 family, the Spartan-7 architecture incorporated new enhancements to deliver more application value at lower power.
28nm Process for Higher Density and Performance
The 28nm high-performance, low-power (HPL) manufacturing process allowed a 2X increase in logic density versus Spartan-6 built on a 45nm node. This expanded capacity within existing small form factors.
Higher transistor densities and lower supply voltages also enabled up to 25% power savings together with improved speed. Spartan-7 could operate across a wide 0.8V to 1.0V Vcc range.
Advanced Productivity Features
To boost design productivity, Spartan-7 added advanced capabilities like:
150MHz+ speed grade devices
Integrated memory controllers with ECC support
Mixed-mode clock management blocks
Enhanced DSP blocks with 25 x 18 multipliers
Automotive and industrial temperature support
Feature-rich IO logic with DDR3 memory interfacing
These features facilitated integration of both control and data processing within a single Spartan-7 device.
Integrated Memory Controllers
To efficiently interface to external RAM and flash, Spartan-7 incorporated dedicated memory interface blocks. Key benefits included:
1Gbps performance with 32-bit DDR3 support
Error correction code (ECC) logic for reliability
Simple interfacing without consuming programmable fabric resources
Reference designs to quickly leverage memory controllers
Low Cost Packaging and IP
Spartan-7 leveraged low-cost chip-scale ball grid array (CSBGA) packages making them ideal for price-sensitive, high volume applications.
Xilinx also provided a large catalog of free IP to accelerate designs including AXI peripherals, verification cores, DSP and video analytics functions.
Together these enhancements expanded Spartan-7’s capabilities compared to prior generations for embedded systems requiring integrated control, data processing and connectivity.
Spartan-7 FPGA Feature Details
Now let’s take a closer look at the details and specs behind the major resource types in Spartan-7 FPGAs.
Programmable Logic Blocks
The Spartan-7 logic fabric is organized as Configurable Logic Blocks (CLBs) interconnected through a hierarchy of routing resources.
Key attributes of the CLB architecture:
Each CLB contains 8 LUTs and 16 flip-flops
LUTs can also be configured as distributed memory or shift registers
2 x 2 flip-flop pairs support high-fanout clocking
Fast carry logic for arithmetic operations
In total Spartan-7 delivers 19K to 147K LUTs to implement glue logic, state machines, buffers and other control-oriented functions.
Block RAM Memory
Spartan-7 contains 216Kb to 2.7Mb of embedded block RAM memory for data storage and buffering needs.
Block RAM provides:
Dual-port 18Kb blocks with optional ECC support
Configurable as 36Kb simple dual-port RAM
Built-in FIFO capability
Dedicated memory interface with DDR3 support and up to 10Gbps throughput
Abundant block RAM enables Spartan-7 to accommodate local data storage and buffering requirements.
Digital Signal Processing
For signal processing, math and vector operations, Spartan-7 integrates up to 444 DSP slices.
DSP slice features include:
25 x 18 multipliers yielding 450 GMACS throughput
48-bit accumulators for high precision compute
Cascadable to form wide math functions
Optional pipelining for high throughput
Power saving clock gating
The DSP slices readily support functions like filters, FFTs, matrix operations, video overlays and sensor fusion.
High Speed Serial I/O
To enable high bandwidth interfacing, Spartan-7 incorporates up to 12.5Gbps serial transceivers supporting protocols including PCIe, Ethernet, DisplayPort and SATA.
Sophisticated equalization for backplane signal integrity
Support for 150m copper cable lengths
Mixed-Mode Clock Management
Flexible clocking capabilities are provided through up to 12 mixed-mode clock management (MMCM) blocks and 48 clock management tiles (CMT).
Key clocking features include:
Zero delay buffers to reduce skew
Frequency synthesis, division and spreading
Phase shifting for timing adjustment
Low jitter PLLs for clock clean-up
Glitchless clock multiplexing and gating
Integrated Memory Controllers
As mentioned earlier, dedicated memory interface blocks enable interfacing to external DDR3 components.
Spartan-7 memory controllers provide:
32-bit interface up to 1Gbps throughput
Simple SPI control for configuration
ECC support for reliability
Reference designs available
1-2 controllers per FPGA device
Spartan-7 FPGA Datasheet Details
Xilinx provides comprehensive datasheets detailing the complete specifications and characteristics of Spartan-7 FPGAs. Let’s go through some of the key parameters covered:
Features Summary: Overview of device size, package offerings, process node, voltage, operating temperatures, etc.
Pinouts: Diagrams showing pin functions for each package footprint. Details I/O bank assignments.
Memory Ports: Specifications for block RAM capacity and configuration for each device size.
I/O Characteristics: AC/DC parameters for memory interface pins and general purpose I/Os. Highlights sideband signals like dedicated clock inputs.
Maximum Ratings: Absolute maximum voltages, junction temps, power consumption and other parameters. Ensures reliable operation when conditions are within ratings.
Thermal Resistance: Resistance parameters to estimate die temperature based on package thermal characteristics and power dissipation.
Switching Characteristics: Timing specs for global clocks, block RAM, transceivers and I/O interfaces across speed grades, voltage and temperature.
Power Consumption: Typical static and dynamic power consumption figures to estimate device power across use cases. Power varies by utilization.
Physical Attributes: Dimensions and weight for each package footprint. Helps with board layout and mechanical considerations.
System Signals: Descriptions of key clocks, configuration pins and other global signals used to operate the FPGA.
The comprehensive datasheet gives designers detailed electrical and physical data to properly model, analyze and deploy Spartan-7 devices in their systems.
Spartan-7 Reference Design Overview
To accelerate adoption, Xilinx provides a suite of Spartan-7 reference designs showing optimal utilization of resources:
Spartan-7 Evaluation Kit: Highlights main Spartan-7 feature sets like block RAM and DSP designs.
Memory Interface Solutions: Demo projects for integrating Spartan-7 memory controllers.
PCI Express Solutions: Endpoint demos using integrated PCIe blocks.
Connectivity Solutions: Networking and interfacing demos leveraging Spartan-7 transceivers.
Signal Processing Solutions: DSP pipeline designs for common algorithms like FIR filtering and FFT.
Video and Image Processing: Demos for video buffering, overlays, encoding using Spartan-7’s dedicated resources.
Industrial Networking and Motor Control: Real-world industrial app examples for functional safety and motor actuation.
These optimized reference projects enable faster design starts leveraging Spartan-7 capabilities. The source code can be readily modified and enhanced to meet application requirements.
Spartan-7 vs. Spartan-6 Comparison
To appreciate the enhancements in Spartan-7, it is useful to compare against its predecessor Spartan-6 built on 45nm technology:
Spartan-6
45nm process node
Up to 150K logic cells
3.2Gbps integrated serial transceivers
200MHz speed grade
No integrated memory controller
Spartan-7
28nm process enabling 2X density
Up to 275K logic cells
12.5Gbps integrated serial transceivers
150+ MHz speed grades
Integrated DDR3 memory controller
The combination of advanced process technology and architectural enhancements solidiified Spartan-7’s position as the leading low-cost/high-value FPGA offering at 28nm.
Conclusion
The Xilinx Spartan-7 family delivers new levels of design value through density, bandwidth and power improvements over prior generations. The 28nm manufacturing combined with 2X capacity, abundant memory, 12.5G serial connectivity and integrated DDR3 memory controllers cement Spartan-7’s standing as the premier low-cost FPGA.
For embedded applications like industrial networking, motor control, functional safety and IoT edge processing, Spartan-7 provides an optimal balance of features and small form factor. The comprehensive datasheet contains complete electrical specifications to aid design and analysis. Example reference designs allow accelerating time-to-market.
Overall, Spartan-7 carries forth Xilinx’s legacy of providing low-cost, high-value FPGAs for space-constrained embedded applications not requiring maximum capacity or performance. The family sets a new benchmark for low-cost programmable logic capability.
Spartan-7 FPGA FAQ
Here are some common questions regarding the Spartan-7 FPGA family:
Q: What process node is Spartan-7 manufactured on?
A: Spartan-7 uses a high-performance, low-power 28nm node to enable higher density and lower power versus the preceding 45nm Spartan-6 generation.
Q: Does Spartan-7 support 3.3V I/O signaling?
A: Yes, in addition to 1.8V interfaces Spartan-7 supports 3.3V I/O for legacy system interoperability along with mixed-voltage I/O banks.
Q: How many clock management tiles does the Spartan-7 architecture contain?
A: Spartan-7 contains up to 12 MMCM blocks and 48 CMTs for advanced clocking capability relative to device size.
Q: What embedded memory controllers are integrated in Spartan-7?
A: Integrated DDR3 memory controllers with 32-bit interface up to DDR3-1066 speed are included to interface to external RAM and SDRAM.
Q: Does Spartan-7 support PCI Express integration?
A: Yes, selected devices include integrated PCIe blocks for implementing PCIe endpoint connectivity without consuming FPGA fabric resources.
Working with electronics can be a terrifying prospect for someone who has little to no experience. One needs to be competent in several different areas just to get started. Fortunately, some tools can help simplify the process, and with these tools, any beginner can get off the ground running.
Xilinx Spartan-7 FPGA boards‘ design is precisely for this purpose with features. For instance, being free from onboard power supplies and simple USB connections. It makes the task of getting started easier than ever before.
The boards are essential in creating many things, from simple LED projects to clocks to full-featured computers, and much more. Spartan-7s is facing criticism from those who believe there is little to offer those with the most limited needs despite their versatility. This notion stems from the fact that many people see them as a steppingstone towards something better. It seems like a common opinion amongst those who do not know why they would choose Spartan-7 over other FPGA boards.
The Arty family of Digilent boards aims to change this notion. These boards are perfect for a wide variety of FPGA projects and do not require heavily trained engineers to use or operate. These designs combine power and ease of use with the flexibility needed to create something great. They also integrate high-end FPGA features. For instance, Xilinx‘s 1.2TFLOPS Tri-core processors, the industry-standard BM3358 dual-core processor, and more into small form factor boards that people can use. At the same time, they learn FPGAs without feeling overwhelmed by the technology.
The first thing that people will notice is that the Arty boards are small, just 4.75 inches by 2.8 inches. This makes them perfect for projects within tight spaces where it would be impossible to fit something larger. Since these boards lack onboard power supplies, they are straightforward to use since we can power them through any micro-USB cable or adapter. This makes them great for projects that might need relocation frequently. We do not need a particular power source to power the board once everything is working correctly.
In addition to being small, the boards are relatively light, making them easy to carry around or carry in a case. With a weight of just Under 1.5 pounds, most people who use them will not even know that they are carrying around an FPGA board.
The boards have all the standard functionality you expect from a modern FPGA board. They include Xilinx’s DSP blocks, such as the CINCH mode, and PCR blocks, such as the DSPax2 and DSPz2 cores. This helps to ensure that those who use these boards will be able to create something truly amazing without compromising the internal functionality of the board.
Each of these boards has several different design areas in mind. For example, the Arty 1 and Arty 2 boards place a significant emphasis on power and ease of use out of the box. With both boards, all needed to get started is a micro cable and any composite cable. Ones that you might need for your project already soldered to the board itself.
Xilinx Spartan-7 FPGA Boards Features
xilinx spartan 7 fpga
The Arty boards are the first FPGA boards that have Digilent’s new Artix-7 FPGAs. Both boards use the same basic schematic. However, they differ in handling power and forgo onboard power supplies to ensure that the boards are small enough to be portable.
Configuring the Xilinx Spartan-7 FPGA boards is relatively easy. However, it can be confusing for those who have little to no experience with programming FPGAs. In all reality, this process is not difficult, and it simply takes time to learn how everything works.
You first need to use Xilinx’s WebPACK tools to configure the Artix-7 FPGA on either of these boards. The JTAG debugger that you need to do this comes with the board when you buy it. These boards also come with two micro-USB cables so that you can plug them into your computer.
Each of these boards has a Pmod connector so that you can use Digilent’s Pmod peripherals with the board. The connectors are compatible with the older Pmods, so any Pmod peripheral will work without issue. SPI Flash drives or JTAG debugger cards are beneficial with these boards. This is because they allow you to store files on them for easy transfer to other devices instead of transferring files to an SD card.
Support The Digilent Pmod peripherals work great with both boards, but the documentation can be confusing. The “Getting Started” section in the user manual says nothing about using them. The Pmod peripheral pages often list features that do not exist (for example, there is no six-channel A/D). QSPI flash drives with the Arty boards work, but they do not support multi-bit reads and writing like the SuperCap and Spark boards do.
Memory
Because these boards only come with 8MB of onboard memory, you will need to add at least one additional memory chip if you wish to store data and programs on the board itself.
The memory on these boards can last for a while, and it is unlikely that you will run out of space while working on something. The documentation lists the memory as being dynamic, but this is inaccurate. More accurate information is that you can write the memory, but it will not disappear.
Processors
These boards have two different processors onboard. The first is a single-core processor known as the TriCore processor, which functions at 633MHz. It has 4kb of embedded DDR2 RAM and 8kB of embedded SRAM.
The second processor is the BM3358 dual-core processor, which functions at 400MHz with two MB of embedded DDR2 RAM and 16kb of embedded SRAM. It also has 4kb of EEPROM to store configuration data.
The two processors are different in terms of how they operate, but they both function well. You can use these processors independently or together to do different things at the same time.
We should use the TriCore processor for low-power applications. This is because it requires very little energy to run, and it will not consume much power. The BM3358 is better suited for high-power applications since it can consume more energy than its companion chip.
Control & I/O
The Arty 1 and Arty 2 boards have a single user I/O port, allowing an external to wire the switch to the board. This allows the board to work as a simple switch, and it is beneficial for projects that need more than one piece of equipment to work simultaneously.
The boards also have a single DIP switch, allowing five different serial ports to connect to the board. This will enable you to use the boards with a variety of software tools and peripherals.
Both boards have a standard JTAG port that can debug code or use the board as a programmer. The Artix-7 FPGA also has an embedded serial port, but neither of these two boards has this feature. User pushbuttons are available for them, but they are somewhat limited in what you can do with them.
Both boards have 16 digital I/O pins that we can use to send or receive data. They also have four analogs PWM channels that can process their inputs or output data. This makes both boards extremely useful for HMI applications. It is because you can use PWM channels to display any image, text, or anything else that you might need on the screen. DIP switches are available to control the digital I/O pins and run a simulation to determine what they do.
The Arty 1 and Arty 2 boards can work as a general-purpose development board that we can use for various projects. The TriCore processor on these boards will not carry heavy loads very well, but it will manage those loads without issue if you need it to run programs.
The Digilent Artix-7 Spartan-7 FPGA boards come with a variety of expansion connectors. It allows users to connect the boards to their other hardware.
The first expansion connector these two boards have is a Pmod connector. It allows the connection of other Digilent peripherals to the board. We can use them with both boards, but they will not work with the XC7A200T FPGAs on the Spark Board or SuperCap. VITA 57.1 FMC LPC connector This FMC connector allows users to connect a VITA 57.1 programming board to the board. There is no documentation on the Internet for this device. So, it may be easy to use wrong or damage something during the process.
The Digilent Artix-7 Spartan-7 FPGA boards have an LPC connector. So, users can program their peripherals instead of using the Xilinx software tool. Pmod Headers This connector allows users to connect an external display with a separate power supply to the board.
This adapter will allow users to connect an external USB flash drive to the board. You must connect it in this format, or it will not work correctly. This connector tells the board what memory banks are available on the expansion header. The only free bank on this board is A0, so if you do not have one of these connectors, you will not connect your expansion device to the board.
Communication & Networking
These boards can connect to any other piece of equipment you might have, but they can also communicate with each other.
The Artix-7 FPGA on the Arty 1 and Arty 2 boards comes with several built-in Ethernet channels that connect Ethernet-capable peripherals.
Arc Risc is an architecture created by Digilent that allows users to connect different boards over Ethernet. The UART to USB Bridge allows any USB device to connect to the board using a universal serial bus. This will allow you to use a variety of peripherals with these boards, but it will not allow the boards to communicate with each other.
The XADC-4096 can also connect to the two boards via Ethernet, but it is essential in sensing data from a piece of equipment that is not an Arty board. The RJ-45 Tri-Speed Ethernet Connectors can connect other boards because they have an RJ-45 connector to plug the cable into. This is not a common feature for FPGAs, but it can be helpful in a variety of applications.
These two boards have two different ways of allowing the user to connect their board to other equipment. The first way is with a USB cable because it enables you to move data between your board and any other piece of equipment that has a USB port.
The Arty boards have a DSI LCD connector that allows the user to connect a TFT LCD or a digital micro-mirror display. This connector drives the display directly and ensures nothing is wrong with the data it is receiving. The TriCore processor on these two boards will also be able to drive the same displays. However, it will not do so since it cannot change the contrast or other settings on these displays. The HDMI Video Output on these boards will allow you to connect your board to an HDMI-capable display.
The Artix-7 FPGA on the Arty boards also has two DSI connectors that will allow you to connect a digital micro-mirror display or TFT LCD. The only difference is that the user must provide their power to the device instead of a USB cable. Additionally, the MIPI-CSI Camera Interface connector available on the Arty 1 and Arty 2 will let you connect a camera to these boards. Also, we can use the MIPI-DSI Display Interface to connect any TFT LCD. The DSI connector on the Arty boards also has an HDMI connector so that you can connect your board to an HDMI-capable display.
The Ralink RT5350F Wifi USB adapter for these boards can connect your board to any other device with a wireless network connection. The only problem with this adapter is that it does not have an antenna. So, if you are using it for anything more than basic programming, you will need to figure out how to increase the range of your wireless network.
Clocking
These boards come with several different clock speeds available for users to use. These clocks allow you to adjust the speed at which the FPGA is working, but they must have an appropriate voltage to run from.
The Arty boards have a VHDL source used for all their I/O signals. It is also the same as the clock used during normal operation, so there is no need for a clock input on these boards. The board will automatically adjust to a stable clock speed depending on the voltage that it gets. You can adjust the clock speed that it runs at using either of these two controls. The Artix-7 FPGA on these boards creates an internal gyroscope that will adjust the clock speed depending on moving.
The Artix-7 FPGA on these boards has two different clock outputs that you can use with external oscillators to drive it at different speeds. The first is the WANCOOP1 output which we use with external oscillators. It has an I2C Programmable Clock input, creating any clock speed that the user would like. The second clock output is CWAN1, and we can also use it with external oscillators, but it cannot create any clock speeds.
Power
There are two different power inputs available for this board. The first is the USB connector that allows the user to supply it with either 3.3V or 5V of power. We can use it to charge a battery directly, but we cannot use it if an AC adapter has a bad connection to the board. We refer to the other power input on these boards as BATEN1, and it has a 6-pin connector that allows users to supply the board with 5V of AC power directly.
The Arty boards also use the same two types of power inputs, but they come with more combinations of power supplies that we can use. These boards come with a C10-C16 DC power input that will allow users to supply the board with any voltage between 10 and 16 VDC. There is also an AUXIN1 input that can supply the board with up to 3A of current.
The Spartan-7 FPGA on the Arty boards will bring a lot of advantages to any project you are working on. The integrated flash memory and USB connectors will allow you to load and transfer data between you and your computer at high-speed rates. The built-in power supply and clock generators will also help by eliminating the need for two additional parts. Still, there is no need to use built-in oscillators. This is because they cannot output as high of speeds as one can achieve using external oscillators. The wide array of Analog, Digital, I/O, and Interfaces make this board an ideal choice for almost any type of application.
The Xilinx Spartan-7 FPGA on these boards is the same as the one found on the Wonder Boards. It has many of the same features, but some additional features are not available on the Wonder Boards. The TriCore processor will drive more digital displays than a single TriCore processor can drive on a Wonder Board. The DSI connectors will be able to drive more displays, but the Artix-7 FPGA on these boards will not drive the same amount as a Wonder Board.
The Xilinx Spartan-7 FPGA on these boards also has two built-in oscillators that come at different speeds. So, their outputs will need amplification if you are planning to use them with an external oscillator. Working with top PCB companies such as RayMing PCB and Assembly will help you enjoy all the advantages stated above.
Limitations of the Xilinx Spartan-7 FPGA Boards
One of the most significant limitations these boards face is requiring an external oscillator to use with projects. The internal oscillators will not work since they are only allowed to output at slower speeds. This limits what types of projects we can do with these boards. If you plan to use them for applications where you need the fastest possible clock speeds, you should choose a board from one of the other series of boards from Xilinx. However, they all have more limited features than the Spartan-7 FPGA on these boards.
Another limitation that these boards have is that there are only two I/O connectors available. The Arty boards have a USB connector available, but they can only charge a battery connected directly to the board. We can use the Artix-7 FPGA on the Arty boards to charge a battery connected directly, but there is no option for an external power source. The only I/O connector available for the Arty boards is an Analog Input connector. However, you cannot use them to connect any digital signals made on the Artix-7 FPGA. This does not limit what types of projects we can do, but it will make using them for some applications more difficult.
The Spartan-7 FPGA on these boards does not come with built-in oscillators.
[XCM-026Y] Xilinx Spartan-7 FGGA484 FPGA board (5 V Tolerant)
XC7S100: 160 DSP Slices, 4,320 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slice
XC7S75: 140 DSP Slices, 3,240 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 832 Maximum Distributed RAM (Kbits), 76,800 Logic Cells, and 12,000 Slices
XC7S50: 120 DSP Slices, 2,700 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 600 Maximum Distributed RAM (Kbits), 52,160 Logic Cells, and 8,150 Slices
[XCM-026] Xilinx Spartan-7 FGGA484 FPGA board (5 V I/O)
XC7S100: 160 DSP Slices, 4,320 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slice
XC7S75: 140 DSP Slices, 3,240 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 832 Maximum Distributed RAM (Kbits), 76,800 Logic Cells, and 12,000 Slices
XC7S50: 120 DSP Slices, 2,700 Total Block RAM (Kb), 100 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 600 Maximum Distributed RAM (Kbits), 52,160 Logic Cells, and 8,150 Slices
[XP68-06] Xilinx PLCC68 Spartan-7 FPGA Module
XC7S50: 5 CMT (MMCMx1+PLLx1), 50 Maximum user I/O pins (Board), 210 Maximum user I/O pins (Device), 120 DSP Slices, 2,700 Total Block RAM Bits (Kbits), 600 Maximum Distributed RAM (Kbits), 52,160 Logic Cells, and 8,150 Slices
XC7S25: 3 CMT (MMCMx1+PLLx1), 50 Maximum user I/O pins (Board), 150 Maximum user I/O pins (Device), 80 DSP Slices, 1,620 Total Block RAM Bits (Kbits), 313 Maximum Distributed RAM (Kbits), 23,360 Logic Cells, and 3,650 Slices
[XCM-210] Xilinx Spartan-7 FGGA676 FPGA board
XC7S100: 296 Maximum user I/O pins (Board), 400 Maximum user I/O pins (Device), 8 CMT (MMCM x1 + PLL x1), 160 DSP Slices, 4,320 Maximum Block RAM (kb), 1,100 Maximum Distributed RAM (kb), 16,000 Slices, and 102,400 Logic Cells
XC7S75: 296 Maximum user I/O pins (Board), 400 Maximum user I/O pins (Device), 8 CMT (MMCM x1 + PLL x1), 140 DSP Slices, 3,240 Maximum Block RAM (kb), 832 Maximum Distributed RAM (kb), 12,000 Slices, and 76,800 Logic Cells
[XCM-308] Xilinx Spartan-7 FTGB196 FPGA board
XC7S50: 8150 Slices, 52160 Logic Cells, 600 Maximum Distributed RAM (kb), 2700 Maximum Block RAM (kb), 120 DSP Slice, 5 CMT (MMCMx1+PLLx1), 100 Maximum user I/O pins (Device), and 56 Maximum user I/O pins (Board)
XC7S25: 56 Maximum user I/O pins (Board), 100 Maximum user I/O pins (Device), 3 CMT (MMCMx1+PLLx1), 80 DSP Slice, 1620 Maximum Block RAM (kb), 313 Maximum Distributed RAM (kb), 23360 Logic Cells, and 3650 Slices
XC7S15: 56 Maximum user I/O pins (Board), 100 Maximum user I/O pins (Device), 2 CMT (MMCMx1+PLLx1), 20 DSP Slice, 360 Maximum Block RAM (kb), 150 Maximum Distributed RAM (kb), 12800 Logic Cells, and 2000 Slices
XC7S6: 56 Maximum user I/O pins (Board), 100 Maximum user I/O pins (Device), 2 CMT (MMCMx1+PLLx1), 10 DSP Slice, 180 Maximum Block RAM (kb), 70 Maximum Distributed RAM (kb), 6000 Logic Cells, and 938 Slices
XC7A100T: 8 CMT (MMCM x1 + PLL x1), 160 DSP Slices, 128 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 4,320 Maximum Block RAM (Kbits), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slices
XC7S75: 12,000 Slices, 76,800 Logic Cells, 832 Maximum Distributed RAM (Kbits), 3,240 Maximum Block RAM (Kbits), 338 Maximum user I/O pins (Device), 128 Maximum user I/O pins (Board), 140 DSP Slices, and 8 CMT (MMCM x1 + PLL x1)
XC7S50: 5 CMT (MMCM x1 + PLL x1), 120 DSP Slices, 128 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 2,700 Maximum Block RAM (Kbits), 600 Maximum Distributed RAM (Kbits), 52,160 Logic Cells, and 8,150 Slices
[XCM-115] Xilinx Spartan-7 FGGA484 FPGA board
XC7A100T: 8 CMT (MMCM x1 + PLL x1), 160 DSP Slices, 128 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 4,320 Maximum Block RAM (Kbits), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slices
XC7S75: 8 CMT (MMCM x1 + PLL x1), 140 DSP Slices, 128 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 3,240 Maximum Block RAM (Kbits), 832 Maximum Distributed RAM (Kbits), 76,800 Logic Cells, and 12,000 Slices
[XCM-025Z] Xilinx Spartan-7 FGGA484 FPGA board
XC7S100: 8 CMT (MMCM x1 + PLL x1), 160 DSP Slices, 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 4,320 Maximum Block RAM (Kbits), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slices
XC7S75: 8 CMT (MMCM x1 + PLL x1), 140 DSP Slices, 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 3,240 Maximum Block RAM (Kbits), 832 Maximum Distributed RAM (Kbits), 76,800 Logic Cells, and 12,000 Slices
XC7S50: 5 CMT (MMCM x1 + PLL x1), 120 DSP Slices, 100 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 2,700 Maximum Block RAM (Kbits), 600 Maximum Distributed RAM (Kbits), 52,160 Logic Cells, and 8,150 Slices
[XCM-025] Xilinx Spartan-7 FGGA484 FPGA board
XC7S100: 8 CMT (MMCM x1 + PLL x1), 160 DSP Slices, 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 4,320 Maximum Block RAM (Kbits), 1,100 Maximum Distributed RAM (Kbits), 102,400 Logic Cells, and 16,000 Slices
XC7S75: 8 CMT (MMCM x1 + PLL x1), 140 DSP Slices, 100 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 3,240 Maximum Block RAM (Kbits), 832 Maximum Distributed RAM (Kbits), 76,800 Logic Cells, and12,000 Slices
[EDX-303] Xilinx Spartan-7 USB-FPGA board
XC7S100T: 4,320 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 1,100 Maximum Distributed RAM (kb), 102,400 Logic Cells, and 16,000 Slices
XC7S75T: 3,240 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 832 Maximum Distributed RAM (kb), 76,800 Logic Cells, and 12,000 Slices
XC7S50T: 2,700 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 600 Maximum Distributed RAM (kb), 52,160 Logic Cells, and 8,150 Slices
Conclusion
These boards are great supplements to any other board that you have for your project. You can use them to perform tasks that were once impossible because of the limitations of other FPGA boards. They do not offer as many features as the Arty family, but they still provide plenty of features to make them useful for almost any type of application. They are not as good as the Wonder Boards, but they are still high-quality FPGA boards.
If you know where to go on the Internet, you can find a USB board already configured for FTDI connection. First, you need to check if your computer has a USB port, as you can use any USB-powered device to communicate with your FTDI device. Second, you need to connect the FTDI board to your computer with a USB cable. Third, within the driver, go onto the “Communication” tab and check that “USB Serial,” “USB Device Class,” and “USB Version” are all set to the right values.
After this, it is time to start working with your FTDI device! FTDI devices have many options, so many are not ready by default. Just google around to find out which settings you need for your specific hardware.
Among the settings that you may need to adjust in your FTDI device, you can find:
1. Set the baud rate.
Check the documentation of your device to say what value it needs.
2. Setting serial port parameters.
The FTDI board sets these automatically. However, if you have one of those USB devices which works with some other protocol (such as CAN Bus) or if you want to use hardware flow control, then set these parameters manually.
An FTDI chip is a small computer with one significant difference. Its pins connect to another electronic device instead of installing them into a circuit. Thus, we can use the FTDI chip to talk over an RS232 serial interface in any other electronic device.
There are many uses for an FTDI chip. For example, we can use it as a serial adapter to convert RS232 signals to USB so that you can use the host computer’s USB port with it. Or we can use it as a USB-to-RS232 converter to connect to a computer that does not have a built-in RS232 interface. Also, we can use it as a USB keyboard (hence its name).
Many of these applications were there before, with various results. But this time, I will describe how you could use your FTDI chip directly in your electronics project. I will assume that you are willing to do some soldering and have basic knowledge of electronics.
What are the advantages of using an FTDI chip?
Since the FTDI chip is a separate computer that we can buy for under $5, it is cheap to connect. In addition, because it uses its memory and processor while sharing a single interface with other devices, communication between the device and the FTDI chip is faster than communication between two computers using an RS232 cable.
Since there is no cable to connect, you can fit the device into much smaller spaces than if you had an RS-232 card. Generically, this means it will be easier for you to hide the chip from sight and deliberate observation by someone else.
The FTDI chip comes with drivers that should work without configuration on most Windows, Linux, and OSX machines. Hence, you can use it in a wide range of environments. There are even cases where you can plug an FTDI chip into your USB port, and it will work immediately. This is not always possible with RS232 cards that we need to configure for the operating system to recognize them.
It is very easy to connect almost any device to an FTDI chip. You need to read your hardware documentation, as there are usually no details about this specific feature.
Unlike an RS232 card that we may need to configure to work, the FTDI chip is always ready-to-use. There is no need for extra software or configuration. It will always work as soon as you plug it in.
One can send data, and you will never forget how to connect your device back and forth with an FTDI chip. You will never have to learn extra commands or settings for your hardware to work, but you can use any protocol you require.
We also various manufacturers of these chips that include RayMing PCB and Assembly. But many use the same chipset and basic features.
FTDI Basic (V1.0)
The FTDI Basic (V1.0) is the oldest and the most basic of all the chips. It does not have any automatic reset, nor does it auto-disable for unused pins (“floating”). Also, it has a slight problem connecting to some USB ports at higher speeds.
We can find it in early FTDI cable products and most USB breakout boards.
FTDI Cable v2
There also exists an FTDI Cable v2. It has the same features as the FTDI Basic but uses two chips instead of one. It also has additional features such as automatic reset on power-up, auto-disable for unused pins, support of USB 2.0 speeds. There are some examples of this type in cables and USB breakout boards (for example, “FTDI Basic to USB Cable v2 – New”).
FTDI Basic v3
In 2009 there was a new type called the FTDI Basic v3.
The main difference is that it does not have the problem of connecting to a USB port that has a high-speed mode. Instead, it works only with a “fast” speed USB port, normally found on all modern computers. As a result, this is the only way to plug an FTDI Basic v3 cable into an “old” computer running Windows XP / Vista or Mac OS X and expect it to work.
The FTDI Basic v3 is available in most new cables and USB breakout boards.
FTDI cable v5
There is also an FTDI cable v5 which uses the same chipset as the FTDI Basic v3 but adds a new feature: auto-disable for unused pins.
It’s also now available in most new cables and USB breakout boards.
The difference between the FTDI Basic v3, the cable v5, and the original FTDI Basic is that they use entirely different chipsets (they do not share features).
FTDI Basic v3 and FTDI cable v5 share the same features, but the FTDI Basic v3 has 1.1V levels, while the FTDI cable v5 has 3.3V levels.
The original FTDI Basic is in level 0 (0V).
Note: If you want to buy one of these chips, please note that many fake versions are available on eBay and other sites. Please check with your seller for details of their guarantee and warranty.
The FTDI Cable v6
FTDI Cable v6 came in 2010 to replace the FTDI cable v5.
The main difference is that it has a higher voltage level (3.3V instead of 1.1V) and thus a greater distance for the current to flow without damage to the chip.
Also, it comes with improved software from cable v5. It has a new and easier method to configure your device using its application software and standard USB hub software.
The FTDI cable v6 is available in most new cables and USB breakout boards.
The most common example is when you want to connect your Arduino board to the FTDI cable:
GND pin is the ground (commonly known as “-” or, on an Arduino board, some of the GND connections). The TXB pin is for sending data from the FTDI chip to your Arduino board. We need to connect this with the RXB pin on your Arduino.
The RXB pin is for receiving data from the Arduino board. So we need to connect this with the TXB pin on your Arduino.
Other devices may have different pinouts. However, they should be compatible as long as they fit into the same connections.
Newer FTDI chips are 5V tolerant, meaning they will not damage the Arduino board if abused by connecting it to a higher voltage. Still, other devices connected via an FTDI cable may suffer damage because they may not be 5V tolerant.
Downloading and installing the drivers
This can be very tedious since you need to download the correct driver for your operating system. You need to find the correct driver by following some steps:
Download and install the free software “FTDI Driver Tool” from here
Select “USB to Serial Adapter” from the devices menu in the FTDI driver tool.
For Windows, click on the “Start” button and type “devmgmt.msc” into the search box on top of the window. Then press [Ctrl+E] and follow the steps to select “FTDI Device” from the device manager.
For Linux, open a terminal window and type “lsusb” into the search box on top of the window to find the correct driver. Also, you can do a google search for “Linux USB serial adapter.”
For Mac OSX, open a terminal window and type “ls -l /dev/cu.*” into the search box on top of the window to find the correct driver.
When you connect cable v5 to a computer, it will automatically reset and install its software on the computer.
You will then get an application called “FTDI Basic Control,” where you can configure your device.
One can also use the standard USB hub software supplied with most operating systems (for example, “WinUSB” in Windows 7). It helps to configure your device from another computer or control it from another application.
There is no need for any special tools to configure your device.
How to install the FTDI Basic Control software
To install this software, you will need to get the “Win32 Disk Imager” program from here and install it on your computer.
The program will then automatically install the FTDI Basic Control software.
Advanced configuration of the FTDI Basic Control software
The Advanced Configuration is only needed if you want to read or write directly to your computer’s serial COM port without using a virtual COM port. For example, to add advanced functionality to your project.
You will also need the “CMDebug” software from here.
It will show you detailed information about all the pins on both your FTDI USB-Serial Converter and your computer’s serial port.
The COM port and FIFO information are also displayed. It helps you use the standard “CMDebug” software to write to your computer’s serial port if you need to.
You may need to use this advanced configuration in rare circumstances. For example, if you want the complete I/O pins of the FTDI USB-Serial Converter to be available for your use.
FTDI Driver Installation
The FTDI driver installation will depend on your operating system.
In general, if you install the FTDI Basic Control software (the “FTDI USB-Serial Converter” control panel), then you should install the drivers automatically when you connect the cable v5 (OE/DO) to a computer.
Otherwise, you will need to install the drivers manually.
The FTDI Basic v3 is now obsolete. There are very few sellers of this chip in a new condition available on eBay and other sites. Check with your seller for details of their guarantee and warranty. FTDI has discontinued selling the FTDI Basic v2.
As of 2015 (and preceding years), there are very few sellers of this chip in a new condition available on eBay and other sites. Check with your seller for details of their guarantee and warranty.
The FTDI cable v5 chips are compatible with the FTDI Basic v2 and v3 cables.
However, the FTDI Basic v2 and v3 cables will not work properly with cable v5.
The general recommendation is to use the most up-to-date cable available for your system. You can use either the FTDI Cable V6 or a USB breakout board from Adafruit Industries.
It will provide better compatibility and more advanced features in most cases.
This chip has four wires. It is a popular chip, and many maker kits are available in new condition.
The FTDI Basic v4 is not compatible with cable v5 (OE/DO). It will only work with a cable v6 (OE/DI).
Altera 5CEBA4F23C8N: 100Maximum user I/O pins (Board), 224 Maximum user I/O pins (Device), 16 Global Clock Networks, 4 PLLs, 132 18 x 18 Multipliers, 3,383 Embedded memory (Kbits), and 49 K Logic Elements.
[EDA-011] Intel Cyclone 10 LP F484 USB-FPGA board
10CL120YF484C8G: 100 Maximum user I/O pins (Board), 277 Maximum user I/O pins (Device), 4 PLL, 288 18×18 Multipliers, 3888 M9K Blocks (kb), and 119088 Logic Elements.
10CL080YF484C8G: 100 Maximum user I/O pins (Board), 289 Maximum user I/O pins (Device), 4 PLL, 244 18×18 Multipliers, 2745 M9K Blocks (kb), and 81264 Logic Elements.
10CL055YF484C8G: 100 Maximum user I/O pins (Board), 321 Maximum user I/O pins (Device), 4 PLL, 156 18×18 Multipliers, 2340 M9K Blocks (kb), and 55856 Logic Elements.
10CL040YF484C8G: 100 Maximum user I/O pins (Board), 325 Maximum user I/O pins (Device), 4 PLL, 126 18×18 Multipliers, 1134 M9K Blocks (kb), and 39600 Logic Elements.
10CL016YF484C8G: 100 Maximum user I/O pins (Board), 340 Maximum user I/O pins (Device), 4 PLL, 56 18×18 Multipliers, 504 M9K Blocks (kb), and 15408 Logic Elements.
The Altera EP4CE15F17C8N: 56 Maximum user I/O pins (Board), 165 Maximum user I/O pins (Device), 20 Global Clock Networks, 4 PLLs, 56 Embedded 18 x 18 multipliers, 504 Embedded memory (Kbits), and 15,408 Logic Elements.
Altera 5CEBA4U15C8N: 56 Maximum user I/O pins (Board), 224 Maximum user I/O pins (Device), 16 Global Clock Networks, 4 PLLs, 132 18 x 18 Multipliers, 3,383 Total Memory (kb), 303 Memory: MLAB (kb), 3,080 Memory: M10K (kb), 18,480 ALM, and 49 K Logic Elements.
XC7K160T-1FBG484C: 8 CMT (MMCMx1+PLLx1), 600 DSP Slice, 11,700 Max Block RAM Bits, 100 Maximum user I/O pins (Board), 400 Maximum user I/O pins (Device), 2,188 Maximum Distributed RAM (Kb), 25,350 Slice, and 162,240 Logic Cells.
XC7K70T-1FBG484C: 6 CMT (MMCMx1+PLLx1), 240 DSP Slice, 4,860 Max Block RAM Bits, 100 Maximum user I/O pins (Board), 300 Maximum user I/O pins (Device), 838 Maximum Distributed RAM (Kb), 10,250 Slice, and 65,600 Logic Cells.
The XILINX XC6SLX16-2CSG225C: 576 K Total Block RAM bits, 56 Maximum user I/O pins (Board), 232 Maximum user I/O pins (Device), 136 K Maximum Distributed RAM bits, 14,579 Logic Cells, and 2,278 Slices.
XC7A100T-1FTG256C: 4,860 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 170 Maximum user I/O pins (Device), 1,188 Maximum Distributed RAM (kb), 101,440 Logic Cells, and 15,850Slices.
XC7A75T-1FTG256C: 3,780 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 170 Maximum user I/O pins (Device), 892 Maximum Distributed RAM (kb), 75,520 Logic Cells, and 11,800 Slices.
XC7A50T-1FTG256C: 2,700 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 170 Maximum user I/O pins (Device), 600 Maximum Distributed RAM (kb), 52,160 Logic Cells, and 8,150 Slices.
XC7A35T-1FTG256C: 1,800 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 170 Maximum user I/O pins (Device), 400 Maximum Distributed RAM (kb), 33,280 Logic Cells, and 5,200 Slices.
XC7A15T-1FTG256C: 900 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 170 Maximum user I/O pins (Device), 200 Maximum Distributed RAM (kb), 16,640 Logic Cells, and 2,600 Slices.
XC7S100T-1FGGA484C: 4,320 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 1,100 Maximum Distributed RAM (kb), 102,400 Logic Cells, and 16,000 Slices.
XC7S75T-1FGGA484C: 3,240 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 338 Maximum user I/O pins (Device), 832 Maximum Distributed RAM (kb), 76,800 Logic Cells, and 12,000 Slices.
XC7S50T-1FGGA48C: 2,700 Total Block RAM (kb), 56 Maximum user I/O pins (Board), 250 Maximum user I/O pins (Device), 600 Maximum Distributed RAM (kb), 52,160 Logic Cells, and 8,150 Slices.
Conclusion
The FTDI Basic is the most varied of all the chips. However, we can modify it (for example, by adding a “floating” pin), and it works with practically any USB device.
