RayMing manufactures and assembles high-density interconnect PCBs with blind, buried, and micro-vias, built-up laminations, and the highest signal integrity in the industry.
High-Density Interconnect (HDI) PCBs represent a cutting-edge approach to circuit board design and manufacturing. These advanced PCBs are characterized by their higher wiring density per unit area, allowing for more complex circuits in a smaller space. But what exactly sets HDI PCBs apart from traditional PCBs?
HDI PCBs are distinguished by several key features:
Finer Lines and Spaces: HDI PCBs typically have trace widths and spaces of 3 mils (0.076 mm) or less, compared to the 4-8 mils common in standard PCBs.
Smaller Vias: HDI boards use microvias, which are typically less than 150 microns in diameter.
Higher Connection Pad Density: HDI PCBs can support more than 200 pins per square inch.
Increased Layer Count: While traditional PCBs often have 4-8 layers, HDI PCBs can have 30 or more layers.
The unique structure of HDI PCBs offers several advantages:
HDI PCBs come in various structures, each suited to different applications and complexity levels. Let’s explore the most common HDI PCB structures.
The 1+N+1 structure is one of the most basic HDI configurations.
The 2+N+2 structure offers increased density and performance compared to the 1+N+1 configuration.
ELIC represents the pinnacle of HDI technology, offering the highest possible interconnection density.
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Choosing the right materials is crucial for the performance and reliability of HDI PCBs. The materials must meet stringent requirements for electrical, thermal, and mechanical properties.
Microvias are the cornerstone of HDI technology, enabling the high interconnection density that defines these boards. There are several types of microvias, each with its own characteristics and applications.
Designing HDI PCBs requires a different approach compared to traditional PCBs. Here are some essential tips for successful HDI PCB design:
Feature | RAYMING ´s HDI technical specification |
Number of layers | 4 – 32 layers standard, 56 layers advanced |
Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D |
Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
Copper weights (finished) | 18μm – 70μm |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.40mm – 6.50mm |
Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.15mm |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |
The manufacturing of HDI PCBs is a complex, multi-step process that requires precision and advanced technology. Let’s walk through each stage of the HDI PCB manufacturing process:
This complex, multi-step process ensures that HDI PCBs meet the high standards of quality and reliability required for their advanced applications. Each step is crucial, and manufacturers often have proprietary techniques to enhance the quality and efficiency of their HDI PCB production.
HDI PCB technology has found its way into numerous industries, enabling advancements in various applications. Let’s explore some of the key areas where HDI PCBs are making a significant impact:
As we look to the future, it’s clear that HDI PCB technology will continue to play a crucial role in the advancement of electronics across various industries. The ongoing trend towards miniaturization, coupled with the increasing demand for higher performance and functionality, ensures that HDI PCBs will remain at the forefront of electronic design.
Emerging technologies like 5G, artificial intelligence, and the Internet of Things are driving the need for even more advanced HDI PCB designs. We can expect to see further innovations in materials, manufacturing processes, and design techniques to meet these challenges.
The future may bring developments such as:
As HDI PCB technology continues to evolve, it will enable the next generation of electronic devices, from more powerful smartphones to advanced medical implants and beyond. Engineers and designers who master the intricacies of HDI PCB design and manufacturing will be well-positioned to create the innovative products of tomorrow.
In conclusion, HDI PCBs represent a critical technology that bridges the gap between the increasing demands of modern electronics and the physical limitations of traditional PCB design. By offering higher density, improved performance, and enhanced reliability, HDI PCBs are not just a current solution but a pathway to the future of electronics.