HDI PCB

HDI_Microvia_PCBs

HDI_Microvia_PCBs

 

HDI Microvia PCBs -HIGH DENSITY INTERCONNECT (Enquiry pls send to Sales@raypcb.com )

 

HDI boards, one of the fastest growing technologies in PCBs, are now available at RayMing Tech. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMing uses laser-drilled microvias electroplated with copper.

 

Special technologies used with HDI any-layer printed circuit boards:

 

Edge plating for shielding and ground connection
Minimum track width and spacing in mass production around 40μm
Stacked microvias (plated copper or filled with conductive paste)
Cavities, countersunk holes or depth milling
Solder resist in black, blue, green, etc.
Low-halogen material in standard and high Tg range
Low-DK Material for Mobile Devices
All recognised printed circuit board industry surfaces available

HDI PCB Technology Sheet

 

RayMing HDI PCB Structures:

1.  1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2.  i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3.  Copper filled stacked microvia structures are commonly seen in challenging designs.
4.  Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

 

RayMing HDI PCB Capabilities: Microvias PCB

A microvia maintains a laser drilled diameter of typically 0.006" (150µm), 0.005" (125µm), or 0.004" (100µm), which are optically aligned and require a pad diameter typically 0.012" (300µm), 0.010" (250µm), or 0.008" (200µm), allowing additional routing density. Microvias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper plated over the top or solid copper filled or plated. Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below.

 

Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used, however, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device, requires the use of Stacked MicroVias using an inverted pyramid routing technique.

 

Any PCB layer HDI

1. Multilayer copper filled stacked micro via structure
2. 1.2/1.2 mil line/space
4/8 mil laser via capture pad size
5. Material options:
High temperature FR4
Halogen - Free
High Speed (low loss)

HDI PCB

First Generation Microvias

1. Create routing density (eliminate through vias)
2. Reduce layer count
3. Enhance electrical characteristics
4. Standard Microvias limited to layers 1 - 2 & 1 - 3

 

Stacked MicroVias (SMV®) or Second Generation Microvias

1. Allows increased routing on multiple layers
2. Provides routing solutions for next generation applications
1 mm - 0.8 mm - 0.65 mm - 0.5 mm - 0.4 mm - 0.3 mm & 0.25 mm
3. Provides solid copper plate eliminating potential solder voiding
4. Provides a Thermal Management Solution
5. Improves Current Carrying Capability
6. Improves Current Carrying Capability
7. Provides a Planar surface for BGA (Via-in-Pad)

8. Allows any layer via technology

 

Deep Microvias  

1. Provide additional dielectric material & small geometry features.
2. Improved Impedance performance
3. Provides RF Microvia solutions
4. Provides a solid copper plate
5. Improves Current Carrying Capability & Thermal Management
6. Provides a Planar surface for BGA (Via-in-Pad)

 

Deep Stacked MicroVias 

 

1. Provides additional dielectric for RF applications
2. Maintains small geometries on multiple layers
3. Improved signal integrity
4. Provides a solid copper plate
5. Improves Current Carrying Capability & Thermal Management
6. Provides a Planar surface for BGA (Via-in-Pad)

 

 

HDI boards, one of the fastest growing technologies in PCBs, are now available at Rayming whatever PCB Prototyping or Express HDI PCB .HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

 

Find a HDI PCB Manufacturer and Supplier. Choose Quality HDI PCB Manufacturers, Suppliers, Exporters at RayPCB.com.Welcome to send your design to Sales@raypcb.com

PCB successfully added to your shopping cart