PCB Manufacturing

Advanced PCB manufacturing services, specializing in high-precision, high-difficulty, and special materials, serving industries such as scientific research, aviation, military, medical, robotics, and AI.

About Us

20 Years PCB Manufacturer

RAYMING PCB is a leading provider of cutting-edge printed circuit board manufacturing technologies, delivering the highest quality standards for the electronics industry. Our unwavering commitment to technological leadership drives us to continuously innovate and meet new design challenges.

Our state-of-the-art innovation lab and expert engineering team specialize in overcoming complex design hurdles, including:

  1. High Speed and High Capacity circuits
  2. RF and Microwave technology
  3. Thermal Management solutions
  4. Miniaturization techniques
  5. Chip package substrates

We offer tailored solutions for various industries, including 5G, AI Robotics, and Battery Management Systems (BMS). Our technical capabilities encompass:

  • HDI PCB ( Blind with Buried Vias)
  • Up to 100 multilayer PCB
  • Rigid-flex PCB
  • RF PCB (Rogers, Taconic…)
  • Heavy Copper PCB
  • Flexible PCB

RAYMING welcomes complex RFQs for cost estimation. We are proud to hold UL Certifications for our products:

  • Rigid PCB/Aluminum PCB: E472163
  • Flex PCB/Rigid-flex PCB: E544606
PCB Manufacturing Cost Calculator | RayPCB

PCB Instant Cost Calculator

Estimate your PCB manufacturing cost in seconds. For an exact quote, email sales@raypcb.com or Contact Us.

Rigid PCB

Standard FR4 PCB — the most widely used board for consumer electronics, industrial controls, and IoT devices.

Board Specifications
W
×
H
Surface Treatment
Green
Red
Blue
Black
White
Yellow
Process Options
Lead Time
24 Hours
48 Hours
3 Days
3–5 Days
7 Days
10–15 Days
RF/Rogers PCB

High-frequency Rogers, Taconic, Isola & PTFE substrates. Ideal for antennas, radar, 5G, mmWave, and satellite communications.

Board Specifications
W
×
H
Lead Time
3–5 Days
7 Days
10–15 Days
15–20 Days
Flex PCB

Polyimide (PI/Kapton) flexible circuits — 1 to 8 layers, ideal for wearables, medical devices, cameras, and compact assemblies.

Board Specifications
W
×
H
Material & Finish
Lead Time
3–5 Days
7 Days
10–15 Days
15–20 Days
Rigid-Flex PCB

Rigid + flex layers combined — eliminates connectors, reduces weight, and enables complex 3D assemblies for aerospace, robotics, and medical.

Board Specifications
W
×
H
Process Options
Lead Time
7 Days
10–15 Days
15–20 Days
20–25 Days
HDI PCB

High Density Interconnect with laser-drilled microvias (min 2.5 mil). Supports BGA pitch down to 0.20 mm and 4-N-4 build-up.

Board Specifications
W
×
H
Microvia & Process
Lead Time
3–5 Days
7 Days
10–15 Days
15–20 Days
Ceramic PCB

Al₂O₃, AlN, and BeO substrates for high-power LEDs, RF power amps, aerospace, and applications demanding superior thermal management.

Board Specifications
W
×
H
Material & Metallization
Lead Time
10–15 Days
15–20 Days
20–30 Days
Heavy Copper PCB

4–20 oz copper for EV BMS, power converters, industrial bus bars, and high-current distribution systems.

Board Specifications
W
×
H
Copper & Surface
Lead Time
3–5 Days
7 Days
10–15 Days
15–20 Days
Rigid PCB
ESTIMATED TOTAL COST
$—
Calculating…
$— / unit
Cost Breakdown
NRE / Setup Fee
Board Cost (10 pcs)
Subtotal
Lead Time Multiplier ×1.18
Total Estimate
⚠ Estimates are indicative only (±15–20%). Final pricing depends on DFM review, exact dimensions, and special requirements.
Email Quote — sales@raypcb.com Upload Files & Get Exact Quote
Quick RFQ: Email sales@raypcb.com with your Gerber files. Our team typically responds within 4 business hours.
File formats: Gerber RS-274X (preferred), .BRD (Eagle), .PCB/.DDB (Protel). Compress into .zip or .rar before sending.

Latest PCB Projects

5G TRX PCB

optical module PCB

Medical PCB

Rogers 4350B + Copper Base PCB

Hybrid PCB: Rogers 4350B + Copper Base PCB

32 layer PCB

32 Layer PCB Manufacturing with 6.5mm thickness, Motor EPC Application

Ceramic PCB

Ceramic PCB manufacturing with Step holes + bevelled edges process

Radar RF PCB

8 Layer 77 GHz millimeter wave radar, Material: Ro3000+IT180A

14 layer SSD PCB

14 Layer High TG FR4+ PI, 4 Step HDI PCB

E-band ODU RF Board

4 Layer 1oz E-band ODU RO4350+FR4 Hybrid PCB

Flexible PCB

2 Layer Flex PCB with PI & FR4 stiffener

Rogers 4350b pcb

Rogers 4350B PCB manufacturing, 0.8mm thickness

Rigid Flex PCB

6 Layer Rigid PCB , 2 Layer Flex PCB

PCB Manufacturing Capability

emsMassPrototypes
Layers1-18 Layers PCB1-56 Layers PCB
Max. Panel Size600*770mm( 23.62″*30.31″)600*770mm(23.62″*30.31″) 500*1200mm(19.69″*47.24″)
Max.Board Thickness8.5mm8.5mm
Min. Board Thickness2L:0.3mm2L:0.1mm
4L:0.4mm4L:0.3mm
6L:0.8mm6L:0.6mm
Min Inner Layer Clearance3mil3mil
Min Line width3/3 mil3/3 mil
Min Line space3/3 mil3/3 mil
Min.Hole Size0.1mm0.1mm
Min plated hole thickness25um25um
Min Blind/Buried hole size0.1mm0.1mm(1-18layers)
PTH Dia. Tolerance±0.076mm(±3mil)±0.076mm(±3mil)
Non PTH Dia. Tolerance±0.05mm(±2mil)±0.05mm(±2mil)
Hole Position Deviation±0.05mm(±2mil)±0.05mm(±2mil)
Heavy Coppe4OZ/140μm6OZ/175μm
Min S/M Pitch0.1mm (4mil)0.1mm (4mil)
Soldermask colourGreen,black,Blue,White,Yellow,RedGreen,black,Blue,White,Yellow,Red
Silkscreen colourWhite,Yellow,Red,BlackWhite,Yellow,Red,Black
OutlineRouting,V-Groove, Beveling punchRouting,V-Groove, Beveling punch
Outline Tolerance±0.15mm ±6mil±0.15mm (±6mil)
Peelable maskTop,bottom,double sidedTop,bottom,double sided
Controlled Impedance+/- 10%+/- 7%
Insulation Resistance1×1012Ω(Normal)1×1012Ω(Normal)
Through Hole Resistance<300Ω(Normal)<300Ω(Normal)
Thermal Shock3×10sec@288℃3×10sec@288℃
Warp and Twist≤0.7%≤0.7%
Electric Strength>1.3KV/mm>1.4KV/mm
Peel Strength1.4N/mm1.4N/mm
Solder Mask Abrasion>6H>6H
Flammability94V-094V-0
Test Voltage50-330V50-330V