RAYPCB / BARE-BOARD FABRICATION
PCB Manufacturing Services
Rigid multilayer, RF, HDI and flexible circuits—from fabrication files to finished bare boards.
Bring your stackup, critical features and quantity to RAYPCB. Define the material, manufacturing route and release requirements together, whether you need a prototype build or repeat production.
Ready to quote? Send board files + fabrication drawing + quantity. Add the stackup and any impedance or special-process requirements.
Choose your PCB manufacturing route
Start with the construction or build task. Each guide covers the relevant material options, design decisions and detailed capabilities. For populated boards, add component sourcing, assembly and test requirements to the fabrication scope.
| Manufacturing route | Decision to resolve | Start here |
|---|---|---|
| PCB prototype | Validate a first revision and prepare the fabrication release. | PCB prototype planning |
| Rigid FR-4 / multilayer | Define layer arrangement, copper, mechanical fit and the complete stackup. | Multilayer PCB |
| RF / microwave | Compare material families, dielectric construction, loss and manufacturing needs. | RF PCB materials & manufacturing |
| HDI | Review via structure, capture pads, filling and sequential lamination. | HDI PCB |
| Flexible circuits | Define flex layers, coverlay, reinforcement and motion duty. | Flexible PCB |
| Rigid-flex | Coordinate rigid regions, bend zones, transitions and layer continuity. | Rigid-flex PCB |
| Metal-core boards | Define heat flow, insulation and the appropriate metal-base construction. | Metal-core PCB |
| Ceramic substrates | Select the ceramic grade, metallization and electrical/thermal requirements. | Ceramic PCB |
Read capability limits as a complete construction
Layer count alone does not determine whether a board is straightforward to manufacture. Consider the hole span, copper weight, fine features and material together. Separate maximum and minimum values are not a qualified combination.
| Illustrative design question | What changes | Useful review |
|---|---|---|
| A small plated hole through a thicker board | The depth-to-diameter ratio increases. Agree whether the calculation uses drill or finished-hole diameter. | Calculate the geometry ratio |
| Fine spacing with heavier copper | Etch compensation and copper distribution affect the workable geometry. | Review rigid capability conditions |
| A mixed RF / FR-4 stackup | Bonding materials, thermal behaviour and dielectric requirements must work together. | Review the RF construction |
| A bend region carrying multiple layers | The flex thickness, reinforcement and motion duty need coordinated review. | Plan the rigid-flex regions |
Use the capability table as a review starting point. Match production category, layer construction, finished copper, hole span and measurement definition before comparing a limit. Send the tightest combined requirement with your drawing; numerical limits listed independently are not an approved stackup. The rigid PCB capability tables retain the detailed values and their conditions.
Prepare the fabrication package
- Fabrication outputs: copper, mask, legend, outline and drill data from the same released revision.
- Fabrication drawing: dimensions, tolerances, slots and mechanical details.
- Stackup: layer sequence, exact materials, copper weights and finished thickness.
- Special requirements: controlled impedance, via fill/cap, finish and agreed inspection or reporting.
- Commercial requirements: quantities, delivery target, panel preference and packaging.
Use a consistent fabrication revision. Ucamco’s Gerber format documentation is the official reference for Gerber outputs. Include drill data and a drawing; artwork alone may not express all manufacturing requirements.
Need populated boards as well? Continue to PCB assembly services and include the BOM, placement data and test requirements with the project.
Ready to place an order? The PCB order release checklist separates file approval, engineering changes and purchase authorization.
Put the critical requirements on the fabrication drawing
| Parameter | Specify in the RFQ | Why it matters |
|---|---|---|
| Stackup and finished thickness | Layer count, thickness target, dielectric arrangement and tolerances. | Electrical behaviour and mechanical fit depend on the complete construction. |
| Material | Exact laminate grade or a clearly defined, approval-based alternative policy. | A generic material-family label may leave important requirements undefined. For thermal exposure, review High Tg material selection. |
| Copper and features | Copper weights, critical trace/space features and finished-hole requirements. | Manufacturability depends on the combination, not a single minimum feature. For thicker conductors, review heavy copper design. |
| Impedance | Target, tolerance, reference layers and measurement requirements. | Trace width alone does not define a controlled-impedance structure. |
| Vias | Through, blind, buried or microvia construction; fill and cap requirements. | Drilling, plating and lamination choices must work together. |
| Finish and mechanical details | Surface finish, profile, slots, edge plating and panel requirements. | These details affect assembly, enclosure fit and subsequent processing. |
Send the actual stackup and feature combination for review. A maximum layer count and a minimum drill size listed separately do not establish that both are feasible on the same board.
For dense interconnects, prepare an HDI construction review. For a board that bends, define the rigid-flex stackup and bend regions before fixing the mechanical envelope.
PCB project examples
Examples from the RAYPCB product gallery. The preparation notes identify useful RFQ inputs for a similar project; the project-specific specification is agreed from your files.
RF project discussion: include the laminate grade, stackup and impedance targets.
Review RF manufacturing requirements
Module project discussion: identify the outline, critical interfaces and controlled stackup.
Review multilayer construction
Application discussion: specify the board acceptance and documentation your product requires.
Review quality documentationHow PCB manufacturing moves from data to a finished board
Follow the complete PCB manufacturing process for the detailed sequence, material-specific routes and inspection gates.
This is a conventional multilayer overview. Flex, ceramic, RF hybrids and HDI require their own qualified routes.
1. Review data and approve the construction
Check the fabrication revision, layer order, drill data and drawing. Resolve material substitutions and engineering questions before release.
2. Image, etch and inspect inner layers
Form the internal copper patterns and inspect the layers before they become enclosed in the multilayer construction.
3. Laminate and drill
Bond the approved layers, then create the specified mechanical or laser-drilled connections. HDI structures can require additional build-up cycles.
4. Prepare holes and form outer conductors
Prepare hole walls and establish copper connectivity, then image, plate and etch the outer circuitry as required by the selected process.
5. Apply mask, legend, finish and profile
Complete the solder mask, identification and specified finish; route or score the board outline. The exact finishing sequence depends on the construction.
6. Verify and release
Perform the agreed electrical and dimensional checks and any specified impedance or section analysis; associate release records with the delivered revision and lot.
See the factory equipment photographs below, then define the inspection and acceptance records required for your order.
Specify how the boards will be accepted
| Evidence or check | What it establishes | What to agree |
|---|---|---|
| Optical / dimensional inspection | Pattern and mechanical features accessible to the inspection method. | Critical dimensions, locations, tolerances and reporting. |
| Bare-board electrical test | Connectivity against the agreed reference netlist; this is not a powered product test. | Netlist source, test conditions, coverage and record format. |
| Impedance measurement | Impedance of the defined structure and measurement method. | Targets, tolerances, reference layers and coupon/report requirements. |
| Microsection / material records | Selected internal construction or material details. | Sampling, features, criteria, traceability and required evidence. |
For rigid boards, IPC-6012 and IPC-A-600 address qualification/performance and board acceptability. Specify the applicable standard, revision, class and additional requirements in the order. A standard reference does not by itself establish a particular certification or inspection scope.
Review quality assurance and PCB manufacturing equipment. Request the certificate scope and sample release records relevant to supplier approval, then define the manufacturing quality and acceptance records required with the shipment.
Review the quotation against one fabrication baseline
A useful manufacturing reply separates the construction being offered, any engineering questions and the commercial assumptions. Compare the returned stackup and exceptions with your drawing before approving a material change or a production release. A lower total can reflect a different finish, test report or delivery scope rather than a more efficient build.
Example: resolve a four-layer fabrication enquiry
ILLUSTRATIVE TEMPLATE — not a customer record, quotation or factory capability statement.
| Customer release | Response to request | Approval boundary |
|---|---|---|
| Drawing Rev B; 4 copper layers; thickness and tolerance stated | Identify the quoted file revision and proposed stackup, including material grades and finished copper. | The layer count alone does not approve the dielectric construction. |
| Controlled-impedance nets identified in the drawing | Return the proposed reference layers, any trace-width changes and the coupon/report scope. | Approve a geometry change before the artwork is released. |
| A plated finished hole dimension is specified | Keep finished hole, production drill selection and acceptance tolerance separate. | A suggested drill diameter must not silently replace the finished-hole requirement. |
| Quote 10 pieces now and 100 pieces of the same revision later | Separate setup, board quantities, special reports and delivery assumptions. | The later quantity is a comparison request, not an automatic purchase commitment. |
The response can list an item as quoted, excluded or awaiting a decision. For example, an alternate laminate awaiting your approval remains an open item; it is not a released substitution. Keep the approved answer with the fabrication revision so a repeat order does not inherit an undocumented change.
Before sending: identify the drawing revision, actual board outline and quantity first. Then list the few requirements that must not change and the decisions where engineering advice is welcome. You can send preliminary files directly; the optional budget above is not a condition for receiving a quotation.
PCB Manufacturing Cost Estimator
Use a standard rigid-board scenario to explore cost drivers, or prepare a specification for engineering quotation. The example coefficients are uncalibrated: they are not current market or RAYPCB prices. Special materials, complex structures and expedited requests need a project-specific quote.
PCB Manufacturing Cost Estimator
For specialty RF materials, use RF PCB material and cost planning. Supported rigid-board scenarios can carry quantity and a clearly labelled PCB budget to PCB Assembly; review-only scenarios carry quantity without a PCB price. Download and include the fabrication brief with the assembly RFQ.
Review your via geometry
Use the same units for via depth and diameter. This calculator compares the ratio against a limit you enter; it does not approve plating reliability or an HDI stackup. Replace the example limit with one agreed for your construction.
Worked example: if the agreed calculation uses a 1.60 mm depth and a 0.20 mm drill diameter, the ratio is 1.60 / 0.20 = 8:1. This is a geometry example, not an approved manufacturing limit. Finished hole size after plating is a separate drawing requirement.
Open the optional via geometry calculator
HDI Via Geometry Review
PCB product gallery
Explore the original RAYPCB board photographs. Use the construction table above to find the material or process requirements for your own design.
View 16 PCB product photographs
PCB Manufacturing Equipment
Original equipment photographs from the RAYPCB factory gallery, grouped from pressing and drilling to imaging, plating and finishing. Agree the actual process and release requirements for your construction.
Bonds the layers in a multilayer construction.
Produces the specified mechanically drilled features.
Transfers an outer-layer pattern to photoresist.
Develops the imaged resist pattern.
Plates copper in the selected process sequence.
Additional plating-line photograph from the gallery.
Images the solder-mask pattern.
Develops the solder-mask openings.
Cures the relevant coating or legend process.
Scores suitable panel separation lines.
Explore the PCB equipment page for the wider equipment context.
Engineering notes for fabrication
Multilayer stackup planning · Controlled impedance · PCB panelization
PCB manufacturing questions before requesting a quote
Should the stackup be reviewed before routing?
For controlled impedance, HDI and rigid-flex projects, reviewing the construction early helps avoid routing around unavailable dielectric thicknesses or incompatible via structures.
Can I request a different laminate to reduce cost?
State whether alternatives are allowed and who must approve them. Compare the properties relevant to the product, including electrical performance, thermal behaviour and processing requirements.
What sets the manufacturing lead time?
Material readiness, construction complexity, lamination steps, special processes, inspection and quantity affect the schedule. A delivery commitment needs a review of the actual fabrication package.
Does the fabrication quote include component assembly?
Identify whether you need bare boards or assembled boards. Assembly needs additional BOM, placement and test information and should be explicitly included in the project scope.
What is the difference between PCB manufacturing and assembly?
Manufacturing produces the bare circuit board. Assembly adds electronic components, soldering, programming and the agreed tests. Request both explicitly when you need populated boards.
What is included in the displayed manufacturing budget?
It is an illustrative bare-board scenario using example setup and board-cost coefficients. Components, assembly, shipping, tax and product-specific qualification are excluded. Exact pricing needs file review.
How can I reduce PCB manufacturing cost without changing performance?
Review unnecessary fine features, excessive copper or layers, panel usage and nonessential tolerances. Material and structural changes need design approval; never substitute solely on price.
Can I ask for help before the stackup is final?
Send the current layer count, thickness target, material needs and electrical or mechanical constraints. Mark open decisions so the quotation can state its assumptions.
How do prototype and repeat-production requirements differ?
A prototype may focus on design verification and unresolved features. A repeat build needs an approved revision, stable material and process requirements, and agreed lot and acceptance records.
Send the construction you need to manufacture
Include the board revision, fabrication files, drawing, quantity and requested delivery date. Identify the material, impedance, hole structure and mechanical requirements that cannot change. Preliminary projects are welcome for discussion—mark the open decisions.
Need a populated board? Add the BOM, placement file and test requirements for PCB assembly.