Request Rigid Flex PCB manufacturing quotation, Pls send PCB files to Sales@raypcb.com
| PCB attributes | Flex | Rigid-flex | |
| Min Layer Count | 1 | 1 | |
| Max Layer Count | 12 | ≤ 32 | |
| Min Core thickness | .001″ (.025 mm) | 3 oz (89 ml) | |
| Max Finished Copper Weight (I/L) | 2 oz (59 ml) | 3 oz (89 ml) | |
| Max Finished Copper thickness (O/L) | 12 micron (.012 mm) | 9 micron (.009 mm) (only for O/L) | |
| Max Panel Size | 12×18 | 12×18 | |
| Smallest Mechanical Drill Diameter | .0079″ (.201 mm) | .0071″ (.180 mm) | |
| Smallest Laser Drill Diameter | No | .005″ (.127 mm) | |
| Min Finished Hole Size | .006″ (.152 mm) | .006″ (.152 mm) | |
| Max through Hole Aspect Ratio | 10:1 | 10:1 | |
| Max Blind Via Aspect Ratio | .75:1 | .75:1 | |
| Min Trace and Space | ≥ .0035”(.089 mm) | ≥ .0035”(.089 mm)(rigid) | |
| Min Pad Size for Test | .016″ (.406 mm) | .005” (.127 mm) (rigid) | |
| Process Pad Diameter | D + .014″ (.356 mm) (1-mil (.025 mm) annular ring) | D + .014″ (.356 mm) (1-mil (.025 mm) annular ring) | |
| Stacked Vias | No | No | |
| Min Wire Bond Pad Size | > .006″ (.152 mm) | > .006″ (.152 mm) | |
| Controlled Impedance Tolerance | 10% | 5% | |
| Solder Mask Registration | Within .002″ (.051 mm) | Within .002″ (.051 mm) | |
| Solder Mask Feature Tolerance | .001″ (.025 mm) | .001″ (.025 mm) | |
| Solder Mask Min Dam Size | .004″ (.102 mm) | .001″ (.025 mm) | |
| Min Diameter Route Cutter Available | .019″ (.483 mm) | .024″ (.610 mm) | |
| Mechanical Routed Part Size Tolerance | .003″ (.076 mm) | .010″ (.254 mm) | |
| Bow and Twist Tolerance | N/A | As per spec | |
| Thickness Tolerance | +/- .002″ (.051 mm) | 10% | |
| Sequential Laminations | N/A | 2 | |
| Buried Vias | Yes | Yes | |
| Blind Vias | Yes | Yes | |
| Conductive Filled Vias | No | Yes | |
| Non Conductive Filled Vias | No | Yes | |
Rigid-Flex PCB Capabilities
RayMing’s rigid-flex PCB manufacturing capabilities represent an impressive blend of technological advancement and precision engineering. As a specialized rigid-flex PCB manufacturer, RayMing offers cutting-edge solutions that integrate rigid and flexible substrates into unified, three-dimensional circuit designs.
Layer Capacity
RayMing has continuously invested in research and development to enhance its manufacturing capabilities. The company has achieved remarkable milestones in rigid-flex PCB production:
- Up to 32 layers in rigid sections
- Up to 12 layers in flexible sections
- Capability to produce complex rigid-flex designs with various layer combinations
- Custom stackup configurations based on specific application requirements
This extensive layer capacity allows RayMing to accommodate highly complex circuit designs in compact, three-dimensional spaces, making them ideal for applications where space optimization is crucial.
Technical Specifications
RayMing’s rigid-flex PCBs are characterized by precise technical specifications:
- Line width/spacing: As fine as 3mil/3mil (0.076mm/0.076mm)
- Mechanical drilling: Down to 0.15mm
- Laser drilling: Down to 0.1mm
- Board thickness options: Customizable based on application requirements
- Copper thickness: Standard 1oz, with options for varying copper weights
- Material options: High-quality substrates including IT180A, AK, and other specialized materials
Material Excellence
RayMing utilizes premium materials for both rigid and flexible sections of their rigid-flex PCBs:
Rigid Sections:
- FR-4
- High-temperature FR-4
- Polyimide
- Rogers
- Arlon
- Teflon
- Taconic
- Specialized high-frequency materials
Flexible Sections:
- Polyimide
- Adhesiveless substrates
- Custom flexible materials based on application requirements
Manufacturing Process
RayMing’s manufacturing process for rigid-flex PCBs involves several sophisticated steps:
- Material Selection and Cutting: Precise preparation of rigid and flexible materials
- Layer Preparation: Individual layer processing with careful attention to detail
- Lamination: Integration of rigid and flexible sections using specialized techniques
- Drilling and Plating: Creation of vias and through-holes with high precision
- Pattern Transfer: Accurate circuit pattern application
- Etching: Controlled removal of unwanted copper
- Surface Finish Application: Options include ENIG, immersion tin, and other finishes
- Cutting and Shaping: Final forming of the board
- Creation of Score Lines: For later folding if required
- Rigorous Quality Testing: Ensuring peak performance and reliability
Stackup Configurations
RayMing offers various standard and custom stackup configurations for rigid-flex PCBs:
- 4-Layer Configurations: Typically featuring 2 rigid and 2 flex layers, suitable for simpler designs
- 6-Layer Configurations: Often with 4 rigid and 2 flex layers, balancing complexity and flexibility
- 8-Layer Configurations: With 4 flex and 4 rigid layers, offering high circuit density
- 10-Layer Configurations: Providing very high circuit density with optimized signal routing
- 12-Layer Configurations: Maximum circuit density for the most complex applications
Each stackup is carefully designed to balance factors such as signal integrity, mechanical stability, flexibility requirements, and thermal management.
Assembly Capabilities
RayMing provides comprehensive rigid-flex PCB assembly services, offering a complete solution from design to finished product:
- Component placement on rigid sections using advanced pick-and-place equipment
- Various soldering technologies including reflow, wave, and selective soldering
- Thorough cleaning processes to remove contaminants
- Comprehensive inspection using AOI, X-ray, and functional testing
- Optional conformal coating application for environmental protection
- Full turnkey services including component sourcing
Applications and Industry Solutions
RayMing’s rigid-flex PCBs are employed across numerous industries and applications:
Aerospace and Defense
- Ruggedized designs for extreme conditions
- High-reliability systems requiring minimal interconnections
- Compact avionics systems
Medical Devices
- Ultra-thin, biocompatible designs for implantable devices
- Patient monitoring equipment
- Diagnostic systems requiring high signal integrity
Consumer Electronics
- Smartphones and wearables
- Digital cameras and CCTV systems
- Compact consumer devices requiring 3D packaging
Automotive Electronics
- Vehicle camera systems
- Engine control units
- Dashboard electronics and infotainment systems
Industrial Control
- Factory automation equipment
- Robotic systems
- Instrumentation and measurement devices
Communications
- Telecommunication equipment
- Network infrastructure
- RF and microwave systems
Design Considerations and Support
RayMing provides comprehensive design support for rigid-flex PCB projects:
- Expert consultation on stackup design
- Material selection guidance
- Design for manufacturing (DFM) review
- Signal integrity analysis
- Thermal management solutions
- Mechanical stress and reliability analysis
RayMing’s engineering team works closely with customers to optimize designs for manufacturability, reliability, and cost-effectiveness.
Competitive Advantages
RayMing’s rigid-flex PCB capabilities are distinguished by several key advantages:
- Technological Leadership: Continuous investment in innovative manufacturing techniques
- Quality Assurance: UL certification and rigorous quality control processes
- Scalability: Capabilities ranging from quick-turn prototypes to volume production
- Comprehensive Services: From design assistance to turnkey assembly
- Cost-Effectiveness: Competitive pricing for both prototyping and production
- Customer Communication: Responsive service throughout the production process
Conclusion
RayMing Technology stands at the cutting edge of rigid-flex PCB manufacturing, offering advanced capabilities, exceptional quality, and comprehensive services. With its extensive experience, technical expertise, and commitment to innovation, RayMing provides reliable solutions for even the most challenging rigid-flex PCB applications. Whether for complex aerospace systems, miniaturized medical devices, or next-generation consumer electronics, RayMing’s rigid-flex PCB capabilities enable engineers to create sophisticated, space-efficient electronic designs that meet the demands of modern technology.
For specific inquiries or to request a quotation for rigid-flex PCB manufacturing, customers can contact RayMing directly at Sales@raypcb.com.