About Us
18 Years PCB Manufacturer
RAYMING PCB is providing the latest printed circuit board manufacturing technologies and highest quality standards for electronics industry. You can count on RAYMING to meet your needs. Pursuing technological leadership is the unchanging belief of RAYMING, and striving to build an innovation Lab and engineers Team to overcome new design challenges: High Speed and High Capacity, RF and Microwave, Thermal Management, Miniaturization, Chip package substrate.
We provide RF and Microwave Solution, High Speed and High Capacity, Thermal Management Solutions to 5G, AI Robotics, BMS… , our Technical ability: Mechanical Blind holes Backplane, 100 layers dobolue-side Crimping Backplane, Multifunctional integrated Copper Combined board, ODU RF Board, E-band ODU RF Board, BMS FPC Board, FPC Of car`s camera, Ultrasonic probe FPC Board, SSD FPC Board, Welcome to send high complext RFQs to estimate Cost .
RAYMING UL Certification:
Rigid PCB/Aluminum PCB — E472163
Flex PCB/ Rigid-flex PCB — E544606
Latest PCB Manufacturing Projects
Rogers 4350B + Copper Base PCB
Hybrid PCB: Rogers 4350B + Copper Base PCB
32 layer PCB
32 Layer PCB Manufacturing with 6.5mm thickness, Motor EPC Application
Ceramic PCB
Ceramic PCB manufacturing with Step holes + bevelled edges process
PCB We Served
- PCB By Materials
- PCB By Technical
- PCB By Application
- PCB By Layers
- PCB By Surface Finish
- PCB By Thickess
- PCB By Solder Mask
- PCB By Copper Thick
- Medical PCB
- Industrial PCB
- Military PCB
- NFC PCB
- Led PCB
- BMS PCB
- Robotics PCB
- IOT Device PCB
- Aerospace PCB
- Automotive PCB
- POWER PCB
- Measuring Equipment
- Telecommunications PCB
- Smart Home PCB
- Audio PCB
- Wearable pcb
- High Speed and High Capacity
- RF and Microwave
- Thermal Management
- Miniaturization
- Chip package substrate
PCB Manufacturing Capability
Specifications | Standard Specs | Custom Specs |
---|---|---|
Layer Count | 1 - 68 Layers | 100 Layers |
Turn Time | Same Day - 5 Day | Same Day - 4 Weeks |
Max. Size (Finish Size) | 600*770mm( 23.62″*30.31″) | Line-card: 850mmX570mm Backplane: 1320mmX600mm |
Drill Hole Diameter | 0.3mm | Mechanical: ≥0.15mm(6mil) Laser: 0.1mm(4mil) |
Materials | FR-4 | 1. High Speed: Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 2. High Frequency: Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 3. others: Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, |
Plate Finish | Lead-Free HAL* | Electrolytic Hard Gold / Soft Gold / ENIG / ENEIPIG/ Nickel / Immersion Silver / Leaded & Lead-Free HAL |
Cert. / Qualifications | IPC Class 2 - A600 | IPC6012 Class 2-3A / IPC6012 Class 3 DS/IPC6018 Class 3 MIL-PRF-31032 / MIL-PRF-55110 / ISO 9001:2008 / AS9100D / Others |
Board Thickness | .031" / .062" / .093" / .125" | Max 10mm(394mil)Sample 14mm(551mil) |
Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 - 4 oz. Inner / 1-30 oz. Outer |
Aspect Ratio (Finish Hole) | 10: 1 | Line-card: 20:1 Backplane: 25:1 |
Trace / Space | 4 / 4 Mils | Down to 2.2mil/2.2mil |
PCB Manufacturing knowledge
- Step by Step to Explain Printed Circuit Board (PCB) Manufacturing Process
- Tolerances on Printed Circuit Boards
- What is PCB Tab?
- How Do You Make a PCB Panel ?
- What is Prepreg in PCBs?
- What is PCB Scoring: Tools, Tolerance and Guideness
- Annular Ring Via: A Comprehensive Overview
- What is Half-Hole PCB
- What is Via Filling in PCB
- What is DRC PCB ?
- Bits,Machines and Process of PCB Drilling
- Process of Etching Solution for PCB
- How to Plan Multilayer PCB Stackup
- Brown oxide vs. black oxide, immersion tin processes for PCB
- What is a silkscreen on a PCB?
- What is Solder Mask
- The Essential Steps to Testing a PCB
- What are the different surface finishes in PCB?
- Final Quality Control (FQC) in PCB Manufacturing
- What You Need for PCB Packaging and Shipping