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RayMing’s HDI Stackup Capabilities

RayMing offers comprehensive HDI PCB manufacturing solutions for stackups ranging from simple to complex configurations. Their capabilities include:

1+N+1 Configuration

The simplest HDI stackup with one HDI layer on top, N standard core layers, and one HDI layer on the bottom. This configuration is suitable for designs requiring moderate density and complexity, such as BGA components with lower I/O counts. Common applications include cell phones, MP3 players, GPS devices, and memory cards.

2+N+2 Configuration

Features two HDI layers on top, N standard core layers, and two HDI layers on the bottom. This provides increased routing capabilities and higher component density. The 2+N+2 configuration accommodates BGAs with smaller ball pitch and higher I/O counts while maintaining a thin board profile. Typical applications include cell phones, PDAs, game consoles, and portable video recording devices.

3+N+3 Configuration

Offers even greater design flexibility with three HDI layers on top, N standard core layers, and three HDI layers on the bottom. This stackup is ideal for designs requiring high component density and intricate routing paths.

4+N+4 Configuration

Represents the pinnacle of HDI complexity with four HDI layers on top, N standard core layers, and four HDI layers on the bottom. This configuration is used for the most demanding applications, offering maximum routing capabilities and component density.

Any Layer HDI (ELIC – Every Layer Interconnect)

In this advanced HDI structure, all layers are high-density interconnection layers, allowing conductors on any layer of the PCB to be interconnected freely through copper-filled stacked microvia structures. This provides reliable interconnect solutions for highly complex, large pin-count devices such as CPU and GPU chips utilized in handheld and mobile devices.

Microvia Technology

Microvias are a defining feature of HDI PCBs, and RayMing has developed advanced capabilities in microvia fabrication:

Types of Microvias

• Blind Microvias: Connect an outer layer to one or more inner layers but do not extend through the entire board
• Buried Microvias: Internal connections that do not reach any outer layer of the PCB
• Stacked Microvias: Series of microvias placed directly on top of each other, connecting multiple layers
• Staggered Microvias: Offset from each other rather than stacked directly, requiring fewer processing steps
• Via-in-Pad: Microvias placed directly in component pads, allowing for higher routing density

Microvia Manufacturing Process

RayMing utilizes state-of-the-art laser drilling technology to create precise microvias with consistent quality. Their process ensures reliable connections between layers, with proper copper deposition and, when necessary, copper filling for stacked microvias.

Technical Specifications

RayMing’s HDI PCB manufacturing capabilities include:

• Trace Width and Spacing: Down to 3 mils (approximately 75 micrometers)
• Via Diameter: As small as 0.006 inches (approximately 150 micrometers)
• Aspect Ratio: Maintains industry-standard recommendations of 6:1 to 8:1 for through-hole vias
• Layer Count: Flexible configuration based on client requirements
• Surface Finishes: HASL, Lead-free HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Soft Wire Bondable Gold, and Hard Gold
• Solder Mask Colors: Available in various colors, including Red, Green, Black, Blue, and White

Manufacturing Process Excellence

RayMing’s HDI PCB manufacturing process incorporates several critical steps that ensure high-quality products:

1. CAM Processing: Transforms design data into manufacturing data through Computer-Aided Manufacturing
2. Core Fabrication: Creation of the standard inner layers of the PCB
3. Sequential Build-Up: Addition of HDI layers through a series of lamination, drilling, and plating processes
4. Copper Deposition: Controlled plating process to ensure an average of 25μm thickness through the holes, meeting IPC class 3 specifications
5. Quality Control: Multiple inspection points throughout the manufacturing process

Quality Assurance

As an ISO9001 certified PCB assembly house, RayMing operates under rigorous quality control procedures that ensure customer requirements are met at every stage of development. Their quality assurance system includes:

• First article inspection before proceeding to full production
• Open and short testing for all PCBs
• Advanced inspection equipment including AOI Testing, 3D AOI Testing, 3D SPI Testing, X-ray inspection, and In-Circuit Testing
• Strict supplier evaluation and yearly supplier assessment
• Comprehensive customer service team for responsive communication

Applications of RayMing’s HDI PCBs

RayMing’s HDI PCBs are used in various applications that require high performance in compact form factors:

• Smartphones and mobile devices
• Wearable technology
• Medical devices and equipment
• Automotive electronics
• Aerospace and defense systems
• IoT devices
• Consumer electronics
• High-speed networking equipment

Benefits of RayMing’s HDI PCBs

Choosing RayMing for HDI PCB manufacturing offers several advantages:

• Cost Efficiency: A 6-layer HDI circuit board can offer the same functionality as an 8-layer standard PCB, potentially reducing manufacturing costs
• Enhanced Reliability: Microvias provide better stability and reliability compared to larger through-holes
• Space Optimization: The use of blind, buried, and microvias decreases board space requirements
• Signal Integrity: Shorter connection paths improve signal quality and reduce electromagnetic interference
• Manufacturing Expertise: Years of experience in producing complex HDI designs ensures high-quality results

Conclusion

RayMing Technology has established itself as a reliable provider of advanced HDI PCB manufacturing services, offering comprehensive capabilities from 1+N+1 to 4+N+4 stackups and any-layer HDI solutions. Their technical expertise, quality assurance systems, and commitment to customer satisfaction make them an excellent choice for companies requiring high-performance HDI PCBs for today’s compact electronic devices.

As the electronics industry continues to demand smaller, lighter, and more powerful devices, RayMing’s HDI PCB manufacturing capabilities will remain at the forefront of enabling technological innovation. With continuous investment in advanced manufacturing processes and quality control, RayMing is well-positioned to meet the future challenges of HDI PCB design and production.