RAYPCB / Manufacturing specifications

Flexible PCB Manufacturing Capabilities

Check flexible layers, copper-dependent line spacing, coverlay, stiffeners, finishes and finished dimensions before releasing the flex drawing.

Multilayer flexible-circuit example from the RAYPCB product library.
Multilayer flexible-circuit example from the RAYPCB product library.
Flexible copper layers
1–12
Line / space at 0.5 oz
4 / 4 mil
Minimum hole
8 mil
Flex copper range
1/3–2 oz

Full process capability tables

Use the matching construction and production window. Dimensions, copper and via limits must be reviewed together; an extended capability is confirmed against the released drawing.

Capability tables (CSV)

Construction, laminate & stiffeners

Construction, laminate & stiffeners
ParameterSpecification
Layers — flexible1–12 layers
Layers — rigid-flex2–32 layers
Base materialPI / DuPont Kapton, PET, PEN; FR-4 for rigid regions or stiffeners
StiffenersFR4, aluminum, polyimide, stainless steel
Copper thickness1/3 oz – 2 oz

FR-4 is used for rigid regions or stiffeners; it is not a flexible base film. Rigid-flex total layers are included for comparison with the dedicated capability page.

Finished dimensions & insulation

Finished dimensions & insulation
ParameterSpecification
Max / min board sizeMinimum 0.2 × 0.3 in (5.08 × 7.62 mm); maximum 20.5 × 13 in (520.7 × 330.2 mm)
Final thickness — flexible0.002–0.1 in (≈0.05–2.54 mm); define each region
Final thickness — rigid-flex0.0024–0.16 in (≈0.06–4.06 mm); rigid-flex comparison range
Insulation thickness0.5–2 mil (12.7–50.8 µm)

State thickness by region: flexible circuit, connector area and any locally reinforced area. The overall range does not define bend-region thickness.

Copper-dependent geometry & holes

Copper-dependent geometry & holes
ParameterSpecificationApplication notes
Min. trace width / space0.5 oz: 4/4 mil · 1 oz: 5/5 mil · 2 oz: 5/7 mil
Min. annular ring0.5 oz: 4 mil · 1 oz: 5 mil · 2 oz: 7 mil
Min. hole size8 milConfirm drilling vs finished diameter, hole depth and material.
Hole tolerancePTH ±3 mil · NPTH ±2 mil
Min. slot24 × 35 mil (0.6096 × 0.889 mm)

Select the row for the actual copper weight. Minimum annular ring, hole diameter and trace clearance describe different dimensions.

Coverlay & marking registration

Coverlay & marking registration
ParameterSpecification
Solder-mask / coverlay alignment tol.±3 mil
Silkscreen alignment tol.±6 mil
Silkscreen line width5 mil

Coverlay openings and rigid-board solder mask have different fabrication steps. Mark their boundaries and tolerances separately.

Surface finish thickness

Surface finish thickness
FinishSpecification
Immersion Nickel / Gold (ENIG)Nickel 100–200 µin · Gold 1–5 µin
Gold plating (electrolytic)Nickel 100–200 µin · Gold 1–4 µin
Immersion SilverSilver 6–12 µin
Immersion TinAvailable
OSPFilm 8–20 µin

Specify the nickel and gold layers separately. Finish thickness ranges do not imply every construction meets every IPC finish specification.

Profile tolerance & electrical test

Profile tolerance & electrical test
ParameterSpecificationApplication notes
Profile tolerance (punch)Accurate mould ±2 mil · Ordinary mould ±4 mil · Knife mould ±8 mil · Hand-cut ±15 mil
Test voltageTesting fixture: 50–300 VElectrical-test setting; not rated operating voltage.

Choose the outline process on the drawing. Electrical-test voltage is a test setting, not the flex circuit’s rated operating voltage.

Engineering decisions before release

Static fold or repeated motion

Show the installed shape, bend zone, radius, direction and expected duty. Copper type and the complete flexible thickness govern the mechanical review.

Flex bend, thickness and budget workbench

Stiffeners & connector interfaces

Dimension the final connector thickness, stiffener material and adhesive. Keep reinforcement boundaries out of the intended bend.

Single-sided flex construction

Multilayer routing & assembly

Map continuous copper and the local coverlay openings. Add support, tooling and the assembly sequence where components are fitted.

Flex assembly preparation

Continue with design or budget planning

Flexible PCB manufacturing and design tools. Use the service-page tools for geometry or budget planning, or send your existing files directly for review.

Inspection evidence for your supplier review

Agree IPC-6013 for flexible / rigid-flexible board performance and IPC-A-600 for board acceptability, including revision, class and customer requirements. Request the relevant evidence against the part number and drawing revision.

IPC standards and their scope help separate manufacturing requirements from acceptance criteria.

  • Current ISO 9001 documentation and applicable UL file / construction scope for supplier qualification.
  • Approved drawing, material identification, lot traceability and agreed inspection records.
  • Dimensional, electrical-test and any specified coupon / microsection results.

Quality system and supplier documents · Inspection workflow · Equipment and process evidence

Inspection workbench — specify the inspection and mechanical checks required for your flex build.
Inspection workbench — specify the inspection and mechanical checks required for your flex build.

Flex PCB capability questions

What line and space should I use for flexible copper?

The listed combinations are 4/4 mil at 0.5 oz, 5/5 mil at 1 oz and 5/7 mil at 2 oz. Review finer geometry and bend-region routing with the actual stackup.

Does the thickness range include stiffeners?

Specify it explicitly in the drawing. A reinforced connector region and the free-flex bend region can have very different finished thicknesses.

Do these limits guarantee a bend-cycle lifetime?

Cycle life needs a defined radius, motion, copper, stackup and qualification test. A layer count or minimum thickness alone cannot establish it.

Send the drawing. Define the build.

Send what you have. Mark any requirement where you need an engineering recommendation, and identify the current revision.

  • Artwork, drill files and flexible / reinforced region drawing.
  • Copper layers, laminate, coverlay, adhesive and finished thickness by region.
  • Stiffener details, connector requirements, outline process and quantity.
  • Installed bend shape, static or dynamic duty, and required tests.

Ready for a manufacturability review?

Upload the files through Contact. The reply can define pricing, delivery, process exceptions and the agreed test scope.

Send files for an exact quote

sales@raypcb.com