Skip to content

Dupont PCB

dupont_PCB_Board

Dupont PCB ( Any Dupont PCB Enquiry Pls send mail to Sales@raypcb.com )

Electronics materials from a company with a deep understanding of materials science a commitment to technology leadership, a wide range of process expertise and a long history of innovation. DuPont offers the industry’s broadest array of high performance electronic materials. The portfolio includes materials for rigid and flexible circuits including: Kapton®, Pyralux®, Interra® and other advanced laminates.

Dupont HT

RayPCB is a leader in design and fabrication of HIGH TEMPERATURE APPLICATION FLEX CIRCUITS for use in industries such as Oil & Gas Exploration (“down hole”), Medical Instrument Sterilization (“autoclave survivability”); Engine Controls (“under hood”) and Automotive Brakes and Transmissions as well as many defense (aircraft, missile and vehicles) and space exploration applications.

RayPCB employs methodically developed process techniques along with DuPont’s new HT materials – copper clad laminate, coverlay and bondply – to fabricate state-of-the-art Flex Circuits which can operate at temperatures in excess of 250°C. The DuPont all-polyimide Pyralux HT material system have the highest temperature operating rating of any flex circuit material and provided with the long-standing quality and consistency that the industry has come value and expect from DuPont.

This proven interconnect solution gives the designer more options in solving electronic packaging challenges. With the ability to incorporate Flex Circuit and enjoy – in a high heat environment – the benefits of these three dimensional internconnects. Contact RayPCB for immediate discussion with an engineer to determine if this technology is right for your application.

“HT”, “Pyralux” and DuPont” are trademarks or registered trademarks of E. I. du Pont de Nemours and Company or its affiliates.

Dupont HT Datasheet

Dupont HT Datasheet

Dupont HT

Laminate Materials

Copper Clad Laminants

Pyralux® AC copper-clad laminate
Pyralux® AP copper-clad laminate
Pyralux® AP-PLUS all-polyimide thick copper-clad laminate
Pyralux® APR copper-clad resistor laminate
Pyralux® LF Copper-clad Laminate
Pyralux® FR copper-clad Laminate
Pyralux® TK flexible circuit material

Coverlay, Bondply & Sheet Adhesive

Pyralux® FR coverlay
Pyralux® FR bondply
Pyralux® FR sheet adhesive
Pyralux® LF coverlay
Pyralux® LF bondply
Pyralux® LF adhesive
Pyralux® LG Glass Reinforced Bonding Film
Pyralux® PC Photoimageable Coverlay

Except Dupont PCB, RayMing also offer Nelco PCB,Isola PCBArlon PCB manufacturing.

Dupont Pyralux series material

1. FR series has halogen bonding sheet (abbreviated as pure glue)

Product numberGlue thickness mil(um)Packing specificationApplication field
FR01001(25) 24in(W)*250ft
250mm*100m
FPC multilayer board, rigid board and soft-hard combined board interlayer composite
FR02001(51) 
FR03001(76) 
FR04004(102) 
FR15001/2(13)
FR15010.7(18)

2. LF series halogen-free adhesive sheet (abbreviated as pure glue)

Product numberGlue thickness mil(um)Packing specificationApplication field
LF01001(25) 24in(W)*250ft
250mm*100m
FPC multilayer board, rigid board and soft-hard combined board interlayer composite
LF02001(51) 
LF03001(76) 
LF04004(102) 
LF15001/2(13)
LF1501 0.7(18)

3.HXC series black cover film Coverlay

Product numberAdhesive ADH thickness mil(um)PI thickness (um)Packing specificationApplication field
HXC1215 0.6(15)  12249mm*200m
500mm*200m
The black epoxy type epoxy cover film designated by the Apple project has a shelf life of 4 months
HXC1220 0.8(20) 12
HXC12251(25)12
HXC25251(25) 25

4. FR series yellow cover film Coverlay (containing halogen)

Product numberAdhesive ADH thickness mil(um)PI thickness (um)Packing specificationApplication field
FR0110 1(25)  2524in(610mm)*
250ft(76m)
The general industrial yellow cover film has a higher flame retardant rating than the halogen-free LF series.
FR0120 1(25) 51
FR70011/2(13) 13
FR70131(25)  13

5.LF series yellow cover film Coverlay (halogen free)

Product numberAdhesive ADH thickness mil(um)PI thickness (um)Packing specificationApplication field
LF0110 1(25)  2524in(610mm)*
250ft(76m)
250mm*100m
Optical and industrial halogen-free yellow cover film, normal working temperature can reach 140°C
LF0120 1(25) 51
LF70011/2(13) 13
LF70131(25)  13

6. FR series Bondply (referred to as PI with glue on both sides, containing halogen)

Product numberAdhesive ADH thickness mil(um)PI thickness (um)Packing specificationApplication field
FR0111 1(25)  2524in(610mm)*
250ft(76m)
FR0121 1(25) 51
FR0131 1(25) 76
FR02122(51) 25
FR70211/2(13)1/2(13)
FR70161(25) 1/2(13)
FR7081 2(51) 1/2(13)
FR15151/2(13) 25

Application Field: Double-sided adhesive PI, Acrylic adhesive system, sealed and preserved at room temperature, applied to the inner layer of multi-layer boards and the inner layer of flexible and rigid boards, especially for the inner layer 2+2 structure, the laminated structure with etched lines on both sides, good Filling performance, optimizing the structure, while reducing the number of pressing

7.LF series Bondply (referred to as PI with glue on both sides, halogen-free)

ModelAdhesive ADH Thickness mil(um)PI(um)PackagesApplication Field
LF01111(25)2524in(610mm)*
LF01211(25)51
LF01311(25)76
LF02122(51)25
LF70211/2(13)1/2(13)
LF70161(25)1/2(13)
LF70812(51)1/2(13)
LF15151/2(13)25

Application Field: Double-sided adhesive PI, Acrylic adhesive system, sealed and preserved at room temperature, applied to the inner layer of multi-layer boards and the inner layer of flexible and rigid boards, especially for the inner layer 2+2 structure, the laminated structure with etched lines on both sides, good Filling performance, optimizing the structure, while reducing the number of pressing

8. HXN series ultra-thin yellow cover film Coverlay (epoxy type)

ModelAdhesive ADH Thickness mil(um)PI(um)PackagesApplication Field
HXN05100.4(10)5250mm*200m
500mm*200m
Epoxy type ultra-thin cover film, special for LCM module, good flexibility
HXN05150.6(15)5
HXN08100.4(10)8
HXN08150.6(15)8

Adhesive base FR (halogen)\LF (halogen free)

1.FR series single-sided plastic substrate (containing halogen)

ModelCu OZ/ft2(um)Adhesive (um)PI(um)PackageApplication Field
FR9110R1(35)252524in(610 mm)*The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical
FR9120R1(35)255136in(914 mm)
FR9130R1(35)2576
FR9150R1(35)25127

2. FR series double-sided adhesive substrate (containing halogen)

ModelCu OZ/ft2(um)Adhesive (um)PI(um)PackageApplication Field
FR9111R1(35)252524in(610 mm)* 36in(914 mm)
FR9121R1(35)2552
FR9131R1(35)2576
FR9222R2(70)25127

Application Field: Double-sided adhesive substrate, working temperature up to 140°C, mainly used in industrial, optoelectronic, automotive, medical and aerospace

3.LF series single-sided plastic substrate (halogen-free)

ModelCu OZ/ft2(um)Adhesive (um)PI(um)PackageApplication Field
LF9110R1(35)252524in(610 mm)* 36in(914 mm)
LF9120R1(35)2551
LF9130R1(35)2576
LF9150R1(35)2551

Application field: The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical

4.LF series double-sided adhesive substrate (halogen-free)

ModelCu OZ/ft2(um)Adhesive (um)PI(um)PackageApplication Field
LF9111R1(35)252524in(610 mm)* 36in(914 mm)
LF9121R1(35)2551
LF9131R1(35)2576
LF9222R2(70)2551

Application Field: The industrial type has a plastic substrate on one side, and the normal working temperature can reach 140°C. It is mainly used in industrial, photoelectric, automotive, and medical

5.Glue-free substrate

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
AC121200EM/R12(1/3)1212(1/3)250mm*100m 500mm*100m
AC122000EM/R12(1/3)2012(1/3)
AC182000EM/R18(1/2)2018(1/2)
AC182500EM/R18(1/2)2518(1/2)
AC181200EM/R18(1/2)1218(1/2)
AC352500EY/R35(1.0)2535(1.0)
AC354500EY/R35(1.0)4535(1.0)

Application Field: Single-sided non-adhesive substrate for consumer electronics, applied to ordinary single-sided and multi-layer soft boards

6.AK series double-sided adhesive-free substrate (HTE copper)

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
AK121212EM12(1/3)1212(1/3)500mm*100m
AK121812EM12(1/3)1812(1/3)
AK122512EM12(1/3)2512(1/3)
AK125012EM18(1/2)5018(1/2)
AK182518EM18(1/2)2518(1/2)
AK185018EM18(1/2)5018(1/2)

Application Field: Double-sided adhesive-free substrate for consumer electronics, high ductility electrolytic copper, applied to the inner layer of ordinary double-sided boards and rigid-flex board, with good expansion and shrinkage stability

7.AK series double-sided adhesive-free substrate (HA copper)

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
AK122512RY12(1/3)2512(1/3)250mm*100m 500mm*100m
AK182518RY18(1/2)2518(1/2)
AK185018RY18(1/3)5018(1/2)

Application Field: Double-sided adhesive-free substrate for consumer electronics, HA high ductility rolled copper, applied to the inner layer of ordinary double-sided boards and rigid-flex board, with good bending performance

8.KP series double-sided adhesive-free substrate

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
KP122512E12(1/3)2512(1/3)250mm*100m
500mm*100m
KP182518E18(1/2)2518(1/2)250mm*100m
500mm*100m

Application Field: LCD, LCM, TP, camera module and consumer electronics application substrate, good expansion and contraction stability, within 3%% after heat treatment in TD direction, and within 5%% in MD.

9. AP series double-sided adhesive-free substrate

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
AP8515R18(1/2)2518(1/2)24in(610mm)*
36in(914mm)
AP8525R18(1/2)5118(1/2)24in(610 mm)*
18in(457mm)
AP9111R1(35)251(35)24in(610mm)*
12in(305mm)
AP9121R1(35)511(35)12in(610mm)*
AP9131R1(35)761(35)18in(457mm)

Application Field: Industrial double-sided non-adhesive substrate, normal working temperature can reach 180°C, transmission speed can reach about 10GHZ, mainly used in industrial, photoelectric module, automobile, medical, aerospace

10.Pyralux® JT Coverfilm and Bonding Material

ModelPI(um)Material characteristicsPackage
JT2525Polyamideimide material, normal working temperature can reach 150°24in(W)*250ft
JT5050

11. Pyralux® HT Coverfilm and Bonding Material

ModelPI(um)Material characteristicsPackage
HT010025The normal working temperature can be resistant to 225°; high temperature press is required for pressing, and the temperature is above 300°24in(W)*250ft
HT704938
HT020050
HT030075

12. HT series industrial high temperature resistant substrate

ModelCu OZ/ft2(um)Adhesive (um)Cu OZ/ft2(um)PackageApplication Field
HT8515R18(1/2)2518(1/2)24in(610mm)*
36in(914mm)
HT8525R18(1/2)5118(1/2)24in(610mm)*
18in(457mm)
HT9111R1(35)251(35)24in(610mm)*
12in(305mm)
HT9121R1(35)511(35)12in(610mm)*
18in(457mm)

Application Field: Full polyimide series double-sided adhesive-free substrate, the soft board material with the highest temperature resistance today, working temperature can reach above 225°C, high bonding force, excellent insulating layer thickness uniformity and electrical properties