The Introduction of CCL(Copper Clad Laminate)
With the development of light, thin, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed boards are getting higher and higher, power consumption is getting larger and larger, therefore, the heat dissipation requirements for PCB substrates are getting more urgent than before. if the heat dissipation of the substrate is not good, the components on the printed circuit board will be overheated, which will reduce the reliability of the whole machine. Against this background, a high heat dissipation metal PCB substrate was born.
The most widely used metal-based PCB substrate is an aluminum-based copper clad laminate. The product was invented by Japan's Sanyo National Policy in 1969 and was applied to the STK series of power amplifier hybrid integrated circuits in 1974. In the early 1980s, China's metal-based copper clad laminates were mainly used in military products. At that time, metal PCB substrate materials were completely dependent on imports and were expensive. In the mid-to-late 1980s, with the extensive use and dosage of aluminum-based copper clad laminates in automotive and motorcycle electronic products, the development of metal PCB substrate research and manufacturing technology in China and its fields in electronics, telecommunications, power, etc. Wide range of applications.
Representative foreign metal substrate manufacturers include Sumitomo(Japan), Panasonic(Japan), DENKA HITY PLATE Company, and American Begs. There are three series of Sumitomo Metal PCB substrates (ie, aluminum-based copper clad laminates, iron-based copper clad laminates, and silicon steel clad laminates). Aluminum-based copper clad laminates, iron-based copper clad laminates, and silicon steel clad laminates are sold under the trade names ALC-1401 and ALC-1370, ALC-5950, and ALC-3370 and ALC-2420, respectively. The earliest manufacturer of metal-based copper clad laminates in China was the state-owned No. 704 factory. In the late 1990s, many units in China also developed and produced aluminum-based copper clad laminates. The metal substrate of the 704 factory has three series, namely aluminum-based copper clad laminate, copper-based copper clad laminate, and iron-based copper clad laminate. The aluminum-based copper clad laminates of the 704 factory are divided into three types according to their characteristics: general-purpose and high-heat-dissipation type and high-frequency circuit. The commercial grades are MAF-01, MAF-02, MAF-03, copper substrate and iron substrate. The product grades are LSC-043F and MSF-034, respectively. According to estimates, the global metal-based PCB production value is about 2 billion US dollars, Japan's metal-based PCB production value was 2.5 billion yen in 1991, 6 billion yen in 1996, and increased to 8 billion yen in 2001, about 13% per year. The speed is increasing.
Since then, with the invention and application of integrated circuits, the miniaturization and high performance of electronic products have promoted the further development of CCL technology and production. The Buildup Multilayer technology has developed rapidly, and a variety of new substrate materials such as resin-coated copper foil (RCC) have emerged.