With the continuous development of the Internet, pcb is an important electronic component, and now pcb boards are widely used in electronic products. Every time we complete the pcb design board, the control of its production cost is very important. So how do you reduce the manufacturing cost of PCB boards?
The semiconductor manufacturing process consists of wafer fabrication, wafer testing, chip packaging, and post-packaging testing. Wherein a plurality of chips are fabricated on a single wafer, and individual chips are cut and packaged. Many of the same tooling, material, and panel size constraints are also present in the PCB manufacturing industry.
First, printed circuit board size design impact on cost
The original size of the copper plate is too large, inconvenient to process, and sometimes can not be processed in the printed circuit board processing equipment, so it needs to be first cut into several pieces of processing size copper plate. As for the specific size of the processing size, it is determined according to the processing equipment for manufacturing the printed circuit board, the size of each printed circuit board, and some process parameters. In addition to the length and width required for the printed circuit pattern itself, these process parameters include the width of the screw holes for fixing the printed circuit board on the electronic product frame, the process allowance for the shape processing, electroless plating, plating and corrosion. The holding amount of the clamp, the amount of positioning pin when the multilayer printed circuit board is used, the amount of registration mark between the layers, the mark of the printed circuit board manufacturer, the width of the printed circuit board, etc. , among which Some process parameter recommendations can be obtained from the copper plate manufacturer or distributor. When the printed circuit is produced and processed, it can be determined according to the above data whether the copper plate of a large original size is cut into a number of processed copper plates, whether it is longitudinally cut or horizontally cut, or can be set.
Second, the impact of the number of printed circuit boards on the cost
As the number of layers of the printed circuit board increases, the manufacturing cost increases sharply, so there is a possibility that the cost difference is greatly different due to the difference in the mind. If you are having trouble designing a 6-layer printed circuit board, don't give up, maybe the big economic benefits are in your persistent efforts; however, it is not easy to make it difficult, because when In this case, in most cases, the designer may not hesitate to choose to design an 8-layer printed circuit.
Third, CEM-3 materials
The double-sided copper clad used in the production of double-sided printed circuit boards, in addition to the widely used double-sided epoxy glass cloth copper plate, there is also a low-cost CEM-3 material, which is constructed with the original double-sided In the epoxy resin glass cloth copper plate, the thick epoxy resin glass cloth as the substrate is changed into two very thin sheets. At this time, due to insufficient strength, a ring is sandwiched between the two sheets of epoxy glass cloth. Oxygen glass nonwovens, which reduces costs. The material has a soft texture and can be used as a core material for a multilayer rigid printed circuit board, in addition to being used alone.
Fourth, the ratio of the line width of the conductor pattern to the gap width affects the cost
If the width of the conductive pattern in the printed wiring board is represented by L and the width of the gap between the conductor patterns is represented by S, the LIS represents the ratio of the width of the conductive strip to the width of the gap. As this ratio decreases, the production yield of the printed circuit board will drastically decrease and the cost will increase. This phenomenon is more pronounced in the case of higher circuit density. Therefore, you must not arbitrarily reduce the value of LIS.
Fifth, the aperture of the through hole affects the cost
In the case of drilling a printed circuit board with a drill bit, when the hole diameter is lower than a certain value, the drilling depth of the drill bit is sharply shortened. That is to say, when a hole is drilled in the same way, when the hole having a small hole diameter is drilled, the drill bit needs to be taken out for heat dissipation many times, so that the production efficiency is lowered and the cost is increased. Therefore, do not arbitrarily reduce the aperture of the through hole; and also reduce the number of through holes as much as possible.
- Filling the through hole with silver paste
For the through hole of the double-sided printed circuit board, the copper-plated method is used to realize the communication between the two-sided circuit, and the method of filling the through-hole with the silver paste is also adopted, and the cost of the double-sided printed circuit board can also be reduced.