If you are looking for a Laminate with the following characteristics, you have come to the right place. The Rogers TMM 10i laminate is available with the following specifications: Dk = 10, Dissipation Factor = 0.002, Thermal coefficient of resistance (Td) = 425 degC, and thickness in inches. This laminate is also resistant to creep flow, low-cost, and high-performance.

Low dissipation factor

The Dissipation Factor (Dk) of Rogers TMM 10i Laminate is 0.002, and its thermal conductivity is more than double that of traditional PTFE laminates. This material comprises a layer of TMM bonded to brass or aluminum and covered with electrodeposited copper foil. It is available in three standard thicknesses – TMM 3, TMM 4, and TMM 10i.

The high dielectric constants of Rogers TMM laminates provide excellent mechanical and electrical performance. Rogers DiClad laminates are also available with low dielectric constants but don’t incorporate cross-plied constructions. These laminates also offer low dissipation and are often used in high-frequency applications and radomes.

A low dissipation factor of Rogers TMM 10i laminates is essential for microwave circuits. It prevents heat buildup and helps maintain good wire bonding. In addition, this material is highly resistant to high temperature and high humidity, and resistant to creep flow. These properties make it an excellent choice for many RF and microwave applications. In addition, they offer Rayming PCB & Assembly the electrical and mechanical properties to design their devices.

Unfortunately, some PCB designs don’t factor in production costs. This can significantly increase the cost of Rogers PCB substrates. For example, they are switching from a double-layer design to a four-layer one, which doubles the cost of Rogers TMM 10i laminate.

Another essential characteristic of Rogers TMM 10i laminate is its high Dk value. It can handle the highest frequencies and is best suited for high-frequency applications. Compared to FR-4, it has a wide range of Dk values. The Rogers material is also temperature stable. It also offers the lowest loss in high-frequency applications. Aside from a low Dk value, it is an excellent option for high-frequency circuits.

Isotropic dielectric constant

The isotropic dielectric constant of Roger TMM 10i laminate is low, allowing for high thermal conductivity. This material is bonded to brass or aluminum plates and covered with an electrodeposited copper foil. It is available in TMM 3, TMM 4 and TMM 10i laminates. Among its properties, this laminate has a low thermal coefficient of expansion. Its low thermal expansion coefficient and low etching shrinkage make it a good choice for microwave applications.

The Isotropic dielectric constant (Dk) of Rogers TMM 10i laminate is 10. It has a high Dissipation Factor of 0.002 and a thermal coefficient of 19. This means that it supports plated through holes. These dielectric properties are ideal for a variety of electronic applications. However, it is essential to note that the Dk value may vary slightly from one product to another.

Rogers TMM thermoset microwave laminate is a versatile material with a low thermal change rate. It is an excellent choice for high-reliability microstrip and stripline applications. It has many advantages over alumina filler materials in terms of processing, such as accommodating larger copper clad specifications and maintaining tight tolerances. These properties make it an excellent choice for microstrip, stripline, and chip tester applications.

A new generation of microwave circuits is made possible with TMM10, a composite of ceramic and PTFE materials. Its dielectric constant is low – typically 30 ppm/degC – which closely matches copper’s thermal expansion. It also has low etch shrinkage values, making it ideal for applications requiring high reliability. The TMM10i laminate is also twice as thermally efficient as traditional PTFE/ceramic laminates.

Resistant to creep flow

A typical PCB substrate is composed of an FR-4 material, a glass fiber/epoxy composite with copper foil laminated on one side. The FR-4 material offers a good balance between cost and manufacturability and good electrical and thermal properties. Rogers also offers cores and laminates with better high-frequency properties, which are more expensive than fiberglass. However, these laminates offer a lower thermal coefficient.

TMM thermosetting microwave laminates offer the advantages of ceramics and PTFE with a low thermal change rate. They are excellent for high-power applications and have low thermal expansion coefficients. Their low etch shrinkage values and high dielectric constants make them excellent choices for power amplifiers, filters, and couplers. They are also suitable for high-reliability microstrip and stripline applications.

Cost

Among the benefits of Rogers PCB laminates is their superiority over standard FR-4 material. However, if you consider purchasing Rogers laminates for your printed circuit boards, you should ensure that you are working with a top-notch manufacturer. RayMing PCB and Assembly Company can provide excellent printed circuit board assembly and manufacturing services. These experts will assist you throughout the design and fabrication process.

The process of putting copper layers on the Rogers TMM 10i laminate involves the application of a pattern plating. Then, a circuit pattern is electroplated. This process requires less copper for the anode bank and reduces the amount of copper removed during the etching process. This helps reduce the overall cost of the substrate. To make the most out of Rogers TMM 10i laminate, you need to understand the difference between a single-axis edge-plated and a multiple-axis margin plated.

While both materials have similar characteristics, the differences between the two materials are apparent in their Dk values. The TMM 10i laminate is more conductive than the TMM 10, with a Dk of -0.01 on the z-axis at 10 GHz. It also has an extremely low thermal coefficient of 19.0 ppm/degC. As a result, it costs less than Rogers TMM 10i laminate.

Another factor affecting the cost of Rogers TMM 10i laminate is the number of layers in the multilayer design. Moving from four layers to six layers would cost fifty percent more. Switching from two to four layers would be equivalent to a hundred percent increase. The surface finish also plays a role in determining the overall cost of Rogers TMM 10i laminate. Specific surface finishes have higher grades, while others provide a long shelf-life but increase the cost of the Rogers laminate in general.

Conclusion

Rogers TMM 10i laminate’s special formula includes several synthetic materials and the common PTFE. Its high dielectric constant provides electromagnetic interference (EMI) reflection suppression, while its low thermal change rate makes it a good choice for high-reliability applications. It offers many advantages compared to alumina filler materials in processing and can accommodate larger copper-clad specifications and maintain tight tolerances. In addition, they come with low thermal coefficients, which provide high reliability in HV transmission. As a result, the TMM 10i laminate is an excellent choice for microstrip, stripline, and chip tester applications.

The cost of Rogers TMM 10i laminate depends on the frequency it is being used at. A high-frequency PCB needs a laminate with a high CTE, and a higher Dk will produce smaller printed circuit boards. In addition, High-frequency PCBs usually require the use of FR-4 material. Rogers TMM 10i laminate is best for such high-frequency applications. If you are considering a Rogers TMM 10i laminate, you may want to consider the advantages it can provide you.

RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that we can process like FR-4. It is a high-strength, lightweight composite made of polyphenylene sulfide (PPS) for advanced performance at a low cost. It has an extension co-efficient of -0.112%/C, with a heat deflection temperature below 260°C and good adhesion to metal and other base materials.

This product offers many benefits like:

Outstanding strength at high temperatures ranges from -40°C to +200°C.

Low Cost $4.98/sq.ft (in 2010)

Able to be machined and drilled using ordinary metalworking tools.

This article will discuss the processing of this material about the benefits and provide electrical performance data for this material over various temperatures, humidity levels, and frequencies. In addition, a discussion of the properties, cost, and durability of RO4360G2 will also take place in this paper.

Composition and properties

Rogers RO4360G2 is a composite of crystalline PPS as its matrix and colloidal silica powder as its reinforcing phase. The crystals are rod-like particles approximately 7 nm in diameter. Silica has a melting point of 478°C, making it brittle and not easily machined. As with most semiconductors, the PPS matrix is an insulating material. However, the large density of minuscule crystal particles gives the material a high dielectric constant.

Wet density Dry density Tensile strength (psi) Tensile strength (MPa) Expanded thickness (in.) at 100% elongation temperature (°C) Density @ operating temperature% Hysteresis loss (%) Dielectric constant for P-N junction % Dielectric constant at rated frequency (GHz) Dielectric loss factor @ rated frequency Thermal conductivity k< 0.3°C/cm k > 0.3°C/cm at ambient °C

The dielectric constant of this material is very high at 7.5, which can lead to problems in the design of electrical components using this material. However, all plastics have very low dielectric constants, ranging from 5 for polyethylene (PE) to 11 for polystyrene (PS). The high dielectric constant of this material comes from the crystalline nature of PPS. We enhance it by the silica addition contained in it.

The thermal conductivity of this material is non-linear and ranges between 0.3 and 1.1 k/cm at ambient temperatures. Therefore, the dielectric loss for this material is moderate at about 12%, with a frequency of 100 MHz. The dielectric loss factor at high frequencies is a problem associated with any dielectric material and gets more severe as the temperature increases. However, the thermal conductivity values are excellent and stay relatively constant from 0°C to 100°C. This increase in thermal conductivity at higher temperatures compensates for the loss factor values and helps keep this material from overheating.

Dielectric loss vs. frequency

This material can be machined, drilled, and soldered using ordinary metalworking tools. It is not advisable to use acids, solvents, or other chemicals. This material should work in conjunction with a PEMF device to aid in the healing of cuts and abrasions and improve its durability.

This material’s cost per square foot was $4.98 in 2010 and has been very stable in price over the past few years, despite rampant price increases in other polyphenylene sulfides (PPS).

Durability

This material has excellent durability when used with PEMF as part of a treatment program. As a result, we can use it as a platform for implanted electronic components fabricating electronic packaging, antennas, and RF shielding enclosures. In addition, several pieces of this material have been exposed to air at 90% relative humidity (RH) over one year with no effect on its electrical or physical properties.

The material is essential in various applications, including electrical connectors, wiring harnesses, RF applications, heat sinks, and electronic packaging.

Environmental protection

This material does not have to be heat treated because it has a very high thermal stability of about 90°C/hr. It can also withstand high radiation levels and impact through its excellent insulation properties.

The strength and durability of this material are excellent in the range of -40 to +200°C. The dielectric property of this material also makes it a good choice for applications requiring its dielectric properties at temperatures over 100°C. However, it is not as good as high-temperature thermoplastic polymers (TPUs) for these applications. Nevertheless, we can use it in low-temperature applications to +60°C.

The electrical properties of this material are quite stable, with temperatures over the range of -40°C to +70°C, which makes it an ideal material for use in any connector or switch. In addition, its high dielectric constant leads to better electrical properties at higher temperatures and frequencies. The cost of this material is moderate but still below $7/sq.Ft currently, compared to prices ranging from $15-30+ for other materials.

Plated through-hole reliability

This material is essential in a variety of applications for through-hole soldering. We can use it in most solder processes and provides good adhesion. It has a wide temperature range and can withstand temperatures up to 180°C, making it useful for any fillet or spring soldering process. We can also use it for through-hole lamination.

It could be helpful as a low-cost substrate for high-temperature/high-frequency surface mount devices. We can use it to make electrical components and wire harnesses currently underused. Its wide temperature range and strength make it useful for many applications in corrosive environments where its physical properties are needed more than its dielectric properties. Its strength and dielectric properties allow it to help as a sacrificial laminate in tough environments.

The durability of this material has a rate of 150°C/hr, which is typical for a PPS. It is also resistant to oxidation and requires no special treatment or coating. In the last five years, there have been no major changes to the cost of this material, with prices staying between $6-7/sq.ft, which makes it very economical compared to other materials in its class.

Efficient supply chain

This material is a product of St. Gobain. It has approximately 60% of the world market share for PPS and controls over 80% of the PEMF market. Having a single dominant supplier has allowed certain economies of scale to be taken advantage of over the years, which has kept pricing on this material constant while other materials have had huge price increases during that time.

Rayming PCB & Assembly also controls the market for polycarbonate, one of its main competitors in the PPS market. Polycarbonates require four times as much energy to produce per unit mass as PPS, and they are significantly more expensive. Polycarbonates are also highly susceptible to environmental influences, leading to a loss in strength over time and requiring special treatment to maintain their integrity. This can result in increased costs and added time for processing applications.

Automated assembly compatible

This material has good mechanical properties, which allows for automated assembly processing and pick and place operations.

This material produces electrical connectors, wire harnesses, PCBs, and switch components. It is also an excellent platform for electronic components such as sensors, transistors, and other electronic assemblies.

We can plate it using solder paste or selective soldering (explosive or thermal) processes and easily soldered using conventional surface mount equipment. It is also helpful in several other applications, such as RF shielding enclosures, heat sinks, and electronic packaging.

This material has good mechanical properties and processed using a variety of processes. They include hot-melt extrusion, spraying, cutting, and embossing. It can also be injection molded.

It has a very high dielectric constant, holding its dielectric properties over a wide temperature range.

Conclusion

Rogers RO4360G2 is ideal if you want an inexpensive functional, and durable material to use in your next product. Rogers RO4360G2 is a very popular material for making medical devices, Aircraft Electronic Fixtures, and many other applications. It is available in an open-cell material with a U-type cross-section. Its dielectric constant of 60 indicates that it has excellent electrical properties. In addition, its high tensile strength and excellent oxidation resistance make it suitable for many types of electronic assemblies.

Introduction to RT/Duroid 5880LZ

RT/Duroid 5880LZ is a ceramic-filled, PTFE composite material manufactured by Rogers Corporation for use in high frequency circuit boards and microwave components.

Some key facts about RT/Duroid 5880LZ:

• Belongs to the RT/duroid 6000 series of high frequency laminates
• Features a dielectric constant of 1.96 at 10 GHz
• Enables performance up to mmWave frequencies
• Low loss material suitable for exacting circuit applications
• Uses a filler system to achieve properties and performance
• Utilized in designs from HF to Ku band and above

With its optimal electrical and mechanical properties, RT/duroid 5880LZ allows circuits to achieve excellent gain and low insertion loss even at millimeter-wave frequencies. In this article, we examine RT/Duroid 5880LZ in more detail including its properties, applications, key benefits, and usage guidelines.

Dielectric Composition

Rogers RT/duroid 5880LZ is a filled, ceramic-PTFE composite dielectric material, consisting of:

• PTFE (Polytetrafluoroethylene): This provides the basic matrix and gives the material is low dielectric constant. PTFE offers high strength and flexibility along with heat and chemical resistance.
• Ceramic filler: This is a proprietary formulation of ceramic particulate blended with the PTFE. The filler system enables the dielectric properties while also enhancing thermal and mechanical performance.
• Glass reinforcement: Glass microfibers are added for improved dimensional stability and temperature coefficient of expansion (CTE).

The composition results in a flexible circuit material that is lightweight and easily fabricates while delivering electrical performance beyond conventional PTFE. The material offerings include prepreg, laminates, bondply, and cable dielectrics.

Dielectric Properties

The dielectric properties of Rogers RT/Duroid 5880LZ that make it suitable for high frequency applications include:

• Dielectric constant (Dk): 1.96 ± 0.02 @ 10 GHz
• Dissipation factor (Df): 0.0019 @ 10 GHz
• Dielectric strength: > 1.6 kV/mil (> 63 kV/mm)

The low and stable dielectric constant over frequency allows for tighter circuit layouts and high frequency operation. The low loss tangent means more of the transmitted signal is retained as it passes through transmission lines, striplines, and other circuit elements. High dielectric strength enables thinner laminates and improved power handling.

Key Material Benefits

Rogers RT/Duroid 5880LZ offers several benefits that make it advantageous for engineers to design high frequency PCBs and components:

• Extremely low loss for optimal circuit efficiency up to mmWave bands
• Lightweight with outstanding dimensional stability
• Allows miniaturization of circuits with thin laminates
• Good thermal conductivity for power handling
• Low moisture absorption for reliable electrical performance
• Excellent CTE match to common metal platings
• Simple machining and fabrication
• RoHS compliant and lead-free
• Enables circuits to achieve wider bandwidths

Typical Applications

RT/Duroid 5880LZ is well suited for the following typical applications:

• Wireless infrastructure antennas and filters
• Military phased array radar and communications
• Satellite communications and telemetry
• Automotive radar transceivers
• Point-to-point backhaul radios
• Test and measurement equipment
• 5G equipment and mmWave antennas

The low loss, dimensional stability, and fabricability make it an optimal choice where every dB of loss matters. circuits operating from L through Ku band and beyond benefit the most from 5880LZ’s properties.

Available Product Forms

Rogers offers RT/Duroid 5880LZ in the following product formats:

Prepreg

• 5880LZ reinforced prepreg
• Available on various glass styles
• Multiple resin content options
• Rolls or panel forms

Laminates

• Double-sided clad sheets
• Thicknesses from 0.005″ to 0.125″
• Rolls or panel sizes
• One ounce ED copper standard

Bondply

• Adhesive bonded multilayer material
• Alternating dielectric and double-sided copper layers
• Eliminates press cycles for multilayer boards

Wire and Cable

• Coaxial and multi-conductor cables
• Semirigid and flexible constructions
• Custom cable solutions

Key Properties Data

Below table summarizes the key properties of RT/Duroid 5880LZ laminates:

Property	Value	Test Method
Dielectric Constant (Dk)	1.96 ± 0.02	IPC-TM-650 2.5.5.5 Clamped Stripline
Dissipation Factor (Df)	0.0019	IPC-TM-650 2.5.5.5
Dielectric Strength	1.6 kV/mil min	IPC-TM-650 2.5.6.2
Volume Resistivity	1 x 10^15 Ohm-cm	IPC-TM-650 2.5.17
Surface Resistivity	5 x 10^15 Ohm-cm min	IPC-TM-650 2.5.17
Coefficient of Thermal Expansion (CTE)	13	IPC-TM-650 2.4.24
Thermal Conductivity	0.69 W/mK	ASTM C518
Moisture Absorption	<0.02%	IPC-TM-650 2.6.2.1
Density	2.2 g/cm3	ASTM D792
Hardness	50 (Shore D)	ASTM D2240
Flexural Strength	27.6 ksi	IPC-TM-650 2.4.4
Tensile Modulus	540 ksi	ASTM D638
Compressive Modulus	12.7 ksi	ASTM D695
Peel Strength	6.5 pli	IPC-TM-650 2.4.8
Shear Strength	750 psi	IPC-TM-650 2.4.8
Glass Transition Temperature (Tg)	280°C	IPC-TM-650 2.4.24

Design and Layout Guidelines

To achieve optimal circuit performance on RT/Duroid 5880LZ, designers should follow these PCB layout recommendations:

• Maintain line width/spacing ratio of ≥ 0.5
• Use smaller traces and spacing at higher frequencies
• Include a continuous ground plane whenever possible
• Minimize number of laminate cuts and material discontinuities
• Watch for resonance points and avoid narrowband designs
• Use impedance matching, coupling andtransitions as needed
• Add more power supply filter –ing as frequency increases
• Allow sufficient distance between circuits and board edges
• Carefully model losses as frequency increases

Fabrication and Assembly

RT/Duroid 5880LZ laminates can be easily fabricated using conventional PCB processing techniques:

• Imaging: Photolithography, laser direct imaging
• Etching: Ammoniacal or cupric chloride etchants
• Plating: Electrolytic and electroless copper plating
• Solder mask: Liquid photoimageable or dry film
• Silkscreen: Epoxy and UV ink compatible
• Automated routing, milling, drilling processes
• V-scoring for snap separation of circuits

For best results, refer to the IPC specifications together with the RT/duroid fabrication guidelines published by Rogers Corporation.

Solder assembly can be done using standard surface mount and through-hole component attachment processes. Rogers recommends 250°C as the maximum soldering temperature for most applications.

Availability and Costs

RT/Duroid 5880LZ material is available directly from Rogers Corporation or through their global network of distributors. It is offered in panel sizes up to 18 x 24 inches and 24 inch wide master rolls.

Being a premium microwave material, RT/Duroid 5880LZ costs more than standard FR-4 laminates. However, it enables far superior performance for demanding high frequency applications. Volume discounts may be available for qualified customers.

Comparing to Other Microwave Materials

There are several other PTFE-based microwave laminate options for high frequency designs besides RT/Duroid 5880LZ:

RT/Duroid 5870

• Similar ceramic-filled PTFE material
• Slightly higher dielectric constant of 2.33
• Better for broader bandwidths

RT/Duroid 6002

• Pure PTFE with Dk of 2.94
• Excellent dimensional stability
• Lower cost alternative

Rogers RO3000 Series

• Woven glass reinforced ceramic/PTFE
• Dk options from 3.0 to 10.2
• Provides good balance of cost and performance

Rogers RO4000 Series

• Filled hydrocarbon ceramic laminates
• Dk of 3.38 to 3.55 for optimal high frequency use
• Low cost, high yield

Each material has different trade-offs between frequency coverage, loss, cost, and fabricability. 5880LZ provides the best overall combination at mmWave bands.

Rogers Corporation Company Profile

Rogers Corporation (NYSE: ROG) is a global leader in engineered materials solutions. Founded in 1832 and headquartered in Chandler, Arizona, Rogers develops advanced materials for mission-critical applications in electrification, 5G infrastructure, connected mobility, clean energy and more.

Rogers invented the first circuit materials that enabled the growth of modern electronics. RT/duroid® materials launched in 1958 were the world’s first ceramic-filled thermoset fluoropolymer circuit materials. Today, Rogers’ advanced circuit materials enable the performance, reliability and density demands of evolviny technologies.

Some key facts about Rogers Corporation:

• 2021 sales of $974 million with 49% in Advanced Connectivity Solutions
• Over 200 patents on advanced materials technologies
• Operations in Asia, Europe and the Americas
• Major R&D centers in the USA, Belgium, China and Germany
• Employs over 3,500 people worldwide

In addition to circuit materials, Rogers offers specialized components for EVs/HEVs, wireless infrastructure, rail and clean energy applications through its EMS division. The company also produces engineered foams and composites for automotive and industrial markets.

Conclusion

Rogers RT/Duroid 5880LZ gives engineers a high performance microwave dielectric to achieve low loss circuits through mmWave frequencies. The ceramic-filled PTFE composite enables stable dielectric properties, tight dimensional control, excellent circuit fabrication, and rugged reliability.

With its precisely engineered filler system, 5880LZ achieves the optimal balance of electrical performance and mechanical stability needed for today’s cutting-edge wireless, radar and satellite communication systems. It allows maximum utilization of available bandwidth while overcoming losses that limit conventional materials.

As high frequency circuits push to 40 GHz and above, RT/Duroid 5880LZ will continue enabling next-generation microwave PCB innovations well into the future through its industry-leading low loss, consistency and fabrication strengths.

Frequently Asked Questions

Here are some common questions about RT/Duroid 5880LZ answered:

Q: What is the dielectric constant of RT/Duroid 5880LZ?

A: RT/Duroid 5880LZ has a dielectric constant of 1.96 ± 0.02 at 10 GHz. This low, stable dielectric constant enables excellent performance up to mmWave frequencies.

Q: What are some typical applications for 5880LZ material?

A: Typical applications include wireless infrastructure, radar and satellite communications, automotive radar, test equipment, and 5G mmWave. Its low loss and stability suits it for applications where circuit efficiency is critical.

Q: Does Rogers 5880LZ require special fabrication processes?

A: No, standard PCB manufacturing processes like imaging, etching, drilling/routing can be used. Rogers provides guidelines for optimal results based on IPC standards.

Q: What copper foil types are used with 5880LZ laminates?

A: One ounce electrodeposited or rolled copper foil is typically used. Other foil weights up to 4 oz. copper are optionally available.

Q: What is the difference between RT/duroid 5880 and 5870 materials?

A: RT/duroid 5880LZ has a lower Dk of 1.96 while 5870 has a Dk of 2.33. 5880LZ achieves lower loss for mmWave, while 5870 offers wider bandwidths.

Rogers 4003C is a popular radio frequency (RF) circuit board laminate material designed for high frequency applications up to gigahertz frequencies. This article provides an in-depth look at 4003C material properties, key electrical and physical characteristics, design considerations, and datasheet parameters that engineers need to know when using this versatile microwave substrate.

Overview of Rogers 4003 Material

The Rogers Corporation 4003C laminate is a ceramic-filled thermoset PTFE composite reinforced with microfiber glass fabric. It was engineered to meet the demands of high frequency analog and digital circuits operating up to frequencies as high as 3GHz.

Some key properties that make 4003C suitable for microwave PCBs include:

• Stable dielectric constant of 3.55 +/- 0.05
• Low dissipation factor of 0.0027
• Tight dielectric tolerance for impedance control
• High thermal conductivity of 0.71 W/m/K
• Low z-axis coefficient of thermal expansion (CTE)
• Lead-free assembly compatibility
• UL 94 V-0 flammability rating
• Excellent dimensional stability
• High strength and moisture resistance
• RoHS compliant materials

Ro4003c achieves an optimal balance of electrical performance, mechanical integrity, and ease of fabrication for RF applications. Next we’ll look at the 4003C datasheet specs in more detail.

Rogers 4003C Datasheet Parameters

Here are some of the key parameters and characteristics provided on the Rogers 4003C datasheet for PCB design and fabrication:

Parameter	Value
Dielectric Constant (εr)	3.55 +/- 0.05
Dissipation Factor	0.0027
Volume Resistivity	>1×10^14 ohm-cm
Surface Resistivity	>5×10^13 ohms
Dielectric Strength	>1.5 kV/mil
Loss Tangent	0.0009 (2.5GHz)
Z-Axis CTE	60 ppm/°C
XY CTE	17 ppm/°C
Tg	280°C
Td	340°C
Thermal Conductivity	0.71 W/m/K
Moisture Absorption	<0.2%
Copper Peel Strength	1 lb/in
Lead-Free Process	260°C

These properties make 4003C suitable for controlled impedance RF circuits through microwave frequencies. We’ll look at some of the key parameters in more detail.

Dielectric Constant and Loss Tangent

The dielectric constant of 4003C is 3.55 with tight tolerances of +/- 0.05. This allows circuit designers to engineer precise, consistent impedances across fabricated boards.

The low loss tangent of 0.0027 (at 10GHz) ensures signals propagate through 4003C PCBs with minimal attenuation. Loss increases gradually with frequency but remains below 0.005 up to 3GHz.

Thermal Performance

Rogers ro4003c provides excellent thermal conductivity at 0.71 W/m/K in the z-axis. This allows heat to dissipate in the dielectric layer which helps maintain signal integrity and component life at high power levels.

The moderate z-axis coefficient of thermal expansion (CTE) of 60 ppm/°C provides good reliability under temperature cycling to reduce risks of trace fractures.

Lead-Free Assembly Compatibility

4003C laminates withstand the 260°C soldering temperatures required for lead-free electronics assembly. The material remains stable through multiple reflow cycles without electrical or mechanical degradation.

Microwave/RF Design Capability

With its stable electrical properties and tight tolerances, 4003C enables fabrication of controlled impedance transmission lines and passive networks that function consistently through microwave frequencies up to several GHz.

The low loss tangent allows complex RF circuits with many lamination layers to avoid excessive signal loss.

4003C Material Grades

Rogers offers several variants of 4003C tailored for different applications:

• 4003C for general RF/microwave use up to 3GHz
• 4003C-AP for automotive applications
• 4003C-2 (double clad) for stripline impedance layers
• High frequency laminates above Rogers ro4003c for mmWave

Consult Rogers for guidance selecting the optimal 4003C grade for your particular cost, performance and reliability requirements.

Design Considerations Using Rogers 4003C

Here are some key design practices engineers should follow when working with Rogers 4003C material:

• Use impedance calculators like Saturn PCB Toolkit to determine stripline dimensions
• Select laminate thickness to achieve target impedance
• Model discontinuities like stubs, vias, bends in traces
• Include power and ground plane effects in impedance models
• Account for frequency-dependent Dk variations
• Limit glass weave skew to under 5 degrees
• Watch for resin starvation, voids and thickness variations
• Allow for Dk tolerance when budgeting impedances

Paying attention to these factors is necessary to achieve repeatable RF performance that matches simulations.

Typical Applications of Rogers 4003C

Some examples of products using Rogers 4003C laminates include:

• RADAR systems
• Radio transceivers
• Wireless infrastructure
• High speed data links
• Test and measurement equipment
• Broadband amplifiers
• Medical imaging equipment
• Automotive sensors
• Aerospace avionics

4003C is commonly used in wireless and industrial electronics operating up to several GHz where low cost, high performance circuit materials are needed.

Comparison to Other Popular RF Laminates

Parameter	4003C	RO4350B	RO3003	Taconic RF-35
Dielectric Constant	3.55	3.48	3.0	3.5
Loss Tangent	0.0027	0.0037	0.0013	0.0019
Dk Tolerance	±0.05	±0.05	±0.04	±0.05
Lead-Free Process	260°C	280°C	288°C	260°C
Thermal Conductivity	0.71 W/m/K	0.69 W/m/K	0.69 W/m/K	0.35 W/m/K
Cost	Medium	Medium	Low	Low

Ro4003c provides a good balance of cost and high frequency performance.

Availability of Rogers 4003C Material

As one of Rogers’ most popular laminates, 4003C is well-stocked by authorized distributors worldwide. Common inventory includes:

• 0.005” to 0.125” dielectric thicknesses
• Reinforced and non-reinforced cores
• Isola 370HR resin system
• 1⁄2, 1, and 2 oz. electrodeposited copper foils
• Glass fabric styles 1035, 2113, 3313
• Sheets and panel sizes up to 18” x 24”

Work closely with your PCB supplier to ensure adequate material availability and lead times for your prototype through production needs.

FQA about Rogers 4003C Laminates

What is the dielectric constant of Rogers 4003C?

Ro4003c has a stable dielectric constant of 3.55 +/- 0.05 tolerance across a wide frequency range up to gigahertz frequencies.

Can Rogers 4003C withstand lead-free soldering temps?

Yes, Ro4003c remains stable through lead-free assembly reflow profiles up to 260°C and multiple soldering cycles.

What are some typical applications for Rogers 4003?

4003C is commonly used for RF circuits in wireless communications, RADAR, medical and test equipment and other applications up to 3GHz.

Does Rogers 4003C laminate meet UL flammability ratings?

Rogers 4003C achieves a UL 94 V-0 rating for flame resistance to meet safety requirements.

What is the loss tangent of Rogers 4003C at 5GHz?

The loss tangent of 4003C at 5GHz frequencies is approximately 0.0035 which provides good low loss microwave performance.

Conclusion

With its controlled dielectric constant, low loss, thermal performance, and stability, Rogers 4003C laminate has become a popular PCB substrate for high frequency RF and microwave circuits through multi-GHz frequencies. Careful modeling of transmission lines, discontinuities, and plane effects is necessary to achieve impedances and performance that match simulations. When designed properly, Rogers 4003C enables consistent, repeatable RF PCB performance across prototyping through volume production for wireless, aerospace, defense and industrial electronics applications.

Rogers RO4533 is a ceramic-filled laminate strengthened with glass hydrocarbon-based materials. This laminate offers good mechanical and electrical properties that make them ideal for antenna designs. Rogers RO4533 laminates belong to the 4500 series. This circuit material offers a lot of advantages which makes it well suited for use over a wide range of frequencies.

Rogers RO4533 is specifically designed for high-speed and high-performance applications. These laminates meet the requirements of antenna designers. The low dielectric characteristics and thickness tolerance are some of its great benefits.

Due to the low loss performance and the controlled dielectric constant of these laminates, they are well suited for microstrip antenna applications. These laminates also offer passive intermodulation response, a great feature that meets the requirements of the antenna industries. RO4533 laminates are compatible with lead-free solder processing.

Properties of Rogers RO4533

RO4533 laminates feature great mechanical, thermal, and electrical qualities that make them useful in several applications. Some of these properties will be discussed below;

Low dielectric constant: The dielectric constant measures the capacity of a material to store energy in an electric field. Rogers RO4533 has a dielectric constant of 3.3 at 10GHz /23°C. A low dielectric constant material is desirable in the antenna market. Materials with low dielectric constant don’t break down easily when exposed to intense electric fields.

Excellent Coefficient of thermal expansion: The coefficient of thermal expansion of this material is measured at 13 and 11 ppm/°C in the X and Y-axis respectively. The CTE of a PCB material describes how it expands in response to a change in temperature. Rogers RO4533 has a low CTE, which implies that this material can be used in any type of temperature.

High thermal conductivity: Thermal conductivity measures the capacity of a printed-circuit-board material to transfer heat. The thermal conductivity of Rogers RO4533 is measured at 0.6 W/m/K. This thermal property meets the requirement for antenna-grade laminates.

Low moisture absorption: The rate at which Rogers RO4533 laminates absorb moisture is very low. Its moisture absorption is measured at 0.02%. These laminates can withstand a humid environment. Typically, PCB materials’ rates of moisture absorption are lower than 0.2%.

Dissipation factor: The dissipation factor of Rogers 4533 is 0.0025 at 10GHz/23°C. This measure shows the loss rate of energy due to the inherent properties of a material. These laminates have an efficient insulator system since their dissipation factor is low.

Exceptional dimensional stability: The dimensional stability of Rogers Ro4533 is less than 0.2mm/m. This shows that the size of this material remains the same even when it is exposed to high temperatures.

Benefits of Rogers 4533

Rogers RO4533 laminates provide the electrical and thermo-mechanical qualities required by antenna designers. These laminates offer a lot of benefits to users.

Cost-effective option: Rogers RO4533 is a cost-effective option for antenna designers. It is a better alternative to PTFE antenna technologies which enables designers to optimize the performance of their antennas.

RoHS compliant: PCBs that are RoHS-compliant are the ideal option for antenna designers. Rogers RO4533 is RoHS compliant, which means that this material complies with the standard provided by RoHS.

Environmentally-friendly: This laminate is lead-free process compatible and halogen-free. It is also flame-retardant making it safe for the environment.  

Thermoset resin system: The resin system of Rogers Ro4533 laminates are fabricated to offer the properties suitable for ideal antenna performance.

Other benefits include:

• More yields on bigger panel sizes
• Improved handling and long life span when used with thin materials
• Low PIM performance
• Offers excellent PTH reliability
• Exceptional passive intermodulation response for antenna applications

Rogers RO4533 Applications

Rogers RO4533 laminates offer stable and reliable electrical and mechanical properties ideal for use in applications such as;

• WiMAX antenna networks
• Cellular infrastructure base station antennas

Processing and Fabrication Guidelines for RO4533

Rogers RO4533 circuit materials come with a reverse treat copper foil. This construction helps to minimize conductor loss and boost PIM performance while using the thermo-mechanical and electrical dielectric characteristics of the resin system. RO4533 laminates are not designed for multilayer use.

Surface pre-clean: To avoid surface oxidation, the panels should undergo a micro-etch before processing.

Entry/exit material: To reduce copper burns, entry and exit materials should be rigid and flat. Aluminum and composite boards are good entry materials.

Maximum stack height: The material’s thickness drilled shouldn’t exceed 70% of the flute length.

Deburring: Nylon brush scrubbers can be used to deburr RO4533 circuit material

What to Consider when Choosing Rogers RO4533

When choosing Rogers RO4533, certain factors should be considered. These factors are discussed below;

Application requirements: Different applications require different properties. You should consider if Rogers RO4533 properties are compatible with the application you want to use it for. This is a very important factor you should consider first.

 Material thickness: The dielectric thickness of your material is very important since this material features great thickness tolerance.

Availability: Ensure Rogers RO4533 is available in large supply. You can confirm from your product supplier.

Type of copper clad: This laminate comes in different copper foil options. Although most applications use the standard EDC foil, the LoPro reverse-treat copper can also be an option

Installation space size: You should be aware of the size of the space you intend to install your Rogers RO4533. This will help you choose the ideal size for your application.

Frequently Asked Questions

What determines the price of Rogers RO4533?

Different factors like thickness and size, cost of freight, electrical and mechanical properties, copper thickness, type of cladding material, and special requirements determine the price of Rogers RO4533

How can RO4533 be stored?

The storage conditions of RO4533 will determine the storage period. This material can be stored in ambient conditions for an indefinite period. However, it is important you avoid conditions that may result in mechanical damages. Note that storing these materials under corrosive environments will reduce their lifespan.

Conclusion

Rogers RO4533 materials are high-performance laminates designed by Rogers Corporation. These materials are fabricated to meet the demands of the antenna industries. Rogers RO4533 laminates are compatible with FR-4 and lead-free solder processing. The mechanical and electrical properties of these laminates are exceptional.