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What is Rogers RT/Duroid 5880LZ ?

Rogers RT/duroid 5880LZ is a lightweight laminate with low water absorption and excellent chemical resistance. This material is ideal for applications requiring high performance while minimizing weight. In addition, its low density and multilayer capability allow for high performance, even in demanding environments. Here are the main benefits of this laminate. Read on to find out how it can benefit you! And don’t forget to check out the full list of specifications!

Low water absorption

The RT/duroid 5780LZ was developed using a material engineered for low water absorption. Its dielectric constant is 10.2, and its loss tangent at ten GHz is 0.0028. In addition, this high-performance material has excellent chemical resistance. So, if you’re looking for a high-quality, low-cost circuit board for your spacecraft, the Rogers RT/duroid 5880LZ is perfect.

The RT/duroid 6002 laminate has a PTFE dielectric and is statistically oriented to maximize fiber gain in end-use and circuit producer applications. In addition, these laminates have the lowest dielectric constant among Rogers products. As a result, they are ideal for high-frequency/broadband applications. And since we manufacture these devices in highly humid environments, they have a low water absorption.

Despite its low water absorption, the Rogers RT/duroid 5780LZ laminates are highly resistant to moisture. As a result, low water absorption makes them ideal for RF applications, while RT/duroid 5880 laminates are suitable for millimeter-wave and microstrip circuits. As a result, RT/duroid 5780LZ materials are much more cost-effective than their predecessors.

Low water absorption on Rogers RT 5780LZ PCBs helps them stay dry in various environments, while FR4 PCBs retain moisture. Their low water absorption makes them ideal for military radar and microwave communication systems. They also have excellent mechanical and electrical properties and are easy to metalize. And they are also resistant to heat and water, making them ideal for aerospace applications.

Excellent chemical resistance

The RT/duroid 5880LX material from Rogers has excellent chemical resistance. Its dielectric constant is low, and its CTE is 31 ppm/degC. Its density is 2.2 grams per cubic centimeter. Consequently, this laminate is a good choice for applications requiring high chemical resistance. Although there are other types of laminates on the market, this one has excellent chemical resistance.

The RT/duroid 5880LX material is a PTFE composite with glass reinforcement. It has low dielectric loss and is ideal for high frequency/broadband circuit applications. It is also highly conductive and can withstand high temperatures and humidity. This composite laminate has excellent chemical resistance and is easily cut, unlike other materials. In addition, it is resistant to all reagents and solvents, making it perfect for etching printed circuits.

RT/duroid 5880LX laminates consist of a unique filler contributing to their outstanding chemical resistance. In addition, these laminates are lightweight and have low density, making them ideal for high-frequency applications in microwave, millimeter, and GHz ranges. They also exhibit low thermal expansion, making them a perfect choice for various applications.

RT/duroid 5880 is a high-frequency PCB. Its applications include military radar, microstrip line circuits, point-to-point digital radio antennas, and stripline circuits. Its outstanding chemical resistance makes it an excellent choice for these and other serious electrical applications. It is also great for military radar and missile guidance. Microstrip circuits are also a great choice.

Low dissipation factor

Rogers RT/duroid 5882LZ laminates combine PTFE with a unique filler to produce a low-density, lightweight, and highly conductive dielectric material. As a result, they are ideal for airborne communications antennas, satellites, and point-to-point digital radios. Moreover, Rogers RT/duroid 5880LZ composites have low dissipation and usable performance at Ku-band frequencies.

PTFE: Unlike PTFE, RT/duroid 5880LX laminates feature low CTE values. The low CTE of RT/duroid 5880LZ laminate enables routine lead-free manufacturing. On the other hand, its high TML and CVCM values characterize this material. In addition, it is challenging to break the RT/duroid 5880LZ laminate with a hammer, which would damage the board.

Compared to PTFE-based circuit boards, RT/duroid 5880LX exhibits low dimensional instability and excellent thermal stability. It also outperforms non-PTFE materials and standard PTFE-based substrates in a wide range of critical applications. For example, it performs better than PTFE-based circuit boards and is superior to the woven-glass reinforced PTFE material.

The RF/microstrip materials used by Rayming PCB & Assembly exhibit excellent thermal and mechanical stability. The low dissipation factor is an essential characteristic for RF/microwave applications. In addition, the RO4000 and RO4730 LoPro circuit materials are compatible with FR-4 and lead-free processing.

In addition to its high thermal conductivity, Rogers RT/duroid 5881LZ laminates offer improved RF/microwave performance. These laminates can handle a wide range of frequencies and are suitable for high-power applications. They can also handle increased heat and resist EMI/RF radiation. Moreover, the reverse-treated copper foil in the Rogers RT/duroid 5880LZ laminate allows a higher level of control.

Multilayer capability

The multilayer capability of Rogers RT/duroid 5880LZ laminates is a crucial feature of this new series. This laminate has the lowest dielectric constant among high-frequency materials and a low dissipation factor over a broad frequency range. The low dielectric loss of RT/duroid 5880LZ is beneficial in high-frequency applications, including Ku-band frequencies.

The multilayer capability of Rogers RT/duroid 5880LZ laminate provides increased frequency and wider conductor widths, allowing users to achieve controlled circuit impedance and lower conductor losses. This allows users to increase the frequency range of their devices, ensuring high-quality audio and video. In addition, the laminate is highly compatible with lead-free manufacturing processes, making it an excellent choice for high-frequency applications.

This Rogers high-frequency PCB is ideal for point-to-point digital radio antennas, microstrip lines, strip lines, and missile guidance systems. The material is thermally stable, so it rarely requires precise welding process control. However, it can encounter joint problems during the process of solving.

The high-frequency PCB applications require precision and reproducible high-frequency performance. To achieve this, high-frequency PCB materials must match the trace impedance with the substrate’s properties. Using FR-4 is a poor choice because it cannot achieve this. In contrast, Rogers materials can be used up to 3 GHz and have higher dielectric constants.

A single-layer PCB may use as many as two layers of conductive copper, with the first layer containing a conductive halide. A two-layer design can reduce the overall PCB substrate cost, while a four-layer design requires a more expensive fabrication process. A high-reliability PCB substrate should be at least a single-layer PCB, so choosing the right substrate is essential.


Rogers RT/duroid laminates are the latest developments in hybrid PTFE circuit boards and can perform faster than their predecessor. We can use them for many high-frequency applications that require a low dissipation factor in a wide range of frequencies. The high-frequency PCB material offers good dimensional stability during the process and good heat resistance. It can be used up to 3 GHz and has a higher dielectric constant.

The use of Rogers RF/microwave approved laminates, including RT/duroid 5880LZ and 5881LZ, can decrease overall process costs. They do not require additional heat curing and resist high temperatures while providing the same performance as other board materials. In addition, they have a low dissipation factor by design, which means less power loss for heating system components.

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