Working with electronics can be an arduous task, especially when it comes to programming. We may not know how or what to code to get the results we want. Luckily, there are boards available that can make it easier by focusing on our design and not worrying about the coding behind it all.

Intel (Altera) Cyclone III FPGA Boards are the most common boards in use today. They usually cost anywhere from $200 – $1000 and we can find them on online shops, and large scale manufacturers like RayMing PCB and Assembly. However, the boards offer a lot of freedom to the programmer, and therefore they cost a lot of money.

It is essential to have a thorough understanding of the components of this board. We take many things for granted regarding electronics, so it is essential to read through this section. The boards are essential in many ways, and each way has its pros and cons.

Before purchasing one of these boards, it is essential to understand and how they work.

What are Intel (Altera) Cyclone III FPGA Boards?

These boards are for people who want to program FPGAs. FPGAs are circuits made up of microchips that allow them to do more than regularly integrated circuits. These boards are essential for people who want to make custom circuit designs.

These boards are for design enthusiasts. Some people use these boards simply because they want to experiment with new things, while others use them in their jobs.

These boards are for people who want to make their electronic designs without coding everything from scratch. These boards are essential in many different ways, but some are better than others, depending on users’ needs.

To summarize, these boards are essential for people who want to program FPGAs in their custom designs, whether large or small.

How Do These Boards Work?

These boards comprise an FPGA chip that has been pre-programmed by the manufacturer.

We do the programming using a circuit called a JTAG. The JTAG controls the FPGA and allows us to change what program is running on it.

We can program these boards directly in hardware or software. Most people use the hardware method because it is quicker and takes less computer memory. However, most modern computers cannot handle loading a lot of software. Therefore this is not an option for most users. If you can, try to get a computer with a fast processor and a lot of RAM.

Hardware programming is usually done by connecting the JTAG to a special connector on the board. This is traditionally called a serial connector. The JTAG controls the FPGA chip and brings out different output pins on the FPGA chip. In turn, we connect these output pins to pins on your computer’s circuit board.

For this to work, the motherboard must have a special circuit built onto it to accept the input from the FPGA board. Most boards do, but you still have to be certain that it does. Also, the JTAG cable must have a special JTAG connector on it. There are many types of JTAG cables, so be certain that you know how your cable works before getting started.

Software programming is just as easy as hardware programming. But not all motherboards can handle this type of programming.

Intel (Altera) Cyclone III FPGA Boards features

Configuration, Status, and Setup Elements

Configuration elements can be anything from input and output signals to memory and logic cells. We can use elements to configure the FPGA to do whatever it is we want it to do.

Configuration of these boards is generally easy. We just have to use a JTAG cable or flash our board with a special program using the JTAG connector on the computer. We do configuration with hardware programming, so most people do not have trouble configuring their board.

Status and setup elements are also easy to understand. These elements tell the FPGA what to do. These elements include pins on the FPGA, and they can either be high or low. There is also a test input and a check input which we can use to see if we have configured something correctly.

Setup elements are more sensitive than status and configuration elements. We cannot simply use an input and output pin to tell the FPGA what to do, but we must carefully set up each pin with a particular value. One can do these using configuration elements on the board.

Status elements are simple to understand. One can see this as an input or output. For example, we can see if the pin is high or low by reading the board’s JTAG connector.

Status elements are also easy to understand, but they can become complicated if we set up a pin using configuration elements.

To summarize, these boards have many different configurations that we can use to change what program we are running on the FPGA chip.

Configuration elements are essential for configuring the FPGA with inputs and outputs.

Clocking Circuitry

Clocking circuitry is the circuit that allows the FPGA to continue functioning. In addition, it will enable us to use external clocks that will allow the FPGA to operate at different speeds.

Configuration of the clock circuits is not necessary. But they are essential in configuring the board with different clock frequencies. We do these using configuration elements on the board, which are generally easy to understand once you have read through the user’s manual.

Status elements are also easy to understand. They simply tell us the frequency of the clock.

To summarize, this circuitry allows us to use external clocks.

Clock Frequency Reduction

One can find the clock frequency reduction within the FPGA chip itself. We can configure it using configuration elements on the board. It allows us to change the frequency of our clock using smaller steps.

Hardware programming is necessary for this element, so most people do not mess with it until they have become more advanced users. Status elements are not necessary, but they inform us of the clock frequency reduction status.

To summarize, we use this circuit to change our clock frequency to a smaller value.

The boards have a special input and output for status and configuration elements. We may use a JTAG cable connected to a computer or flash our board with a special program to communicate with the FPGA chip on each board. These boards have different ways of communicating with them, depending on which one you get.

Memory Elements

Memory elements are elements used to store data in the FPGA. Other elements on the board can change this data. There are two types of memory elements: SRAM and ROM. We do not configure memory using the JTAG cable, but it uses configuration elements on the board.

Memory elements can be either SRAM or ROM, and they each have their uses and advantages.

SRAM is useful in storing temporary data that we need, but we will lose it upon turning off the board. This is good for storing data that we want to access every few milliseconds.

RAM is not as fast as SRAM, but it stores more data than SRAM (it can also hold our entire design if we use enough of it). We use this to store information for use for a long time.

Therefore, these boards have a lot of memory elements that we can use to store our data.

We can also use ROM to store our entire design. It is generally used as a backup of our actual design or easily uploads a different design version. Of course, one can also use this to store anything we desire.

One cannot configure SRAM and ROM with the JTAG cable, but one can do it using configuration elements on the board.
To summarize, these boards have memory elements that we can use to store any information we want.

General User Interfaces

User interfaces are the elements that allow us to interact with the board. There are two types of user interfaces: Input and Output.

Input elements are the particular input and output ports that we connect to when we want to talk to or from something else. These user interfaces have different functions, depending on which one you choose.

Inputs come in many different shapes and sizes (literally). They can be simple digital and analog inputs and outputs or even more complicated I2C buses.

Outputs are the special ports that we use to talk to other elements on the board. These can be simple digital outputs or more complicated SPI or I2C buses.

Status elements are the pins that allow us to check if there was an input or output to these ports.

User-Defined Push Button Switches

User-defined push button switches allow us to easily create our buttons on the FPGA chips. These boards have a very convenient way of communicating with these user-defined push button switches on the board. They also have lots of special input and output ports that we can use to tell the FPGA what to do.

User-Defined DIP Switches

DIP switches are user-defined push button switches that we connect to the JTAG cable. We can easily connect them to the JTAG cable to check if the switch is active or not. They come with different prototypes.

User-Defined I2C Switches:

Similar to DIP switches, user-defined I2C switches allow us to check if they pushed or released a switch using the particular I2C interface on each board. Each one has a different way of connecting them to other elements on the board.

User-Defined LEDs:

User-defined LEDs allow us to connect three different LEDs to the JTAG cable of the FPGA board. We can use these as a way to display information or just for decoration. Connecting these user-defined LEDs requires a special method depending on which board we have.

User-Defined Analog Output:

These boards allow us to use an analog output on the FPGA itself directly. For this, we need an external circuit that we can connect to our FPGA board. This circuit has special status elements that we can connect to the analog output port. Analog outputs are beneficial because they allow us to send analog signals directly from our FPGA board to external circuits without using any other circuit.

User-Defined Analog Inputs:

These boards allow us to use an analog input on the FPGA itself directly. To use this, we need an external circuit that we can connect to our FPGA board.

7-Segment Displays

The displays can display information, such as the values of different pins on the FPGA. These displays come in many different sizes and shapes, and some even have LEDs that one can switch on and off. In addition, manufacturers often configure the 7-Segment displays using special user-defined I2C switches. While we connect the 7-Segment display to our FPGA board, we connect the 7-Segment display to the special user-defined I2C switch in a particular way. Thus, it has many different ways of displaying information and many different ways of connecting it to other elements on the board.

The boards have a special input and output for status and configuration elements.

User 7-Segment Display: This seven-segment display communicates with the FPGA with the special I2C port. Manufacturers assign each segment to one of the seven bits in our design. Therefore, we need to send the appropriate data to the proper bit in our design to change the display.

Power 7-Segment Display: This seven-segment display communicates with the FPGA with the particular SPI port. We can change the display by sending a specific status value to the FPGA on the correct bit on a separate oscillator.

Communication Ports and Interfaces

There are many communication ports and interfaces on these boards.

One can configure these communication ports with a special connector. Once we have set up the connector, we can use the port to communicate with other elements on our FPGA board.

Interfaces allow us to communicate with other elements on our FPGA board. Each interface is a particular port with a unique number that we use to identify it, and that we also use it by other switches and pins on our FPGA board. There are many different types of interfaces, all of which have a unique number. We can use some to receive or send data from/to other elements on the board, while others can send or receive data.

There are also special communication boards that can easily connect to one of these interfaces on our FPGA board. Thus, we can use any serial interface to transfer data from our computer to our FPGA board.

High-Speed Mezzanine Connector

Mobile or Mezzanine connectors are connectors that we use to connect to the high-speed mezzanine bus. High-speed mezzanine boards are special boards that allow us to talk to other elements on our FPGA board. These boards contain many different ports that can send various signals, like control signals, status signals, and other data signals.

Advantages of Intel (Altera) Cyclone III FPGA Boards

The Cyclone III device family offered by Altera is the most powerful FPGA family. the benefits of using the Cyclone III device family are as follows:

Reduced Cost

FPGA-based boards are perfect for their high cost. Since we use the chips differently, manufacturers often design them differently. This results in a lower cost than using an FPGA from another manufacturer since they modify it for use with these boards.

The family of Cyclone III device also saves in power consumption when compared to other FPGA devices. They have fewer power-hungry components in them, so they consume less power under normal usage.

This also allows them to use more power-restricted systems, like handheld devices or portable computer systems.

Fast Processing Speed

The Cyclone III device family famous for its high processing speed. The family of Cyclone III device can process data at a higher speed than previous FPGA families.

It allows for faster capture of data and fewer errors while capturing data for analysis. This speed also applies to CAD programs, which we use in product design.

Lower Error Rate

The Cyclone III device family includes features that prevent errors from occurring. These features allow for a lower error rate as compared to other FPGA devices.

With the use of soft programmable logic, there is less time spent on configuration and verification. There is no need to verify the bits in the configuration process. Also, there is no need to zero the logic within the configuration cycle. These features reduce time, which results in fewer errors when using these boards.

Lowest-Power 65-nm FPGA

This is the only FPGA in this category that uses a 65-nm technology. The other FPGAs use a 55-nm technology, which makes them slower and less efficient.

Also, Cyclone III has a smaller die size than other FPGA’s. This allows for less power consumption and heat dissipation under normal usage.

Lowest-Power 55-nm FPGA

This is the only FPGA in this category that uses a 55-nm technology. The other FPGAs use a 65-nm technology, which makes them slower and less efficient.

Also, Cyclone III has a smaller die size than other FPGA’s. This allows for less power consumption and heat dissipation under normal usage.

Complete system integration

With the design and production of the boards, users get access to a complete system that they can use for their needs. This includes a motherboard and other components that the user may need for their design. With this, users can create their circuit board and create complete working designs. It also includes a software development kit, which is an essential feature for many users. This includes everything they need to start programming their circuit boards.

Disadvantages of Intel (Altera) Cyclone III FPGA Boards

The Cyclone III device family is the most power-hungry FPGA device. They famous for their high-power consumption under normal usage. This is because of their high processing speed and high amount of logic.

The other boards in this category use less power than the devices in Cyclone III family. While the Cyclone III device family has more power, we can still use them in some applications that need high power.

Cyclone III FPGA boards also require a lot of cooling during use. This is because of their fast-processing speed and a large amount of logic. This extra cooling requires extra energy to operate, which results in their high-power consumption.

We also rate them for use on more advanced boards than other FPGAs. They require more advanced circuitry to function at their full processing capacity.

As a result, their smaller die size also means that we can still use them on less advanced boards. While this may seem like a disadvantage, it is a benefit in some ways. The smaller die size allows the FPGA to be useful on boards that other FPGAs we can’t them on. This gives users more options when choosing what board to use their Cyclone III device family in.

It also means that these boards are for more advanced users who understand how to work with them and program them. This means that manufacturers only sell fewer boards to inexperienced users.

Intel (Altera) Cyclone III FPGA Boards

Some common attributes among these boards include:

• Made In Japan
• RoHS compliance
• Tested all I/O
• Credit-Card-Size 3.386″x 2.126″ (86 x 54 mm)
• High-quality six layers PCB. (Immersion gold)
• Ten-pin socket JTAG Connector for download cable connection
• Power-on Reset IC
• Status LED (Power, CONF_DONE)
• User LED x2
• User Switch (Slide)
• 30 MHz Oscillator (50 ppm) or External
• Configuration Device (Micron, M25P16)
• 5 V I/O support with Bus switch ICs (Texas Instrument, SN74CB3T3245)
• 100 I/O PAD 100 mil (2.54 mm) grid
• The single 5 V power supply operation with on-board 3.3 V,2.5 V, and 1.5 V regulators

[ACM-029] Altera Cyclone III Q240 FPGA board (5V I/O)

Altera EP3C16Q240C8N

• 20 Global Clock Networks
• 100 Maximum user I/O pins (Board)
• 346 Maximum user I/O pins (Device)
• 4 PLLs
• 56 Multipliers
• 56 M9K Blocks
• 504 Total RAM KBits
• 15,408 Logic Elements

[ACM-029Y] Altera Cyclone III Q240 FPGA board (5V Tolerant)

Altera EP3C16Q240C8N

• 20 Global Clock Networks
• 100 Maximum user I/O pins (Board)
• 346 Maximum user I/O pins (Device)
• 4 PLLs
• 56 Multipliers
• 56 M9K Blocks
• 504 Total RAM KBits
• 15,408 Logic Elements

[AP68-04] Altera Cyclone III C25 PLCC68 FPGA Module

Altera EP3C25U256C8N

• 50 Maximum user I/O pins (Board)
• 156 Maximum user I/O pins (Device)
• 20 Global clock networks
• 4 PLLs
• 66 18 x 18 multipliers
• 594 Embedded memory (kb)
• 56 M9K memory blocks
• 24,624 Logic Elements

[AP68-03] Altera Cyclone III PLCC68 FPGA Module

Altera EP3C10U256C8N

• 50 Maximum user I/O pins (Board)
• 182 Maximum user I/O pins (Device)
• 10 Global clock networks
• 2 PLLs
• 23 18 x 18 multipliers
• 414 Embedded memory (kb)
• 46 M9K memory blocks
• 10,320 Logic Elements

[ACM-304Z] Altera Cyclone III Q240 FPGA board

Altera EP3C40Q240C8N (CycloneIII FPGA 40K LE)

• 56 Maximum user I/O pins (Board)
• 128 Maximum user I/O pins (Device)
• 126 Multipliers
• 1,161,216 RAM Bits
• 4 PLLs
• 39,600 Logic Elements

CycloneIII FPGA 16K LE (Altera EP3C16Q240C8N)

• 56 Maximum user/consumer I/O pins(Board)
• 160 Maximum user/consumer I/O pins(Device)
• 56 Multipliers
• 516,096 RAM Bits
• 15,408 Logic Elements

[EDA-004] Altera Cyclone III USB-FPGA board

Altera EP3C55F780C8N (Cyclone III FPGA 55K LE)

• 156 Multipliers
  • 2,396,160 RAM bits
  • 260 M9K RAM blocks
  • 100 Maximum user I/O pins (Board)
  • 377 Maximum user I/O pins (Device)
  • 4 PLLs
  • 55,856 Logic Elements

[ACM-018] Altera Cyclone III Q240 FPGA board

Cyclone III FPGA 40K LE (Altera EP3C40Q240C8N)

• 1,161,216 RAM Bits
  • 126 M9K Blocks
  • 100 Maximum operator/user I/O pins (Board)
  • 535 Maximum operator/user I/O pins (Device)
  • 4 PLLs
  • 39,600 Logic Elements

Altera EP3C16Q240C8N (Cyclone III FPGA 16K LE)

• 516,096 RAM Bits
  • 56 M9K Blocks
  • 100 Maximum user I/O pins (Board)
  • 346 Maximum user I/O pins (Device)
  • 4 PLLs
  • 15,408 Logic Elements

[ACM-105] Altera Cyclone III F484 FPGA board

EP3C16F484C8N

• 56 Multipliers
  • 516,096 Memory(kbits)
  • 56 M9K RAM blocks
  • 128 Maximum user I/O pins (Board)
  • 346 Maximum user I/O pins (Device)
  • 4 PLLs
  • 15,408 Logic Elements

[ACM-202] Altera Cyclone III F780 FPGA board

EP3C120F780C8N

• 288 Multipliers
  • 3,981,312 RAM bits
  • 432 M9K RAM blocks
  • 296 Maximum user I/O pins (Board)
  • 531 Maximum user I/O pins (Device)
  • 4 PLLs
  • 119,088 Logic Elements

EP3C80F780C8N

• 244 Multipliers
  • 2,810,880 RAM bits
  • 305 M9K RAM blocks
  • 296 Maximum user I/O pins (Board)
  • 429 Maximum user I/O pins (Device)
  • 4 PLLs
  • 81,264 Logic Elements

EP3C55F780C8N

• 156 Multipliers
  • 2,396,160 RAM bits
  • 260 M9K RAM blocks
  • 296 Maximum user I/O pins (Board)
  • 377 Maximum user I/O pins (Device)
  • 4 PLLs
  • 55,856 Logic Elements

[ACM-203] Altera Cyclone III F484 FPGA board

EP3C55F484C8N

• 156 Multipliers
  • 2,396,160 RAM Bits
  • 260 M9K RAM blocks
  • 262 Maximum user I/O pins (Board)
  • 328 Maximum user I/O pins (Device)
  • 4 PLLs
  • 55,856Logic Elements

EP3C40F484C8N

• 126 Multipliers
  • 1,161,216 RAM Bits
  • 126 M9K RAM blocks
  • 262 Maximum user I/O pins (Board)
  • 331 Maximum user I/O pins (Device)
  • 4 PLLs
  • 39,600 Logic Elements

EP3C16F484C8N

• 56 Multipliers
  • 516,096 RAM Bits
  • 56 M9K RAM blocks
  • 262 Maximum user I/O pins (Board)
  • 346 Maximum user I/O pins (Device)
  • 4 PLLs
  • 15,408 Logic Elements

Conclusion

The Intel (Altera) Cyclone III FPGA Board is a useful device that we can use in many ways. For example, they can be useful for people who want to mess around with new ideas or for people who want to implement and test new and exciting designs. These boards comprise an FPGA chip that has been pre-programmed by the manufacturer.

We are quick to forget how technological advancements have contributed to our existence. A brief flashback will be helpful to appreciate these developments at our disposal. The USB adds up to one of such developments.  

The USB world is a vast grassy field of interface. It has provided solutions to sharing of files, transfer of data, images and programs. Also, it is an interface between USB and various computing, electronics and communication devices.  It has grown over time as a technology that has become customary to tasks and play devices.

There are various types of connectors roving around the field of PCB production. They show the means by which power relays data transfer as input to producing new outputs. These interfaces are in two gender form, the male and female

In a bid to please curiosity on what the new technology in appliances for both tasks and play provides, read on. This article will explore PCB USB, USB PCB connector, USB c PCB, USB circuit board, and others.

What is PCB USB?

The abbreviation USB means Universal Serial Bus. This is basically a snap-in device that plays the role of an interface between PCB and its subsidiaries. Its expansion has been very huge and its dominance well felt in the technological world.  Its relevance and contribution to the world economy today as well is significant.

It is self reliant without dependence on any device to run, or the need to charge for power before use.  Its efficiency has helped businesses and corporations transfer document cases with relative ease.

The PCB USB is a sought after connecting found in various electronic devices. They include computers, mobile phones, pen drives, printers and many more. It aids initiating connections with accomplices. The USB connecting strip is also fixed on the PCB which forms linkage between both.

This is achievable through a simple plug-in to the USB port.  The USB port is the interface that joins the computer and other electronic gadgets. The port permits connection with USB devices to send computerized data through cords.  

Moreso, electric current can go through the cord to devices that need such. There are two major types of PCB USB; they are wire and wireless USB connection. Thus, the wired type uses the cord and USB ports while the wireless uses radio frequency.

The usage of the PCB USB device exceeds much more than the common functions that reach the mind. It serves various purposes to include the following:

• Locking and unlocking of computer devices
• Harmonizing documents through mechanized process
• Backing up of folders for future use
• Running of programs connecting to wireless network

To enjoy prompt access to folders as well as efficient data transfer, the USB flash drive is a perfect fit.

Micro USB PCB Connectors

Micro USB PCB is a mini design of USB intersection invented to connect solids and mobile devices.  It features the minute foot mark of USB and provides considerable decrease in PCB for a host of handy devices.

The Micro USB PCB succeeds the bulk of Mini USB electric points and receptacles in use presently.   Its design bolsters the present USB on the go addition and allows mobile affinity. Also, other compact devices can interact directly with one another devoid of a host (PC).

Connection with the PCB is through the micro USB cable. It is the smallest type of USB cable. Also, it has two connecting means and a 3.0 USB. It provides an easy way to join different gadgets, plugging in an electric charger.

In addition, micro USB cords are utility devices used to replace Mini USB link up ports due to size or efficacy. Likewise, the USB cords give an equal performance as expected from an all purpose USB cord.

USB PCB Board

The USB PCB board is the center for the USB connecting interface gadgets due to its popular usage. It aids in transmitting data quickly in such an efficient way.

Different brands of USB 2.0 are in the market space, but the use of its application becomes difficult. This is due to a series of challenges posed by the USB design after assembling the PCB.

Designing a PCB that satisfies the 2.0 USB demands is very vital for the designed brand’s integrity.

The USB compactness explains the relaying of the electrical signals by various lines (D+, D-). For the USB gadget to perform maximally, the distinctive lines designed must agree to guiding rules

In fixing the elements on the PCB, the distinctive lines must be as short as it could be. Plan the distinctive lines at first so that they will not exceed two vias.  The vias enhance the parasitic inductor of the lines that in turn affect the signal strength.

The USB 2.0 device uses three types of speed. The peripheral gadgets that include Keyboards, and mouse are low speed gadgets. They run at a speed of 1.5mbit/s to transfer data whereas high speed gadgets transfer data at a speed of 12 mbit/s.

These high speed USBs are always used by gadgets that use hard drives.  To get a full speed operation from high speed gadgets, identification with the host is vital.

USB PCB Connector

Connecting computers and other devices years back was difficult. Computers and other peripherals have connection possible only through parallel and serial ports to transfer data. More so, separate ports serve various peripherals that include mouse, printers, keyboards and joysticks. Connections wouldn’t have been possible without the accelerator cards and custom software.

This setback continued for a period until a superior technology came into existence. Thus, the invention of the USB. This brought relief and efficiency at performing computer related as well digital tasks. It became the most acceptable connector due to its function of being a plug in as well as playing device.

The USB PCB connector comes in dual surfaces which are the host and peripheral. They have related similarities in components design to meeting their intention of production.

PCB USB Design Components

The USB PCB design components are as follows.

Shielding: This is an important component of the USB PCB design. It serves as a protection to preserve the signal part to a loud electrical sound atmosphere. Exposure of the connector to a high sound environment could cause damage.

Strong power connections: This is a design that allows power pins on the USB connector. It permits connection done ahead of the data cords. This helps to avoid powering the device above the data lines which could be dangerous to the USB.

Polarization: Most connectors go through a single orientation. It implies fixing a connector into devices wrongly could lead to a potential damage to the device.

Strain Relief: In a bid to reduce the tension placed on the connector, the strain relief becomes vital. It is a plastic coating on the USB to prevent tension on the cord which could damage the electrical link.

Four Contacts: The USB design comes with at least four contacts. Although, some designs carry up to five contacts and more such as a 3.0+ USB connector. These contacts serve as the power, dual data lines, (D+ and D-) as well as the ground. The USB can convey 5V which can rise to 500mA.

USB PCB Connectors Types

There are different types of USB PCB connectors. They are a perfect match to various kinds of applications. However, the following USB PCB connectors are the popular types available.

The Vertical through Hole Connectors

These are the female types of PCB. They consist of staged plastic connectors produced in 3, 2 and 4 rows with specific contact space of 0.050. These connectors have an upright orientation in the same form of an upright mount spigot. Moreso, its stoppage goes through the coated through holes on the PCB before fixing. The upright through hole connector presents a slim track for space confined applications.

Top Mount Connectors

These types of connecting strips are knotted to the top tier layer of the PCB using the break off lead. It is best for mechanical devices open to the risk associated with vibration and fall objects.

Mid Mount Connectors

As its name implies, the mid mount connector has its space in the middle of the PCB. These are the types that meet the electronic demands for low profile end users. They are handy options when concerns surround the height over the base of the PCB

Base Mounted Connectors

These connectors are at the under surface of the PCB. They can join two PCBs side by side using the links between the applications that pass across the PCB. The holes at the base surface layout which passes across the header pins as the link.

USB C PCB

Since the innovation of the USB, various successes have gone into records. The technological advancements it has brought cut across every sphere. Technology advances often and so upgrades of early designed connectors are vital.

New gadgets are hitting a position where existing USB connectors need upgrading. The big size and inner sound restriction within the standard A and standard B USB is an example of such setbacks.

In correcting the developing needs of the devices, the new specification of USB C PCB came about, without the previous specifications losing its operating advantages as a device.

The USB C PCB design as a connector has gained acceptance across electronic devices. They can deliver power as well as send data. It has overturning capacity and its performance is quicker than those designed earlier. A typical USB-C connector can generate power of 2.5 watts while it also shows an improved thinner figure.

The quality standard that explains the USB C PCB socket, electric outlet and cord are as follows:

• It allows current and existing anchor and device set up agent where design, size and styles are parameters.
• Augments the usage of associating USB gadgets with ease in a view to reducing users.
• It functions with the existing USB link without interruption

Why Choose a USB C Connector For Your PCB Design?

There are various reasons why the USB C PCB connector is the most suitable for the PCB design. They are as follows:

• It enhances efficient compatibility for quick quality charging
• Has a durability advantage over micro USB – B type of connector because of it mode of design
• It has higher carriage capacity of currents and voltages
• The USB C connector is the most preferred by various gadgets

USB Circuit Board

The USB is a certified integrating system between the computer and other gadgets. It is a device that deals with a host (PC) and most often other gadgets (peripheral). Also, it uses a corporal interface which consists of four guarded cables. Each cable represents a pin.

• The first pin called V BUS is the power connecting point for other gadgets. It supplies base current from the USB host to the tune of +5v.
• The second Pin serves as the neutral data workstation noted as D- (DM).
• The third pin is the direct opposite of D- (DM). It functions as the couple that conveys data. Also, it is the main energy source noted as D+ (DM).
• The fourth pin is the ground connection (GND).

The Circuit board is a leveled overlay designed from a dielectric material. It has an integrated circuit covered with copper either on the outer layer or inner layer.

The board could be as modest as having two coated layers and it could be as complex as having multiple layers. In designing a layout that fixes the USB to the PCB, various challenges are being faced. The coupling of the USB interface needs to be precise to enable it function perfectly.

The dominant challenges include power, arrangement and meddling issues. Errors in the layout will give resultant problems and break up.

Common Challenges in USB Circuit Board Design

In a bid to develop a USB circuit board that is error free, preventive measures to check are very vital.

To deliver a USB circuit board that has signal probity, the DM and display port must cover the same gap. A difference in coverage by any of these two pins would affect the signal timings. Thus, data error becomes inevitable. A detailed balance check on the data trace in distance and range is very important.

Effective resistance of the electric circuit to alternating current is another challenge. Trailing the DP and DM on the PCB has to match to reduce wave reflection. The pattern of current PCB setup software can direct both the DM and DP signals together. The design should be as little in distance as possible.

Adequate care is important to avoid the addition of stubs. Most often during the process of putting the base current diodes, producers tend to add the stub. Its resultant effect will be to reduce data wave strength. More so, signals for the DM and DP should go through the USB ground plane on a consistent basis. Hence, this will help cut the risk of splits under the DM and DP”s plain.

Selection of a suitable power arrangement during the USB coupling design is a key. Thus, producers must ponder on how current will get into the USB integrated circuit.

Conclusion

The roles played by the USB PCBs are significant. They play a pivotal role in advancing technology. Thus, their inputs include efficiency, stability, innovation and many more both to the digital as much as the electronic world. However, this article has highlighted some challenges and solutions to designing a quality USB PCB.

Component placement is a very important aspect of PCB assembly. There are different ways of mounting components on a circuit board. Each of these approaches has its benefits and disadvantages. The type of mounting technology used in a circuit board determines its functionality.

Sometimes, the application requirements determine the type of mounting technology to use. It is important to know how these technologies work. Therefore, this article will shed more light on the difference between SMT, THT, and SMD.

THT VS SMT

 THT and SMT are the two major types of mounting technology for PCB. These technologies are used in mounting electronic components on circuit boards. However, there are differences between these two technologies. To have a better understanding, it is important we shed more light on THT vs SMT

What is THT?

THT stands for through hole technology. It is a method of mounting electronic components on circuit boards. THT involves drilling holes through the PCB and inserting the leads via those holes. THT plays a crucial role in PCB fabrication.

This technology involves the placement of component leads into drilled holes on a bare board. Manufacturers solder these leads onto pads on the other side of the board. The manufacturer does this using reflow soldering or wave soldering equipment. THT was a common approach for mounting components until the advent of SMT. Despite the popularity of SMT, THT has proved resilient as it offers several benefits.

THT replaced electronics assembly techniques like point-to-point construction. This technology has been used since the 1950s. The through hole technology is ideal for creating interconnections between layers on boards.

What is SMT?

SMT means surface mount technology. This technology is the more recent method of mounting components on circuit boards. It replaced the through hole technology due to certain benefits it offers. SMT involves mounting electronic components on the surface of the PCB directly.

This technology uses automation. SMT makes use of pick and place machines to place electronic components on boards. This technology is considered the second revolution of electronic assembly. SMT uses both wave soldering and reflow soldering to solder components.

The advent of SMT has helped to reduce the cost of manufacturing while maximizing PCB space. SMT was developed in the 1960s and became popular in the 1980s. This technology is ideal for high-end PCBs. The use of SMT has resulted in smaller components. Also, it has enabled the placement of components on the two sides of the board.

In surface mount technology, manufacturers mount electrical components without drilling. These components feature no leads or smaller leads. Here, there is a specific amount of solder paste the manufacturer applies to the board. Since there are not many drilled holes on SMT boards; they are more compact for better routing.

Comparing THT vs SMT

THT and SMT are two reliable mounting technologies in PCB assembly. However, SMT is more reliable and more common. There are differences between these two technologies. While SMT replaces THT, THT is still being used in PCB assembly.

THT inserts electronic component leads into drilled holes on a circuit board. Most times, manufacturers carry out this technique manually. SMT technology doesn’t require as many drilled holes as THT does. The use of pick and place machines in SMT makes the technique much easier for manufacturers.

SMT doesn’t require leads and can be directly mounted on the circuit board. Whereas, THT requires lead wires that manufacturers place in drilled holes. SMT requires advanced production and design skills compared to THT.

THT vs SMT In terms of manufacturing costs, THT involves a higher cost of manufacturing than SMT. However; capital investment for automated equipment is higher than that of THT. THT is ideal for certain applications. Through hole boards are ideal at the prototype stages of a project. For a through hole board, manufacturers don’t need to produce a new solder stencil anytime the circuit board goes through a revision change.

THT vs SMT via through hole technology. This technology is ideal for the manufacturing of bulky components. SMT is ideal for higher circuit speeds since it features fewer holes. Unlike THT, SMT allows assembly automation which is ideal for the production of higher volumes at reduced costs.

SMT provides more board space during assembly, unlike THT which uses up the board space. THT helps manufacturers to check mechanical problems during validation. The manufacturer can fix this problem during redesign without any assembly difficulties. However, in SMT, this is difficult to fix. This is because warp and twist is easier to fix on a manually-assembled PCB.

SMD vs THT

What is SMD?

Surface mount device (SMD) is an electronic component placed on a circuit board. PCB manufacturers can place SMD on circuit boards through SMT. There are various types of SMD components. All SMD components work together to enable the functioning of a circuit board. Examples of SMD components include chip resistors, capacitors, and diodes among others.

Let us discuss a few below;

A capacitor is a type of SMD component. This component features a rectangular block of dielectric. The dielectric contains several interleaved metal electrodes. A transistor is another SMD component available on a circuit board. The resistance of this component is built in the ammeter and the base.

SMD resistors are another type of SMD component. There are chip and network resistors. The three digits on the chip resistor are the resistance value. The significant digits are the first and second digits. The network resistor comprises many resistors with similar parameters. This resistor uses the same resistance identification method as the chip resistor.  

SMD vs THT – What is the difference?

It is important to know the difference between SMD and THT. A lot of times, most people confuse these two terminologies. Through hole technology involves the soldering of through-hole components on a circuit board. Manufacturers use hand soldering or wave soldering to complete this process. In THT, the component leads pass through the drilled holes on the boards.

 SMDs are components manufacturers place on circuit boards through SMT. Manufacturers use solder paste to place SMDs on the bare board. Surface mount devices feature shorter leads that enable a greater electrical connection. THT involves soldering through hole components onto a circuit board by wave soldering. The component leads go through the drilled holes of the boards.

Through hole technology offers stronger mechanical bonding. This technology is ideal for electronic devices likely to suffer from mechanical stress. THT manufacturers use hand and soldering or wave soldering for the THT process.

SMDs are smaller than the components in THT. SMD components can be so small to be clearly seen by the naked eye. Due to the size of SMDs, they save more space on the bare circuit board. SMD components rely on solder balls to enable improved bonding capability.

THT provides more mechanical bonds than SMT. However, the extra drilling in THT makes it more expensive to create the circuit board. Therefore, THT is ideal for more bulky parts. For instance, electrolytic capacitors need extra mounting quality to withstand pressure.

What is the Difference Between SMD and SMT?

SMD refers to the electronic component manufacturers mount on a bare circuit board. SMT is a type of mounting technology PCB manufacturers use to mount SMDs on a PCB. SMT uses a pick and place machine to mount SMDs on circuit boards. This technology replaces the through hole technology.

The advent of SMT has enabled PCB manufacturers to easily mount SMDs on circuit boards. The process of SMT includes solder paste printing, component placement and reflow soldering. The placement of SMD is a very important stage in surface mount technology. SMD and SMT work hand in hand.

Advantages and Disadvantages of SMT

SMT has its advantages and disadvantages.

Advantages

• Smaller PCB design

SMT enables manufacturers to place more electronic components on the circuit board. This helps to achieve a more compact and lightweight design. Manufacturers prefer this technology due to this benefit. PCBs specifically designed with SMT also offer higher circuit speeds. Hence, these PCBs are ideal for high-frequency applications.

• Enhanced mechanical performance

SMT provides enhanced mechanical performance under vibration conditions. Therefore, SMT PCBs are ideal for use in applications extremely exposed to vibration. SMT comprises high-end components which enable multitasking.

• Higher densities

One of the greatest benefits of SMT is the ability to achieve higher levels of component density. The high densities are a result of the smaller size of electronic components. Also, the elimination of drilling mounting holes helps to achieve higher densities. SMT uses both sides of the circuit for mounting components.

• Quicker Assembly

SMT uses pick and place machines to place components on PCBs. This enables simpler and quicker PCB assembly. Some machines can place over 136,000 components every hour. SMT allows manufacturers to attach components through selective soldering. Manufacturers can also customize the selective solder process for each component.

• Low manufacturing costs

SMT reduces the costs of manufacturing printed circuit boards. SMT parts are cheaper that through-hole parts. This mounting technology is a budget-friendly option for PCB manufacturers.

Disadvantages

• Surface mount technology replaced THT due to the benefits it offers. However, this technology has its disadvantages too.
• Small lead can make it difficult to repair
• SMT isn’t ideal for components that produce much heat. This is because the solder will melt under high temperature
• The SMT process requires high-skilled or professional operators. Also, it requires expensive automated equipment.
• Less solder for solder joints might tamper with the reliability of the solder joints. This is a concern for PCB assemblers.

Advantages and Disadvantages of THT

Through hole technology existed before the advent of SMT. THT has proved to be very useful in some cases. However, it has got its own limitations. Below are some advantages and disadvantages of this technology.

Advantages

• Stronger mechanical bond

THT provides enhanced mechanical bonds. This makes THT assemblies suitable for high mechanical or electrical stress environments. Manufacturers prefer to use THT in applications often subjected to stress.

• Resistance to wear and tear

THT components can withstand wear and tear. This is because of the solder joints that extend over the board’s width.

• Ideal for fast prototyping

THT components are ideal for prototypes and testing. This is because these components are very easy to swap out. THT is suitable at the prototype stages of an application. The prototype layout can make use of THT components to enable quick assembly of the board.

Disadvantages

• THT requires the drilling of holes. This increases the cost of production. Also, it takes time to drill these holes, which increases production time.
• The drilled holes must go through every layer of the PCB. Hence, THT limits the available routing clearance on a multilayer circuit.
• The wave soldering process ensures the soldering of THT components. This process is not as reliable as the reflow soldering process.

Considerations for SMT Designs

The type of materials and surface finish manufacturers use play a crucial role in SMT boards. It is ideal to use more planar surface finish when using finer-pitch SMDs. Manufacturers should ensure they evaluate the base laminate. SMT PCBs need higher soldering temperatures than THT PCBs. This is as a result of the lead-free surface finishes frequently used.

Materials that meet certain standards will withstand high soldering temperatures. These materials also resist several thermal cycling shocks.  These shocks may happen when two-sided SMT boards are being assembled. PCB assemblers can reduce the possibility for solder shorts by removing soldermask openings for vias.

With dimensional accuracy in mind, it is crucial to design-in flatness. To achieve this, balance copper coverage from layer to layer and fill large empty areas with copper.

Conclusion

While SMT has been the mainstay of the PCB industry, THT is still ideal for certain applications. THT vs SMT show that the two technologies have got their strengths and weaknesses. The huge difference between SMT and THT lies in their mounting techniques. SMT mounts SMDs on circuit boards without many drilled holes. THT requires component leads and many drilled holes. SMDs play a crucial role in surface mount technology. SMD components are carefully mounted on circuit boards by assemblers.

Printed circuit boards are available in different shapes. There are octagonal boards, round boards, rectangular boards, and other odd shapes. However, the most common shapes are the square and rectangular PCB. Round PCBs are not as common as their rectangular counterparts. With the increasing development in the electronics industry, round PCBs are becoming popular.

Sometimes, there is a need for unconventional PCB shapes. This is because of the need to fit these PCBs into certain enclosures. The fact about PCB design is that a PCB must fit its intended application. Many people aren’t familiar with the round PCB. In this article, we will discuss important facts about round PCB.

What is a Round PCB?

As the name implies, a round PCB is a type of board with a round shape. A round PCB offers an electrical connection to a circuit. This type of PCB is available in consumer electronics, LED PCBA, and more. Round PCBs are ideal for both domestic and commercial devices. A round shaped PCB consumes more time during the routing process. Therefore, these boards may cost more.

PCB manufacturers fabricate round PCBs with extreme care and attention. The fabrication of this type of board is a complex one. A round PCB also features electronic components, traces, and widths. This PCB is available in wearable devices. A round shaped PCB can provide more board space for you. Therefore, this PCB gives you an edge over the rectangular ones.

A round PCB is also referred to as a circular PCB. This type of circuit board is the most difficult to work with. A round or circular PCB is available in tiny wearable devices and rigid-flex circuits.

Round PCB Design

The designing of a round PCB is more complex than the usual rectangular boards. Manufacturers can only shape the perimeter of this board with a straight line segment. When arranging the lines of the perimeter in a circular shape, you should place a circle on the silkscreen layer.

There are different software for designing a round circuit board. Break routing is the only separation method for a round PCB. Now, let us explore one of these software.

Using Eagle CAD to Make Round PCB

Eagle CAD is a popular software for designing the schematics and layouts of a circuit. A circuit’s schematic is an outline of how various electronic components connect. The designer then converts the schematic into a layout. The layout is the exact image of how the circuit will appear on the PCB. Most times, designers create a rectangular shape layout. However, Eagle CAD has a command that can change a rectangular layout into a circular one. This command is known as “MITER.”

Open the Eagle CAD software to proceed with your design. Click on the “File” and select “Open’ to open the layout file. Click “open” to open the layout file. If you haven’t created a layout file, create a new file. To do this, go to “file” and click on “New.” Name the file according to your choice.

You will need to adjust the board outline’s size according to the PCB’s size. Typically, the board outline will be a square. You can adjust the size by left clicking on either side of the outline and dragging to the right or left. Ensure the shape of the board remains square. This will prevent the shape from taking an oval shape when trying to convert it into a circle.

Make sure the sides of the square are equal to the circle’s diameter. Type “MITER 2” on top of the layout and click “Enter.” The icon will change into a + sign. Left-click on the square’s corner. The corner will become round. If the corner appears too small, use “MITER 3” or any greater number. You can do the same if the corner of the square appears too large. All you need to do is decrease the number of the MITER. Do this repeatedly to round all corners.  

Round Circuit Board Design Rules

There are design rules and strategies for round circuit boards. It is very important you draw out the board’s shape in the CAD tool. This is where the foundation for your board lies. If your round circuit board is for a high-speed device, you will have to design a multilayer board.

It is also important you define the power and ground planes in separate layers. Furthermore, you will need a polygon editor to define the shape of ground or power planes. Certain software will allow you to customize your power and ground planes to fit your round board.  For instance, Altium Designer is a software that helps you complete your design.

This software has the necessary tools to help you achieve a great design. The schematic capture of this software is very easy to learn.  However, it is powerful enough to create the most complex schematics. Some applications require the need for a round circuit board. Therefore, it is important to design your circuit board to match your devices’ form factor.

The available board space reduces when you use a rectangular board in a curved package. A circuit board will match the packaging’s contour when the designer works with curved designs. Round PCB design provides designers with more flexibility. Also, it can enable you to expand the design to incorporate new features later on. Great CAD and layout tools enable the designer to add pad shapes in circuit boards.  Round circuit boards require great panelization schemes for their design.

What is a Round LED PCB?

A round LED PCB is a type of circuit board in which a LED is soldered to it. Manufacturers design this type of PCB specifically for LED circuits. A round LED PCB helps to improve heat dissipation. As a result, it allows the greater performance of assemblies. Round LED PCBs are ideal for applications that demand the use of many LEDs.

A round LED PCB features a lot of properties which makes it a great deal in the electronics world. The truth about this PCB is that they have low power consumption. Manufacturers use aluminum to fabricate round LED PCBs. Round LED PCBs are mostly available in light fixtures. For example, these boards are available in a desk lamp, led strip, etc.

Advantages of Round LED PCB

A round LED PCB offers a lot of advantages. This type of PCB is common in several applications due to the benefits it offers.

• Saves energy
• Allows heat dissipation
• Flexible in design
• Small size
• Resistant to thermal shock and vibrations
• Environmentally friendly

Applications of Round PCB Board

Round PCBs are ideal for use in several applications. Although the round PCB board isn’t as common as the rectangular ones, it is a great option for some applications.

Medical industry

Some medical devices feature a round PCB board since they offer great benefits. These boards are more durable and lighter. Medical devices such as monitoring devices and hearing aid devices feature these boards.

Wearable devices

The production of wearable devices can be a complex one. This is because these devices mostly feature round PCBs. A wearable device needs to be unobtrusive and small. In today’s world wearable devices have become so popular.

Consumer electronics

This is another application of the round PCB board. Consumer electronics are devices that we use in our day-to-day activities. Consumer electronics like smartwatches feature round PCBs.

Telecommunication industry

Some telecommunication devices feature a round PCB board. Since this board offers enough routing and saves more space, it is ideal for this device.  Also, this board is very flexible and durable.

LEDs

Light emitting diodes (LED) also feature round PCBs. The benefits of LED are countless. This lighting incorporates round PCBs due to the flexibility they offer. Round circuit boards have great thermal and electrical properties. These make them ideal for this application.

Types of Round PCB

There are different types of round circuit boards. There are single-sided, double-sided, and multilayer round PCBs. Each of these round PCBs has its functions. Manufacturers design these boards based on the requirements of the intended projects.

Single sided round PCB

A single sided round PCB has one conductive copper layer. This is one of the most common type of round PCBs. Single sided round PCBs are common in several applications. Substrate is the main material in this type of PCB. This type of PCB is ideal for low density designs. A single sided round PCB has components on one side of the board. It then features a conductor pattern on the other side.

The single sided round PCB is the simplest PCB to fabricate. Also, it is also cheaper to fabricate. This PCB is more economical to produce than other round PCBs. The manufacturer can either use through-hole technology or surface mount technology.

Double-sided round PCB

This is another type of round circuit board. The double-sided round PCB features conductive layers on the two sides of the circuit board. This round PCB type has proved to be useful in several applications. Furthermore, it is a preferred option to the single sided round circuit board. These circuit boards are available in lighting systems, wearable devices, and consumer electronics.

Multilayer round PCB

A multilayer round PCB features more than two conductive layers of material. This type of round PCB is ideal for use in high-speed applications. The multilayer round PCB has a lot of benefits. This PCB offers higher assembly density in applications.  This type of round circuit board provides high capacity and more board space. However, the multilayer round PCB is the most complex to fabricate.

How to Choose the Best Round PCB Manufacturer

Round PCB boards are complex to fabricate. Therefore, it is important you choose a round PCB manufacturer that delivers quality. There are several round PCB manufacturers available. However, you should consider some important factors when choosing one.

Experience

This is the first factor you need to consider. You should opt for a round PCB manufacturer that delivers the best quality products. This manufacturer should offer excellent quality and professional service. Choose a manufacturer with long-time experience in the field. You can make an inquiry to know about their products and services.

Quality

Round PCB manufacturers carry out several tests to ensure quality. The best manufacturer will perform several tests. Such a manufacturer will carry out E-test, thermal stress test, microsection testing, and more. These tests help to detect any defects on the circuit board. This manufacturer should also use the best quality materials for your circuit boards.

Turnaround time

The turnaround time is also an important factor. This refers to the time it takes for a manufacturer to deliver a product. You want a manufacturer that delivers your product at your specified time.

Customer service

Some round PCB manufacturers support the research and development efforts of their clients. Such manufacturers are always available to meet your demands. The best manufacturer offers quick quotation response, professional tech support, and customized service. You can inquire about a manufacturer through reviews and comments of past clients.

Frequently Asked Questions

How do I panelize round PCBs?

The best way to panelize a round PCB is through break routing. Ensure you keep 10mm clearance between round circuit boards. This is very important when using a small routing tool. You can increase the clearance when you are using a larger routing tool.

What type of mounting technology is best for round PCBs?

You can either use the SMT or THT method for placing components. However, the surface mount technology is the best method for component placement. This procedure is an automated one. Therefore, it makes the fabrication process much easier. The use of SMT on round PCBs reduces the stress encountered during production.

Conclusion

A round PCB board is ideal for use in both commercial and domestic applications. Not all applications require rectangular or square PCBs. Therefore, there is a need for round PCBs. It is very important you design your circuit board to match your devices’ form factor. Round PCB boards are complex to design. However, with the right software, the designing process can be a straightforward one. Also, it is important to follow some design rules and strategies during the design process.

What is Intel Cyclone 10 FPGA

The Intel Cyclone 10 FPGA is a low-cost, low-power field programmable gate array (FPGA) manufactured by Intel Corporation. First released in 2020, Cyclone 10 is the successor to Intel’s Cyclone V series, targeting cost-sensitive applications that need modest logic capacity and performance.

Some of the key attributes of Cyclone 10 FPGAs include:

• Low cost – Pricing starts under $10 in high volumes, enabling very cost-sensitive designs.
• Low power – Static power as low as 2 mW enables all-day battery life.
• Performance – Up to 150K logic elements delivers suitable performance for IoT edge.
• Small form factors – Compact fine-pitch BGA packages fit space constrained applications.
• Hard IP blocks – PLLs, ADC/DACs, memory interfaces reduce system cost.
• Security features – Hardware security blocks for IP protection and encryption.

With this combination of capabilities, Cyclone 10 aims to provide a balanced FPGA for cost- and power-sensitive embedded vision, industrial, automotive and IoT applications.

Cyclone 10 Architecture

The Cyclone 10 architecture is optimized for lowest cost and power with decent performance. Key aspects of its architecture include:

Manufacturing Process

Cyclone 10 FPGAs are manufactured on TSMC’s 28 nm HPC+ process. The 28 nm node enables a small die size to reduce cost along with 1.0V core voltage operation for low power.

Programmable Logic

The core programmable logic fabric in Cyclone 10 consists of look-up tables (LUTs) and registers as logic elements (LEs), along with local and global routing. It delivers up to 150K LEs and 12 Mbits of embedded RAM blocks.

PLLs

Each device contains up to six phase-locked loops (PLLs) for clock management and synthesis. The PLLs allow frequency synthesis, clock jitter filtering, and zero delay buffering.

ADC/DAC Blocks

For analog interfaces, selected Cyclone 10 variants incorporate two analog-to-digital converters (ADCs) and two digital-to-analog converters (DACs). These enable analog signal processing without external components.

PCI Express

To support high-speed peripherals, Cyclone 10 GX devices integrate up to two PCI Express (PCIe) Gen2 x4 interfaces with data rates up to 5 Gbps each.

Security Architecture

Cyclone 10 includes cryptographic blocks for AES-GCM 128/256-bit encryption to secure FPGA IP and communications. Physical unclonable functions (PUFs) enable device authentication.

Configuration

Cyclone 10 supports active and passive serial configuration schemes, and can also be configured via the PCIe interface. This enables low-cost configuration in volume manufacturing.

I/O Interfaces

A range of external interfaces are supported including LVDS, hyperbus, and general purpose I/Os. Selected devices also incorporate 5 Gbps transceivers for protocols like Ethernet and USB 3.0.

Cyclone 10 FPGA Family

The Cyclone 10 family includes four variants with different features and capabilities:

Cyclone 10 LP

• Lowest power optimized with sleep mode down to 2 mW static power.
• Up to 150K LEs and 10 Mbits RAM.
• Package options down to 4×4 mm.

Cyclone 10 GX

• Adds PCIe Gen2, ADC/DAC blocks, and 5 Gbps transceivers.
• Ideal for edge applications with high-speed interfaces.

Cyclone 10 CX

• Cost-optimized model with one-time programmable (OTP) configuration memory.
• Reduces configuration bitstream storage costs.

Cyclone 10 SX

• Secure variant with additional IP protection and encryption blocks.
• Prevents tampering, cloning, and counterfeiting of FPGA designs.

Within each variant, densities range from 4K LEs up to 150K LEs. The following table summarizes some of the key Cyclone 10 family specifications:

This range of densities and capabilities allows designers to select the optimal balance of features to meet their cost, power, and performance requirements.

Development Kits

To accelerate designs with Cyclone 10, Intel provides low-cost development kits including:

• Cyclone 10 GX FPGA Development Kit – Features the 10CX220YF324I device with PCIe, 150K LEs, transceivers and ADC/DAC.
• Cyclone 10 LP Development Kit – Lowest power oriented with the 10CL016YU256I8G device providing 16K LEs.
• Intel SoCKit Development Kit – Cost-optimized with the 10M02SCU324I7G Cyclone 10 CX FPGA.

These kits provide Cyclone 10 FPGA samples along with interfaces, peripherals, accessories and software for evaluating the capabilities. Reference designs and tutorials are also available to help designers get started quickly.

Design and Programming

For designing with Cyclone 10 FPGAs, Intel provides the Quartus Prime design software. Quartus Prime includes all the tools for:

• Design entry – Using VHDL, Verilog or schematic capture.
• Simulation – Hardware simulation and verification.
• Synthesis – Converting HDL designs into physical circuits.
• Place and route – Mapping design to FPGA logic elements.
• Timing analysis – Ensuring design meets timing requirements.
• Programming – Generating FPGA configuration bitstream.

In addition, a ModelSim simulator is provided for performing behavioral simulations. The IP Catalog within Quartus Prime gives access to a large library of ready-to-use IP cores for common functions.

To develop software for embedded processors in Cyclone 10 FPGAs, the Nios II embedded design suite (EDS) is available. This provides a full environment for creating, debugging and profiling Nios II software.

Power Optimization

Since low power operation is a key priority for Cyclone 10 FPGAs, Intel provides multiple techniques to optimize and reduce power:

• Support for 1.0V VCC core supply voltage minimizes dynamic power.
• Sleep modes allow FPGA to be powered off when idle.
• Clock gating and power gating reduce activity when circuits are inactive.
• Smart voltage ID sets core voltage based on frequency to save power.
• Low static power I/Os reduce I/O interface leakage.
• Power-driven compilation optimizes design power during place and route.

Using these techniques, many Cyclone 10 FPGA designs can operate all day on just a coin cell battery.

Security Features

To protect FPGA designs and data, Cyclone 10 incorporates security capabilities including:

• 256-bit AES encryption blocks for securing internal and external communications.
• Physical unclonable functions (PUF) for device authentication and binding designs to specific FPGAs.
• SHA cryptographic hashing for secure boot of FPGA images.
• Non-volatile eFUSE bits to store encryption keys and configuration settings.
• Tamper detection circuits to actively monitor for tampering attempts.

These features allow Cyclone 10 to provide robust protection against cloning, overbuilding, counterfeiting, and tampering of FPGA designs.

Target Applications

The combination of low cost, low power, and security make Cyclone 10 FPGAs ideal for a wide variety of embedded and IoT applications including:

• Battery powered wearables
• Industrial automation
• Vision systems
• Motor control
• Smart home/building
• IoT edge nodes
• Automotive sensor processing
• Broadcast equipment
• Aerospace avionics

For these applications, Cyclone 10 delivers the right-sized logic capacity with minimal power draw in compact and cost-effective packages. The integrated ADCs, DACs, PCIe, and transceivers enable advanced connectivity and signal processing without external components.

Conclusion

In summary, the Intel Cyclone 10 FPGA provides a compelling blend of low cost, low power, performance and security for embedded vision, industrial, automotive and IoT designs. With up to 150K LEs, hard IP blocks, and advanced power optimization, Cyclone 10 achieves new levels of power efficiency at minimal cost. For embedded systems needing energy efficiency on a tight budget, Cyclone 10 is an ideal fit.

Frequently Asked Questions

Here are some common questions about the Cyclone 10 FPGA:

What foundry process is Cyclone 10 manufactured on?

Cyclone 10 FPGAs are fabricated on TSMC’s 28 nm HPC+ process, enabling a low-cost and low-power optimized device.

What is the main difference between Cyclone 10 LP and GX variants?

The Cyclone 10 LP focuses purely on lowest power operation, while the GX adds integrated PCIe, ADC/DAC blocks and high-speed transceivers for more advanced I/O connectivity.

Does Cyclone 10 have any hard processor cores?

No, Cyclone 10 does not have integrated processor cores like ARM CPUs. But it can implement soft processor cores like the Nios II and MicroBlaze within the FPGA fabric itself.

What configuration modes does Cyclone 10 support?

Cyclone 10 supports both active and passive serial configuration over a SPI-like interface. Parallel configuration modes like SelectMAP are not supported.

What is the typical static power consumption of Cyclone 10 parts?

Static power consumption ranges from around 2-3 mW for the ultra low power variants up to around 100 mW for the high-end GX parts. Exact power depends on specific device density and speed grade.

Features of Intel Cyclone 10 FPGA Boards

The new Cyclone 10 FPGA board is a two-layer PCB with I/O, 20MHz clock generator, and up to 20MBps Ethernet.

Ethernet connectivity

Intel Cyclone 10 FPGA board includes a high-speed 100Mb/s Gigabit Ethernet MAC, programmed to any Ethernet protocol. The Ethernet interface provides an easy way to connect your design to a PC for debugging and data storage. It also provides a powerful tool for monitoring serial and parallel interfaces.

The ease of use of the Ethernet interface is suitable for both prototyping and production. For example, if you prototyped your design by using our Xilinx ISE Design Suite 10.1 design tools, the new board makes it easy to reconfigure your design at any time. Furthermore, you can change clock speed or peripheral configuration by clicking the USB mouse button and selecting the new settings.

USB connectivity

The Intel Cyclone 10 FPGA board supports two full-speed USB 2.0 interfaces. SO, it allows you to configure any of the four HSUARTs or six USI modules as a USB device. You can even connect multiple USB devices simultaneously if you wish. In addition, the board supports a Xilinx I/O expander which we can use to provide even more bandwidth from the FPGA without adding an external CPU.

The USB interface provides a convenient way to connect to your Intel Cyclone 10 FPGA board. Plug in your USB cable and program the device through IP, SPI, or JTAG. So, the built-in switching regulator accepts anything from 3.3V to 5V, so you can power your design directly from your PC.

Debugging with USB

The new Intel Cyclone 10 FPGA board includes a built-in USB 2.0 interface. It provides an easy way to debug your design through IP, SPI, JTAG, or Xilinx I/O expander. In addition, the board features an embedded oscillator. As a result, it provides a switching voltage regulator for powering any of the four HSUARTs or six USI modules without external components.

The large debugging LED is present on the bottom side of the board to make debugging easier. After that connecting a JTAG cable provides a simple way to monitor the entire FPGA. On the other side, you can monitor the USB interface connection through debug IO.

USB power

The built-in switching voltage regulator on the new Intel Cyclone 10 FPGA board provides a high-speed 5V to 3.3V power interface. This allows you to power any USB device directly from your PC, including a development board through an ExpressCard slot or any other device with a USB connector.

The Intel Cyclone 10 FPGA board is easy to use. Firstly, connect your design to the onboard mikroBUS connector, and you are ready to get started. Then the mikroBUS connector provides power, reset, JTAG, and 26 GPIO by default. Afterward, you can add any of the mikroBUS devices using only your USB cable and a PC. Additionally, you can do this without a hardware probe or a hardware debugger.

DSP Blocks

We can configure the Intel Cyclone 10 FPGA board with eight Digital Signal Processing (DSP) blocks through the USB connection. These DSP blocks are useful in various ways, including:

• Matrix multiplication and convolution (and fast Fourier transforms).
• Audio and video processing (such as audio echo cancellation).
• Data encryption and decryption.
• Digital cell baseband modems.
• Frequency offset correction.
• Modular arithmetic units.
• Denoising and packet loss concealment for speech coding.
• Finally, Video display processing with alpha blending.

The DSP blocks are useful as a functional core with a simple control interface. Therefore, it consists of a few registers or as a ready-to-use block programmed with an included firmware file using the USB interface.

Single Event Upset (SEU) Mitigation

The new Intel Cyclone 10 FPGA board is the first FPGA platform to include on-chip SEU Mitigation features. Therefore, Xilinx has two levels of protection for all on-chip memory. They include configuration flash, trust flash, and user flash.

Firstly, the initial level of protection is the checksum feature. This feature protects against “mass effect” single event upsets. They can occur during manufacturing or handling defects. Secondly, the next level is the use of silicon error correction codes (ECC). It protects against “targeted” single event upsets, such as gamma radiation.

Transceivers (12.5 Gbps)

The Intel Cyclone 10 FPGA board supports up to four 12.5Gbps transceivers. So, each transceiver consists of four differential LVDS pairs. They are essential in implementing the SGMII interface. It means it can support up to 8 lanes at 12.5Gbps due to LVDS drivers for this interface.

FPGAImg has a library that encapsulates the Transceiver Macrocell 1 (XCVR1). This library provides a simple interface for programming the transceivers through the USB connection. Therefore, this library helps to simplify your design and eliminate the possibility of errors due to incorrect register usage.

SPI Flash Programming

The new Intel Cyclone 10 FPGA board includes a two Mbit SPI flash memory device connected to one of the FPGA’s SPI ports. So, you can program this flash device from your PC with our SW4STM32 tool within our Free Software Download.

Our FPGA image for the Intel Cyclone 10 FPGA board includes many ready-to-use designs. You can find these designs in different folders, including:

• The External Memories (for connecting to external memory blocks through the DDR memory bus).
• AXI4 examples (for connecting to the FPGA through the AXI4 bus).
• External Peripherals examples (to connect to external peripherals, for example, to connect an LCD).

Nios II Processor

The Intel Cyclone 10 FPGA board implements a Nios II processor and associated peripherals, including:

• Signal generator and multiplexer
• Real-time clock with CIP-51 interfaces
• Nios II debug application

Benefits Intel Cyclone 10 FPGA Boards

The Intel Cyclone 10 FPGA boards offer several benefits for your design:

Easy to use MPU

The MPU block comes with the Intel Cyclone 10 FPGA board, and it allows you to program any FPGA’s 256 K-bit wide memory spaces easily. SO, you can program this MPU through JTAG or a Xilinx I/O expander.

USB 2.0 Interface

The new Intel Cyclone 10 FPGA board includes a built-in USB 2.0 interface. Therefore, it provides an easy way to debug your design through IP, SPI, JTAG, or Xilinx I/O expander.

Debugging with USB

The new Intel Cyclone 10 FPGA board includes a built-in USB 2.0 interface. Moreover, it provides an easy way to debug your design through IP, SPI, JTAG, or Xilinx I/O expander.

Increase productivity

Develop your design with the Intel Cyclone 10 FPGA board. It supports up to 1024Kbit wide memories, allowing you to store programs directly on the FPGA’s RAM. Additionally, it includes several ready-to-use designs for various applications.

Reduce Engineering time

Increase productivity with the Intel Cyclone 10 FPGA board. Similarly, it supports up to 1024Kbit wide memories, allowing you to store programs directly on the FPGA’s RAM. In addition, it includes several ready-to-use designs for various applications.

Free tools for mixed-language development

The Intel Cyclone 10 FPGA board is compatible with several Eclipse-based Intel Quartus Prime software development tools. Additionally, it supports the free C/C++ and System Verilog USB software stack (for high-level synthesis and formal verification).

Integration

The Intel Cyclone 10 FPGA board allows you to integrate your design quickly and easily with the rest of the system. Additionally, it provides several ways to connect your design to the rest of the world.

Reduce maintenance costs

The Intel Cyclone 10 FPGA board is compatible with several IEEE standard communication protocols. Moreover, it uses the FPGA as a mixed-signal processor. It provides several ways to connect your design to the rest of the world.

Drawbacks of Intel Cyclone 10 FPGA Boards

The Intel Cyclone 10 FPGA boards support up to four 12.5Gbps transceivers and eight 12.5Gbps LVDS channels. As a result, the FPGA’s internal 5 Gbps memory bandwidth can still handle excess transceiver and channel traffic.

The new Intel Cyclone 10 FPGA board is not compatible with earlier FPGA boards, such as the 7 Series (the XC7SX-4C). So, this makes it incompatible with all existing designs. Consequently, it is not compatible with FPGA boards from other vendors. For instance, Altera and Xilinx, the maximum memory width supported by those boards is 64 bits.

The new Intel Cyclone 10 FPGA board does not support Xilinx tools such as Quartus II software and will only run the free SW4STM32 tool provided in our Free Software Download.

In addition, the new Intel Cyclone 10 FPGA board does not support Flash programming or debug Flash programming. Then, one can accomplish this using the JTAG interface. But this is less efficient than the SPI flash interface.

The new Intel Cyclone 10 FPGA board is not for high-throughput applications, such as high-performance data acquisition systems.

Moreover, the Intel Cyclone 10 FPGA board does not support AXI4 and has only one AXI4 bus. So, this makes it incompatible with other FPGA boards which implement AXI4, such as the Xilinx XC7SX-6C.

The new Intel Cyclone 10 FPGA board has only one DDR memory bus. Unfortunately, this makes it incompatible with other FPGA boards which implement an additional DDR memory path, such as the Altera XC6LX25-6K.

Intel Cyclone 10 FGAs Design Tools

Getting started with the Intel Cyclone 10 FPGA boards is easy when you use the free software and development tools available in the Intel Quartus Prime software.

Development kit

The Intel Cyclone 10 FPGA Development Kit includes all the hardware that you need to start your design. Above all, this development kit consists of an Intel Cyclone 10 FPGA board, probe card, cables, and software tools.

Features of the Intel Cyclone 10 FPGA development kit include:

The board is directly compatible with the Altera DE2 boards. The Altera DE2-115 board offers the same features as the Intel Cyclone 10 FPGA board, plus additional features such as USB programming. So, the Altera DE2-115 board is also directly compatible with the Xilinx DE2 boards.

The Intel Cyclone 10 FPGA boards include a probe card that allows you to easily access signals within your design. In other words, you can connect the probe card through a common PCB test point or connected directly through the JTAG or HSI interface. You can also connect several cards on the same bus, allowing you to view signals from multiple cards simultaneously.

The Intel Cyclone 10 FGPA Probe Card is a customizable development and debug probe card used in many embedded applications. So, the card supports four signal groups, each of which we can individually assign to one of the four HSI channels. It also supports one debug or programming bus at 5V or 3.3V voltages. In conclusion, the debug bus signals are available for your application when you’re running in user mode (application mode).

Software

The Intel Cyclone 10 FPGA boards allow you to access and interact with the board using your host PC through the USB port. These tools include:

Also, the Intel Cyclone 10 FPGA boards also support standard communication protocols such as UART, SPI, I2C, and AXI4. This lets you easily interface with industry-standard peripheral devices such as EEPROMs, SRAMs, DRAMs, and flash memory.

Intel Cyclone 10 FPGA boards also support several IEEE standards for communications applications. For instance the Inter-Integrated Circuit (I2C) protocol for system integration. It also provides standard interfaces to external memory devices like DRAMs, SRAMs, and Flash Memories.

The Intel Cyclone 10 FPGA boards include a unique Xilinx-based high-speed memory controller subsystem. This subsystem supports both the standard memory-mapped application programming interface (API) and a new memory-centric API.

To top it off, the new Intel Cyclone 10 FPGA board uses the Xilinx XC6SLX25-4K128K device from Altera. This device extends the Xilinx Spartan 6 FPGA family, a low-cost, highly integrated FPGA with many signals and I/O pins exposed on a single AXI VGA connector.

Applications of Intel Cyclone 10 FPGA Boards

The new Intel Cyclone 10 FPGA boards are one of the fastest ways to connect your design to the rest of the world. So, the FPGA boards are compatible with standard JTAG interfaces, SPI buses, and USB ports.

Machine Vision: High performance and low power:

As an actual embedded vision development board, the Intel Cyclone 10 FPGA is ideal for machine vision and high-performance embedded vision applications. Therefore, you can use the I2C memory interface to connect an image sensor such as a 2D or 3D camera with an onboard image processing unit (IPU). You can also use the I2C interface to connect a video camera, such as the popular USB-2 VisionCam, and capture still and video images.

Smart Vision: High performance and low power:

Use the FPGA boards to perform pre-processing and analysis on image data blocks before transferring them to a PC or microprocessor for post-processing and analysis.

Industrial Fog Computing in SDA Environments:

The Intel Cyclone 10 FPGA provides a powerful platform for industrial fog computing in smart factories, with its high-speed onboard memory and high-speed onboard memory controller subsystem.

Medical Imaging: High performance and low power:

Use the onboard image processing subsystem to manipulate images from a camera or an ultrasound or MRI machine. Then forward data from the onboard image processor to a PC or server over the USB 2.0 interface.

Industrial Drives: High performance and low power:

Use the FPGA to control servo motors, stepper motors, or DC brush motors. Moreover, you can use the FPGA to read data from sensors in your motor system. The high-speed memory controller subsystem allows storing data blocks in memory buffers without stalling host processor transfers. As a result, the FPGA can support real-time image processing of image data received from intelligent cameras outside the factory, transferring only relevant images to the server for further analysis.

Pro A/V: High performance and low power:

Utilize the Intel Cyclone 10 to digitize, decode, loop, and mix audio in high fidelity. Use it in video sequence capture/storage applications for image-based video editing. You can then use it in multi-camera live video streaming applications for the synchronization of multiple cameras.

Intel Cyclone 10 FPGA Boards family and specifications

[ACM-033] Intel Cyclone 10 LP F484 FPGA board

The ACM-033 family is a Japanese product that has RoHS compliance. It comes with an immersion gold high-quality six-layer PCB and a 10-pin socket JTAG connector. The Status LED for done and Power functions make it easier to operate. Also, you will also find a Power-on Reset IC, user LEX x2, 50MHz onboard oscillator, 128Mbit Micron SPI-Flash Memory, and 256Mbit Alliance Memory SDRAM. ACM-033 family also uses a 3.3 V single power supply operation.

The family consist of 10CL120YF484C8G (ACM-033-120), 10CL080YF484C8G (ACM-033-80), 10CL055YF484C8G (ACM-033-55), 10CL040YF484C8G (ACM-033-40), and 10CL016YF484C8G (ACM-033-16). They have the following features:

[ACM-114] Intel Cyclone10 LP F484 FPGA board

The ACM-144 family also has similar specification to the ACM-033 family except for 2.5 V, 1.2 V on-board regulators in addition to 3.3V single power supply operation. This family consist of 10CL120YF484C8G (ACM-033-120), 10CL080YF484C8G (ACM-033-80), 10CL055YF484C8G (ACM-033-55), 10CL040YF484C8G (ACM-033-40), and 10CL016YF484C8G (ACM-033-16).

They have the following features:

[ACM-115L] Intel Cyclone 10 GX FPGA board

The ACM-115L is very simple and compact. It uses a 3.3V single power supply operation. These products come from Japan and adhere to RoHS compliance. Moreover, the family consist of 10CX220YF672I5G (ACM-115L-220), 10CX150YF672I5G (ACM-115L-150), and 10CX105YF672I5G (ACM-115L-105)

They have the following features:

[ACM-208] Intel Cyclone 10 LP F780 FPGA board

The ACM-208 family consist of 10CL120YF780C8G and 10CL080YF780C8G and have the following attributes:

[ACM-308] Intel Cyclone 10 LP E144 FPGA board

The family consists of 10CL025YE144, 10CL016YE144, 10CL010YE144, and 10CL006YE144.

ACM-308 has the following specifications:

[AP68-09] Intel Cyclone 10 LP PLCC68 FPGA Module

This module is a 68-pin device that offers you high performance. Additionally, it uses a DIP PLCC socket because it is compact. Like other modules, it uses 3.3V single power supply operation. The family comprises of 10CL025YU256C8G, 10CL016YU256C8G, 10CL010YU256C8G, and 10CL006YU256C8G.

[EDA-011] Intel Cyclone 10 LP F484 USB-FPGA board

The EDA-011 family has similar characteristics to a majority of the models and has the following types: 10CL120YF484C8G, 10CL080YF484C8G, 10CL055YF484C8G, 10CL040YF484C8G, and 10CL016YF484C8G.

[EDA-013] Intel Cyclone 10 LP USB-FPGA board, FTDI USB 3.0 FT601

This product is a high-performance, USB-to-FPGA board. The Cyclone 10 LP features two on-chip 100 Gigabit Ethernet NICs that work independently or as one unit on Intel Atom E3800 series processors up to 35W TDP and an on-chip PCI Express Gen3 interface for both host and peripheral devices. It consists of 10CL0120YF780C8G and 10CL080YF780C8G. In addition, they have the following specifications.

Conclusion

So, do you want to design your FPGA boards? All you need is this Intel Cyclone 10 FPGA Board. It is a straightforward interface for everyone.

The Intel (Altera) Cyclone V FPGA family is one of the newest members of the Altera line-up. While this is the first time many people see these boards publicly, they have been in use for quite some time. This article will look at what makes this part special and why it might soon replace other parts of Altera‘s current line-up.

What is Altera Cyclone V

The Altera Cyclone V is a family of low-power field-programmable gate arrays (FPGAs) manufactured by Intel (formerly Altera Corporation). Introduced in 2010, Cyclone V FPGAs provide a balance of low power consumption, performance, and cost for mid-range applications such as industrial automation, automotive infotainment, and digital displays.

Some key features of the Cyclone V family include:

• Low power consumption – Cyclone V FPGAs consume as little as 3 Watts static power thanks to Intels 40 nm process technology. This makes them suitable for battery-powered and green energy applications.
• Performance – With a maximum frequency of 300 MHz, Cyclone V delivers up to 220K logic elements (LEs) and 96 Mbits of RAM to meet the needs of mid-range applications.
• Cost-optimized – Pricing starts below $25 USD for high volume orders, providing an affordable option compared to higher cost FPGAs.
• DSP blocks – Up to 220 18×18 multipliers allow for digital signal processing in applications like motor control and software-defined radio.
• Multi-protocol communication – Support for protocols like Ethernet, USB, and PCIe allow for easy system connectivity.
• Partial reconfiguration – The ability to reconfigure part of the FPGA while the rest remains active can help reduce power consumption.

This combination of features has made the Cyclone V series a popular choice for industrial, medical, automotive, and consumer applications that require low cost and power efficiency.

Cyclone V Architecture

The Cyclone V architecture is built on a 40 nm process technology, which enables low static power consumption and a high logic density up to 220K LEs. The FPGA fabric consists of the following key components:

Logic Elements

The basic building block of Cyclone V FPGAs is the logic element (LE). Each LE consists of a 4-input look-up table (LUT) capable of implementing any 4-input logic function, along with a register to implement sequential logic. Cyclone V provides a abundant 120,000 to 220,000 LEs, allowing designers to synthesize complex logic functions.

Embedded Memory

Cyclone V provides approximately 10 Mbits of embedded memory blocks that can be used to implement FIFO buffers, RAM, and ROM functions within the FPGA fabric. Each device has between 160 to 594 M9K blocks, each block providing up to 9 Kbits of storage. For larger memory needs, Cyclone V also includes up to 16 Mbits of larger M144K blocks.

DSP Blocks

For digital signal processing functions, Cyclone V incorporates dedicated high-performance 9×9 multiply and accumulate DSP blocks. Each block can perform one 18×18 multiply accumulate operation per clock cycle. The larger devices in the family provide up to 220 of these DSP blocks.

Clock Management

Flexible clock management is critical for FPGAs, and Cyclone V provides up to 12 global clocks that can drive throughout the device. Each clock can be individually programmed for frequency synthesis, deskew, and dynamic phase shifting. There are also up to 88 low-skew routing clocks per device.

I/O

A wide variety of external interfaces can be implemented with Cyclone V I/O capabilities. Multi-voltage I/O banks support common standards like 3.3V LVTTL as well as 2.5V LVCMOS and 1.8V LVCMOS. High-speed inputs support data rates up to 1.6 Gbps. General purpose I/O provide flexibility for a wide range of applications.

Transceivers

For high-speed communications, selected Cyclone V variants incorporate up to four transceiver blocks. These multi-gigabit transceivers support data rates up to 6.5 Gbps for protocols like Ethernet, Fibre Channel, XAUI, and RapidIO. Each transceiver channel contains dedicated PLLs, clock data recovery, and channel alignment logic.

Configuration

Cyclone V can be configured using industry-standard methods like active/passive serial, JTAG, and AS configuration schemes. This allows the use of low-cost configuration devices and easy interfacing with common microprocessors. Partial reconfiguration is also supported for dynamically modifying sections of the FPGA while the rest continues operation.

Cyclone V FPGA Family

The Cyclone V family includes devices in four variants optimized for different applications:

• E – Mainstream low cost FPGAs
• GX – Transceiver variants with 2-4 transceiver channels
• GT – High performance transceiver variants with 6-16 transceivers
• SE – Lowest power optimized variants

Within each variant, different densities are available with different amounts of LEs, memory, DSP blocks, and transceivers. The following table summarizes the Cyclone V family specifications:

This range of densities allows designers to choose the optimal Cyclone V device to match their specific requirements. The highest density 5CGXFC9 provides a potent combination of logic, memory, DSP, and transceiver capability in a low power, cost-optimized package.

Cyclone V Development Kits

To simplify the design process, Intel provides a range of development boards and kits for Cyclone V FPGAs:

• Terasic DE1-SoC – Features a Cyclone V 5CSEBA6U23I7N FPGA with 85K LEs, along with ARM Cortex-A9 processor and video interfaces.
• Intel Cyclone V GX Starter Kit – Highlights the 5CGXFC9 transceiver capabilities with PCIe x4, SATA-II, and Gigabit Ethernet interfaces.
• Intel Cyclone V SE Starter Kit – Demonstrates lowest power operation with the 5CSEMA5F31C6 FPGA variant.
• Arrow SoCKit – Cost-optimized board with Cyclone V 5CSEBA6U23I7 FPGA SoC.

Using these kits, developers can start implementing and testing their designs with the Cyclone V hardware and software environment. The kits provide easy access to peripherals like memories, interfaces, switches, buttons, and displays. Many example designs and tutorials are available both from Intel and third parties to accelerate learning. Once a design is completed and tested, it can be migrated to a custom PCB for production.

Design Tools

To support Cyclone V developers, Intel provides a robust design environment:

• Quartus Prime – FPGA design software with support all major HDLs like Verilog and VHDL. Includes logic synthesis, place and route, timing analysis, power optimization and simulation tools.
• ModelSim – HDL simulator for verifying and debugging FPGA designs without hardware.
• Nios II EDS – For developing embedded software for the Nios II softcore CPU that runs within the Cyclone V fabric.
• Qsys – Tool for integrating intellectual property (IP) blocks into system-level designs.
• DSP Builder – High-level block diagram tool for developing DSP systems with the Cyclone V DSP blocks.

This suite of tools provides everything needed for a complete FPGA design flow from conception through verification and debug. The tools support simulation, synthesis, place and route, timing analysis, power optimization and programming of the final bitstream.

Applications

With its combination of low power, performance and cost, the Cyclone V family targets a wide variety of applications including:

• Industrial Automation – Programmable automation controllers, motor drives, robotics, and factory automation.
• Automotive – Infotainment systems, driver assistance, camera processing, USB connectivity.
• Consumer – Digital cameras, home automation, portable electronics.
• Medical – Diagnostic systems, ultrasound, imaging, healthcare IoT.
• Aerospace and Defense – Avionics systems, ruggedized electronics, radar processing.
• Wired Communications – Switches, routers, FTTx, optical networking.
• Wireless Communications – 4G/LTE infrastructure, baseband processing, small cells.

For these applications, Cyclone V provides an optimal balance of capability and power efficiency in a cost-effective design. The low power eases thermal design while maintaining the performance needed.

Some specific customer examples include:

• Glidecam – Portable camera stabilization system uses Cyclone V for control algorithms.
• Nutaq – Software-defined radio platform built on Cyclone V FPGA.
• Foxconn – High-volume manufacturing uses Cyclone V SoCs for quality control systems.

Comparison to Other FPGAs

Cyclone V is positioned between Intel’s low-cost Max 10 FPGA family and higher-end Arria series FPGAs in terms of price and performance:

Max 10

• Lower cost, power and performance
• Up to 50K LEs
• Single power supply 1.2V
• No transceivers

Cyclone V

• Mainstream cost/performance/power
• Up to 220K LEs
• Dual power supply 1.1V and 2.5/3.3V I/O
• Optional integrated transceivers

Arria V

• Higher performance, power and cost
• Up to 1.5M LEs
• Dual power supply 1.1V and 2.5/3.3V
• Up to 96 transceiver channels

Compared to competing mid-range FPGAs, Cyclone V differentiates with lower power consumption while maintaining high logic density and hard IP blocks for memory and DSP:

Overall, Cyclone V hits a sweet spot between the capabilities, power efficiency and cost structure desired by many mid-range applications.

Conclusion

In summary, the Cyclone V FPGA family provides an optimal balance of low power consumption, performance, and cost for mid-range applications. Key capabilities include:

• Low power 40nm process technology.
• Up to 220K LE programmable logic.
• Embedded memory and DSP blocks.
• Optional integrated multi-gigabit transceivers.
• Mature design tools and IP ecosystem.

For industrial, automotive, consumer and communications markets needing energy efficiency and low cost, Cyclone V FPGAs are an excellent fit. With its high logic density, ample hard IP blocks, and aggressive power optimization, Cyclone V continues as a popular mid-range FPGA family.

Frequently Asked Questions

Here are some common questions about the Altera Cyclone V FPGA:

What process node is Cyclone V based on?

Cyclone V is manufactured on TSMC’s 40 nm low power CMOS process technology. This provides a good combination of density, performance and low static power.

What FPGA families are higher and lower than Cyclone V?

In Intel’s FPGA lineup, Cyclone V sits between the low cost Max 10 FPGAs and higher end Arria V FPGAs. Max 10 targets lowest cost while Arria V adds more performance and capabilities for high end applications.

What types of clock management blocks are in Cyclone V?

Cyclone V provides up to 12 global clocks that can drive throughout the FPGA. Each clock has individual clock control blocks with frequency synthesis, deskew, and dynamic reconfiguration. There are also up to 88 low-skew routing clocks per device.

How many I/O standards are supported by Cyclone V?

Cyclone V supports a wide range of I/O standards including 3.3V LVTTL, 2.5V LVCMOS, 1.8V LVCMOS, SSTL, HSTL, and differential standards. Multi-voltage I/Os allow interfacing to different voltage domains.

What configuration schemes can be used with Cyclone V?

Cyclone V supports active serial, passive serial, JTAG, and AS (fast passive parallel) configuration schemes. This allows low cost configuration solutions as well as processor-based configuration.

Cyclone V in Comparison to Other FPGAs

Cyclone V is available in all three of Altera’s technology nodes: Stratix 10 (10nm), Stratix 11 (16nm), and Stratix 12 (14nm). In the Stratix 10 technology node, this is at its smallest point. In addition, the Cyclone V adds 12-bit A/D converters, which is a new addition from the previous generation.

Stratix 11 and Stratix 12 have several differences between them in their Cyclone V offerings. Most notable is that Stratix 11 offers a 16-bit multiplier block with both add and divide functionality. On the other hand, Stratix 12 only offers a 16-bit multiplier block that does not have any add or divide functionality. Additionally, Stratix 12 offers a 16-bit multiplier block with only add functionality. But Stratix 11 offers both add and multiply functionality.

The other change is that Stratix 11 does not support on-chip memory while the other two do. However, since we know that this is due to the manufacturing of Stratix 11 on TSMC’s v10 60nm process while we make the other two on TSMC’s 10nm node, it is still unclear whether this is true.

The Cyclone V also differs from the previous Cyclone IV parts in that the memory interface is in a different location. They moved it off the FPGA chip itself and put on an L4 device called the C5N. This allows for better routing between FPGA companies.

Cyclone V Information

The Cyclone V family has three different models, broken down by technology node, and these are 10LX, 10LX-S, and 10SS. The 10LX-S has a data rate of 60MHz, while the other two have a 40MHz data rate. Both have 16GB of onboard FLASH memory, while the C5N has up to 192GB of external memory.

The online documentation for this part is available at the CFE (Component Firmware Engine). The documentation includes a full pin-out of the part as well as device-specific information. It also includes a full description of the onboard memory built on a 10nm process. You can lock the FPGA from 100MHz to 400MHz, and the C5N from 100MHz to 400MHz

The latest version of Quartus II is Q2 2017 SP1, allowing Altera users to access Cyclone V within their systems.

Intel (Altera) Cyclone V FPGA Boards features

Features of the Intel (Altera) Cyclone V FPGA Boards include:

Cyclone V Architecture

36 customizable Digital Input/Output (I/O) blocks + 6 clock I/O blocks. The new Integrated Memory Controller (IMC) provides both on-chip and off-chip memories. It has 56-bit wide multipliers with multi-precision support.

Hardware FPGA Firmware for advanced security, intelligent routing, power management, and advanced programmable logic functions. Support for advanced bytewise programming operations such as Array Interleaving and Inline Operation.

Advanced tools for automated design and verification

Performance improvements on or above the previous generation

Cyclone V has more I/O pins than the rest of the Altera FPGA families. It allows for the combination of more FPGA devices. So there are no pluggable daughter boards. The board supports 8GB of onboard FLASH memory, which we can use as on-chip or off-chip memory.

Flexible Interface Support

Cyclone V has multiple options for interfacing to the C5N with speeds up to 10Gbps. There are four QSGMII transceivers, which are useful for gigabit ethernet. It also supports four SGMII transceivers used for serial communications protocols such as PCI Express Gen 2.

This FPGA has an integrated serial transceiver with multiple options for interfacing up to 10Gbps. Thus, it is useful for high-speed serial communication protocols such as PCI Express Gen 3.

Abundant Hard IP

There are over 120 IP blocks for easy integration of the Cyclone V into an application. The various Altera FPGA families have different IP blocks, but they are all available in Cyclone V.

Slice-based FPGA Architecture

Cyclone V slices its array into 64 slices. This means that the entire array is smaller than a regular FPGA part. But it still has all the functionality that Altera’s current FPGA chips provide.

Design Security

There is a hardware-based security mechanism, which we can use to prevent writing to data that may need erasing. This hardware protection is separate from the software control over who has access to the various bits within the FPGA.

The Cyclone V has a 128-bit hardware-based data integrity checker. It ensures that the part will output the same results as it would if you hand-programmed it manually. The checker uses a look-up table for this purpose.

Connectivity

The Cyclone V has an on-chip Ethernet controller with functionality for gigabit ethernet, 10GBase-T Ethernet, and PCI Express Gen 2. In addition, the serial transceiver supports SGMII, QSGMII, PCI Express Gen 2, and other serial interfaces.

A GPIO interface on the Cyclone V provides a standard set of inputs and outputs for connecting to other FPGAs. We can use this interface to connect to other chips with the right signals.

The Cyclone V also has a USB 3.1 controller that is capable of up to 20Gbps. We use eight FSMC USB controllers for wireless communication using protocols such as Bluetooth and Wi-Fi. The board also has two CAN controllers for communicating over CAN Bus networks.

Multiport Memory Controller

The on-chip memory has two ports, allowing it to interface with external memories using two different protocols. It allows for using the part in applications that require high-speed block-level access to external memory. So it makes it useful for cloud computing or scientific analysis applications.

Extended Power Management

The Cyclone V has extensive power management functionality. As a result it allows greater flexibility in system design. For example, it can alter its clock frequency based on current operating conditions. Also, it disables unused modules to control power consumption. It is compatible with the USB 3.1 SuperSpeed Plus standard for up to 20Gbps data transfer speeds.

Cyclone V also has “Embedded Debug Support.” It provides on-chip debugging functionality at low power consumption. We can use it to debug applications embedded in the FPGA, which is ideal for debugging.

Silicon and Architectural Optimizations

Several silicon and architectural optimizations are products of Cyclone V. These include a different set of memory control blocks. They allow the device to run faster and with less power. There is also a larger set of multipliers, which can optimize the FPGA’s performance.

10LX-S – The 10LX-S has a data rate of 60MHz while the other two have a 40MHz data rate.

Benefits of using Intel (Altera) Cyclone V FPGA Boards

The main advantages of using an Intel (Altera) Cyclone V FPGA Boards are as follows:

Tailored for High-Volume, Cost-Sensitive Applications

The Cyclone V is the lowest cost FPGA from Altera’s FPGA line-up. This makes it ideal for applications that need a large amount of I/O but don’t have a lot of space available to put the FPGA device. In addition, it includes applications such as networking and other large high-speed communications.

Flexible Integration Options

There are several options for integrating the Cyclone V into a system using Altera’s standard tools. There are four QSGMII transceivers, which we use for ethernet and other networking applications. We also use four SGMII transceivers for serial communications protocols such as PCIe Gen 2 and various network protocols.

Versatile Design

The Cyclone V has many different options for interfacing with other chips. There are four QSGMII transceivers, which we use for ethernet and other network applications. There is also a set of eight FSMC USB transceivers that are useful for USB 3.1 communication.

Tailored for High-Performance Designs

The Cyclone V has numerous performance features that allow its optimization for high-performance applications where the main limitation is the size of the FPGA part. The Cyclone V has a hardware-based checker, which makes it more secure. It runs at a higher speed than previous Altera FPGA parts. The Cyclone V also has larger multipliers. So, it allows the Cyclone V optimization for many different applications.

SoC FPGAs–Your Customizable ARM* Processor-Based SoC

The Cyclone V is an ARM* processor-based FPGA that allows you to implement an ARM system on a single chip. It is a member of the Cyclone family. In other words, it provides a full set of FPGA blocks and IP for implementing most ARM processor functions. It includes the entire memory subsystem, I/O subsystem, and peripheral control. We can use the Cyclone V in an end-to-end design where we place it after the ARM core and before the rest of the SoC device.

Reducing Total System Cost through Integration

Cyclone V can reduce the cost of a system by replacing many discrete components in an SoC. They include the main processing core, memory, DSP, display controller, and other peripheral chips. This approach is attractive to leading companies such a RayMing PCB and Assembly that are looking for a way to reduce the total system cost.

End-to-End System Design

We can use the Cyclone V in an end-to-end design where it’s placed after the ARM core and before the rest of the SoC device. Other FPGAs provide all processing blocks required to implement an ARM SoC with all peripherals, memory, DSP, and I/O devices.

Industry-Leading Low Power and Low System Cost

Cyclone V uses the same high-performance architecture as other Altera FPGAs, such as the FLEX series. It has a 3.1V core voltage and runs at a 200MHz clock speed. The Cyclone V gives you many benefits of an all-FPGA design while also improving its performance. It uses advanced IP blocks in the FPGA, designed especially for low-power applications.

High-Bandwidth Interconnect

Cyclone V provides high bandwidth interconnects between the blocks within the FPGA. It is useful in applications where you need to transfer large data. Such data include image processing and other signal processing applications.

Cyclone V has four QSGMII transceivers used for data communication over ethernet networks, with data transfer speeds of up to 200Mbits/s. One can transfer data simultaneously, which is useful when reading or writing to flash memory in the FPGA.

ARM*-Based HPS

Cyclone V also has an HPS field-programmable gate array (HPS) block. ARM designed the block, but we can program it in the FPGA. The HPS is essential in off-chip applications by connecting the output of the QSGMII transceivers to an optional Cypress XC7K35P1. In addition, it provides a memory interface for ARM’s HPS.

Intel (Altera) Cyclone V FPGA Boards drawbacks

Although the Cyclone V is a low-cost FPGA, it still offers many benefits that other FPGAs do not. The main drawbacks include:

1. The 1Gbit/s QSGMII transceivers, the FSMC USB transceivers, and the HPS are not available. So, you can’t use them to implement certain types of end-to-end designs.
2. There is no support for non-ARM systems. It includes AMD or ARM-based systems that one implements using a PCIe switch or other high-performance interfaces between the ARM core and the rest of the SoC.
3. Cyclone V doesn’t support DDR memory directly. However, it has a connector for using an optional XC7K35P1 memory device designed for use with the QSGMII transceivers and the HPS.
4. There is only one SGMII transceiver and one USB transceiver in the FPGA. You can’t add more of these transceivers to interface with more peripherals on an SoC design.

Although the Cyclone V has many drawbacks, it is still a very powerful FPGA that we can use in many different systems.

Intel (Altera) Cyclone V FPGA Boards applications

We optimize the Cyclone V for FPGA designs that use the ARM CPU. The following are some examples of systems that you can implement using Cyclone V:

1. Industrial networking, motor control

Industrial network systems are useful in many different environments. It includes factory automation, building automation, and mining. Cyclone V provides high-performance networking capabilities for industrial network systems. The QSGMII transceivers can connect the FPGA to the ethernet, which is essential for communication with other systems. Cyclone V can also implement motor control systems used within factory automation and building automation.

2. Wireless: Mobile backhaul, remote radio heads, picocell

Mobile backhaul systems are essential in cellular communication systems. It includes a wireless backhaul to the base station, which we connect to an ethernet switch. We can use Cyclone V to provide high-performance communication capabilities in these environments. The QSGMII transceivers are useful in data communication over the wireless network. But the FSMC transceivers are essential radio energy transmission or reception. Cyclone V can implement remote radio heads used in the field inside mines and other underground locations.

3. Wireline: Access routers, control plane

We can use Cyclone V in high-performance wireline routers that are useful in cellular networks. These routers are in the base station and connect the communications device to the network. The QSGMII transceivers can help data communication over the wireline network.

4. Broadcast: Capture cards, video conversion

The Cyclone V provides high performance for video conversion applications. It can help implement digital broadcast capture cards, which we use in analog broadcast television, satellite television, and IPTV systems. It can also convert analog low-definition television into digital high-definition television or other types of videos.

5. Cryptography

The Cyclone V is a secure processor that uses an ARM core for data processing. We can use it in applications that require high-performance encryption algorithms. You can use the HPS to provide an interface compatible with ARM’s processors, such as the Cortex-A8 and Cortex-A9.

6. Consumer: Displays

The Cyclone V is useful in consumer applications, such as digital TVs, home theater systems, and e-book readers. We can also use it in low-power embedded systems that include large displays.

7. Security

Affordable hardware security solutions are essential for secure communications between devices and networks today. The Arm Cortex-A8 is a highly integrated processor system used in many high-performance devices due to its high performance and low power consumption.

8. automotive: Infotainment, drive assistance, battery management

Cyclone V is a completely programmable system that we can customize to perform certain tasks in a system. The QSGMII transceivers help connect the FPGA to a high-performance network. We can use it in applications that require powerful processing capabilities, such as multimedia applications. The HPS is essential in applications where we need a memory interface with an ARM-based system.

Intel (Altera) Cyclone V FPGA Boards

[ACM-027] Altera Cyclone V FPGA board

ACM-027-A4 consist of the Altera 5CEBA4F23C8N FPGA with the following specifications:

• 100 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383 Kbits Embedded memory
• 49K Logic Elements

[ACM-027Z] Altera Cyclone V FPGA board

The ACM-027Z-A4 Is compact and straightforward, using a 3.3V power supply operation. The specification for the Altera 5CEBA4F23C8N FPGA includes:

• 100 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383 Kbits Embedded memory
• 49K Logic Elements

[ACM-028] Altera Cyclone V F896 FPGA board

The ACM-028 consist of the Altera 5CEFA9F31C8N or 5CEFA7F31C8N. This FPGA Cyclone V board is straightforward and compact and offers high performance. Some of the specifications include:

5CEFA7F31C8N:

• 100 Maximum user I/O pins (Board)
• 480 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 7 PLLs
• 312 Embedded 18 x 18 Multipliers
• 7,696 Kbits Embedded memory
• 149.5 K Logic Elements

5CEFA9F31C8N:

• 100 Maximum user I/O pins (Board)
• 480 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 8 PLLs
• 684 Embedded 18 x 18 Multipliers
• 13,917 Kbits Embedded memory
• 301K Logic Elements

[ACM-109] Altera Cyclone V FPGA board

The Altera 5CEBA4U15C8N FPGA consists of the following attributes:

• 128 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global clock networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383kb Total Memory
• 303kb MLAB Memory
• 3,080kb M10KMemory
• 18,480 ALM
• 49k Logic Elements

[ACM-113] Altera Cyclone V GX FPGA board

The ACM-113 family consists of 5CGXFC7B7F23C8N, 5CGXFC5B7F23C8N, and 5CGXFC3B7F23C8N Cyclone V GX FPGA.

Their specification include:

5CGXFC7:

• 128 Board Maximum user I/O pins
• 240 Device Maximum user I/O pins
• 7 PLLs
• 312 18×18 Multipliers
• 6,860kb M10K Block
• 150k Logic Elements

5CGXFC5:

• 128 Board Maximum user I/O pins
• 240 Device Maximum user I/O pins
• 6 PLLs
• 300 18×18 Multipliers
• 4,460kb M10K Blocks
• 77k Logic Elements

5CGXFC3:

• 128 Board Maximum user I/O pins
• 208 Device Maximum user I/O pins
• 4 PLLs
• 114 18×18 Multipliers
• 1,350kb M10K Blocks
• 36k Logic Elements (k)

[ACM-206] Altera Cyclone V FPGA board

The ACM-206 family consists of 5CEFA9F31C8N and 5CEFA7F31C8N ALTERA Cyclone V FPGA.
Their specification include:

5CEFA9F31C8N

• 684 Embedded multipliers
• 16 Global Clock Networks
• 13,917Kbits Embedded memory
• 296 Board Maximum user I/O pins
• 224 Device Maximum user I/O pins
• 8 PLLs
• 301K Logic Elements

5CEFA7F31C8N:

• 312 Embedded multipliers
• 16 Global Clock Networks
• 7,696 Kbits Embedded memory
• 296 Board Maximum user I/O pins
• 240 Device Maximum user I/O pins
• 7 PLLs
• 149.5K Logic Elements

[ACM-305] Altera Cyclone V FPGA board

Like all the other Cyclone V boards made in Japan, it had High quality eight layers and a ten-pin socket JTAG Connector. The Altera 5CEBA4U15C8N FPGA has the following attributes:

• 56 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 3,383kb Total Memory
• 303kb MLAB Memory
• 3,080 kb M10K Memory
• 18,480 ALM
• 49K Logic Elements
• 132 18 x 18 Multipliers

[ACM-305Z] Altera Cyclone V FPGA board

This board is a Hi-performance FPGA Cyclone V board that is very simple and compact. The Altera 5CEBA4U15C8N FPGA has the following feature:

• 56 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383 Total Memory
• 303kb MLAB Memory
• 3.080kb M10K Memory
• 18,480 ALM
• 49K Logic Elements

[AP68-07] Altera Cyclone V PLCC68 FPGA Module

With AP68-07, you will get 68pin PLCC FPGA that is simple and compact. The Altera 5CEBA4U15C8N has the following specification:

• 50 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global clock networks
• 4 PLLs
• 132 18 x 18 multipliers
• 3,383kb Total Memory
• 303kb MLAB Memory
• 3,080 kb M10K Memory
• 18,480 ALM
• 49K Logic Elements

[AP68-06Z] Altera Cyclone V PLCC68 FPGA Module

The Altera 5CEBA4U15C8N has the following features:

• 50 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global clock networks
• 4 PLLs
• 132 18 x 18 multipliers
• 3,383kb Total Memory
• 303bk MLAB Memory
• 3,080kb M10K Memory
• 18,480 ALM
• 49K Logic Elements

[EDA-008] Altera Cyclone V USB-FPGA board

Altera 5CEBA4F23C8N FPGA:

• 100 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383KB Embedded memory
• 49K Logic Elements

[EDA-009] Altera Cyclone V USB-FPGA board, FTDI USB 3.0 FT600

Altera 5CEBA4F23C8N FPGA:

• 100 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383 KB Embedded memory
• 49K Logic Elements

[EDA-302] Altera Cyclone V USB-FPGA board

Altera 5CEBA4U15C8N FPGA:

• 56 Maximum user I/O pins (Board)
• 224 Maximum user I/O pins (Device)
• 16 Global Clock Networks
• 4 PLLs
• 132 18 x 18 Multipliers
• 3,383kb Total Memory
• 303kb MLAB Memory
• 3,080kb M10K Memory
• 18,480 ALM
• 49K Logic Elements

Conclusion

The Cyclone V is the first FPGA Altera has produced that supports high-speed digital design. It allows for several high-speed applications. The 10SS can handle up to 60MHz of data, while the other two only support 40MHz.

From the above details, all variants support 16GB, 32GB, and 64GB of onboard memory. While this is not enormous compared to the typical DRAM found on modern systems, it will easily implement typical designs.

While there are limitations on the number of environmental effects allowed for this device, it does not appear to be much below what we find in modern FPGAs.

Introduction

A transparent printed circuit board (PCB) is a specialized PCB that uses a clear insulating substrate material instead of the typical opaque FR-4 material. This allows building functional PCBs that are see-through, providing a unique aesthetic while still maintaining electrical functionality.

This article explores transparent PCB technology including:

• Materials used and properties
• Fabrication process
• Applications and use cases
• Advantages and limitations
• Design considerations
• Future trends

Understanding transparent PCB technology enables leveraging these visually appealing boards in products requiring high transparency like lighting, displays and other electronic assemblies.

Transparent PCB Materials

Conventional PCBs use opaque substrate materials like FR-4 which is a composite of fiberglass and resin. Transparent PCBs use clear insulating materials that allow light to pass through while still providing adequate dielectric insulation. Some options are:

Polycarbonate

An amorphous thermoplastic known for optical clarity and high impact resistance. Offers good temperature and chemical resistance. Used in riot shields, lenses.

PET (Polyethylene Terephthalate)

A crystalline thermoplastic polymer resin known for strength, thermal stability and transparency. Used in water bottles and food containers.

PMMA (Polymethyl Methacrylate)

An amorphous thermoplastic known as acrylic glass. Provides high light transmittance. Used in aquariums, aircraft windows.

Glass Reinforced Epoxy

Composite of glass fabric and epoxy known for dimensional stability. Provides very high optical clarity along with rigidity.

LCP (Liquid Crystal Polymer)

A highly chemically resistant crystalline thermoplastic polymer allowing thin and flexible PCBs.

These transparent insulating materials enable fabrication of PCBs that are see-through while still providing adequate dielectric insulation for proper functioning of the circuits.

Transparent PCB Fabrication Process

Fabricating transparent printed circuit boards involves:

Substrate Preparation

The clear insulating base material sheet is cut to the required PCB panel size. Holes are punched for vias.

Metallization

Copper foils are laminated onto the substrate panels using clear adhesives. This forms the starting conductive material.

Imaging

Photoresist is applied on the copper layers and patterned by photolithography process to define the conductive traces.

Etching

Exposed copper is etched away by chemicals leaving only the protected copper traces.

Stripping and Drilling

Remaining photoresist is stripped and holes are drilled for component mounting and connectivity.

Plating

Walls of through holes and outer copper layers are plated with copper to enable conductivity.

Solder Mask

A clear photoimageable solder mask is applied to define solderable regions and provide insulation.

Legend Printing

Component outlines, markings and other legends are screen printed using transparent inks.

Routing

Individual PCBs are cut from the larger fabrication panels.

Testing and Inspection

Electrical testing and optical inspection verifies board quality.

This fabrication process allows creating PCBs that are functionally the same as regular PCBs but with see-through substrates for transparency.

Applications of Transparent PCBs

Some applications and products leveraging transparent printed circuit boards include:

• LED lighting – Light fixtures, bulb assemblies
• Automotive – Tail light assemblies, instrument clusters
• Consumer electronics – Appliances, game consoles, wearables
• Digital signage/displays – Video walls, public information systems
• Medical – Dialysis machines, imaging equipment
• Human-machine interface – Touchscreen kiosks, vending machines
• Architecture – Switch panels, interactive installations
• Industrial – Automation systems, machine tools
• Science/Education – Electrical training systems

Any application where both lighting effects and electronic circuitry need to co-exist in a single assembly can potentially benefit from transparent PCB technology.

Advantages of Transparent PCBs

Some benefits of using transparent PCBs are:

• Aesthetic appeal – Provides see-through effect for better illumination, lighting effects
• Light transfer – Allows light transmission through the PCB
• Illumination – Components can be underside mounted and illuminated
• Heat dissipation – Improves thermal performance by reducing heat accumulation
• Component visibility – Components can be visible through the board
• Debugging – Helps in visual debugging of circuits
• Low EMI – Transparency avoids shielding unlike metal enclosures
• Ruggedness – Materials like polycarbonate offer high strength

The optical clarity allows creativity in design and lighting effects while still retaining circuit functionality.

Limitations and Challenges

However there are certain limitations and design considerations:

• Higher cost – Materials are more expensive than standard FR-4 boards
• Limited sizes – Cannot manufacture very large transparent boards
• Lower thickness – Limited to thin boards due to material flexibility
• Component contrast – Components mounted on top may have lower visibility
• Safety standards – Meeting medical and appliance safety directives
• Complex assembly – Requires expertise to solder and assemble transparently
• Signal quality – Careful layout needed for high frequency signals
• Repairability – More difficult to troubleshoot and repair boards
• DC resistance – Higher electrical resistance impacts conductors

While the technology provides immense creative possibilities, designers need to account for the nuances of working with non-traditional PCB materials.

Design Guidelines for Transparent PCBs

To effectively design transparent printed circuit boards:

• Choose substrate material based on strength, thermal, dielectric needs and budget
• Allow slightly larger spacing between conductors to account for lower resolution
• Ensure conductor widths and clearances meet current, voltage needs considering higher resistance
• Use transparent leaded components or reverse mount SMDs for visibility
• Place non-transparent components selectively to avoid blocking visibility
• Include alignment markers for accurate component placement
• Review design for safety directed energy, fire resistance regulations
• Perform thermal simulations to ensure adequate heat dissipation
• Verify electrical performance through simulation and prototyping
• Work closely with experienced transparent PCB manufacturer on design refinements

With careful design considerations and controls, the limitations can be effectively managed.

Future Trends in Transparent PCBs

Some emerging trends shaping transparent PCB technology are:

Materials R&D

• Developing new transparent substrate materials with enhanced capabilities

Manufacturing Improvements

• Innovations enabling higher layer count boards with smaller vias

Touch Integration

• Embedding touch sensors within transparent boards

Flexibilization

• Creating flexible transparent circuits

Additive Processing

• Leveraging additive methods like inkjet printing of conductors

Miniaturization

• Producing transparent circuits on thinner substrates for compact products

Design Automation

• CAD tools optimizing layouts for transparent PCB needs

Smart Lighting

• Integrating transparent electronics into smart LED lighting

New Applications

• Adoption in emerging industries like wearables, EV, AR/VR

Continued progress in materials, processes and design tools will expand applications for transparent PCB technology across industries where aesthetic lighting and electronic functions need merging in novel ways.

Conclusion

Transparent printed circuit boards enable illuminating creativity in product design by merging lighting aesthetics and electronic functions using clear insulating substrates. With its unique set of advantages and widening range of applications across automotive, consumer products, medical devices and industrial automation, transparent PCB technology empowers products to blend electronics seamlessly into visually appealing illuminated structures. As manufacturing processes and new substrate materials advance, transparent PCBs hold the promise to transform future electronic product paradigms in stunning ways.

What is a Transparent PCB? – FQA

Q1. What materials are used to fabricate transparent PCBs?

Transparent PCB materials include polycarbonate, PET, PMMA, glass reinforced epoxy, liquid crystal polymers which provide optical clarity along with adequate dielectric insulation.

Q2. What kind of applications use transparent PCB technology?

Applications include LED lighting, automotive tail lights, consumer appliances, medical dialysis machines, industrial HMI, interactive public kiosks needing electronic-lighting merging.

Q3. What are some advantages of using transparent PCBs?

Benefits include aesthetic appeal, light transmission, component illumination and visibility, improved thermal dissipation, reduced EMI through non-metallic enclosure.

Q4. What are some limitations and challenges with transparent PCBs?

Limitations are higher cost, smaller sizes, lower thickness, component visibility contrast, safety standards, assembly complexity, electrical resistance and debug difficulty.

Q5. What are some future trends shaping transparent PCB technology?

Trends are new substrate materials, manufacturing improvements for higher layer counts, touch integration, flex circuits, additive printing, design automation tools and applications in lighting, wearables and AR/VR.

Introduction

The Intel MAX 10 is a low-cost, instant-on, non-volatile field programmable gate array (FPGA) by Intel (formerly Altera) aimed at a wide range of industrial IoT, embedded vision and compute applications.

This article provides an overview of the Intel MAX 10 architecture, features, design considerations, available options and target applications to help designers evaluate its capabilities.

Intel MAX 10 Architecture

The MAX 10 architecture is built on Intel’s 14nm process and consists of the following key components:

Logic Fabric

• Based on Intel’s Adaptive Logic Module providing optimal balance of logic, memory and DSP resources
• Up to 50K LEs (logic elements) providing over 300K logic cells
• LABs (logic array blocks) with 10 LEs each, carry chains, registers
• ALM and register packing boosts utilization

Embedded Memory

• Up to 5.5 Mbits of embedded memory blocks
• MLAB (640b blocks), M9K (9 Kb blocks) and M144K (144 Kb blocks)
• Memory mode configurable as ROM, FIFO etc.

DSP Blocks

• Up to 252 18×19 variable precision DSP blocks
• High performance arithmetic and signal processing

Clock Management

• Up to 6 PLLs (phase-locked loops) for clock management
• Clock conditioning, frequency synthesis, deskew

Transceivers

• Up to 4 full-duplex transceivers up to 10.3 Gbps
• Multi-protocol support including Ethernet, PCIe, DisplayPort

Hard IP Cores

• Rich library of instant-on Intel FPGA IP cores
• Peripheral sets for interfacing, communications, computing

Non-volatile Configuration

• Unique flash memory based configuration unlike SRAM FPGAs
• Instant boot up, low power retention during shutdown

This combination of flexible programmable fabric along with abundant hardened blocks for common functions enables creating a wide range of embedded and industrial electronic systems using the MAX 10 FPGAs.

Intel MAX 10 Features and Benefits

Some of the major highlights of Intel MAX 10 devices are:

Low Cost

• Aggressively priced for high volume markets
• Lowest cost programmable logic solution

Small Form Factor

• Compact fine-pitch packages including CSP/BGA options

Power Efficiency

• Typical static power under 100 mW
• Hibernate power mode for μW retention

Non-Volatile Operation

• No external configuration memory needed
• Instant power on with flash-based configuration

Mixed-Voltage Support

• 1.2V core with 3.3V I/O supply

Robust Security

• AES-GCM 256-bit encryption blocks
• Pubkey authentication, access prevention

SEU Immunity

• Resistant to radiation induced errors

-40°C to +125°C Operation

With its compelling combination of low-cost, low-power, mixed-voltage operation, reliability and abundant hardened blocks, the MAX 10 brings new flexibility and capabilities compared to CPLD or microcontroller solutions for embedded systems.

Intel MAX 10 Design Considerations

Key aspects designers should keep in mind while working with the MAX 10 FPGA:

Programming and Debug

• Leverage Intel Quartus Prime for design entry, synthesis, place and route
• Debug via SignalTap logic analyzer

IP Selection

• Choose relevant interface, peripheral, instruction sets from Intel IP library

**Pin Planning **

• Plan I/O early based on package options

Board Design

• Follow Intel reference design guidelines

Power Analysis

• Use power analysis tools to optimize current consumption

Thermal Design

• Employ proper heat sinking for high power variants

Security

• Make use of robust built-in security capabilities

Team Skills

• Prior experience with Intel/Altera FPGAs is beneficial

Considering these aspects early in the design cycle helps harness the full potential of MAX 10 devices.

Intel MAX 10 Options

The Intel MAX 10 is available in a range of variants with different I/O counts, logic, memory and DSP resources to match diverse application needs:

This scalable portfolio allows developers to choose the optimal device configuration matching embedded system needs in terms of I/O, logic resources, memory and cost.

Target Applications

With its compelling blend of low-power, reliability, small form factor and real-time performance, MAX 10 FPGAs are well suited for a diverse set of industrial applications:

• Embedded machine vision – Vision sensors, inspection systems
• Industrial automation – Motor drives, robotics, PLC expansion
• Aerospace and defense – Vehicles, communications, munitions
• Communication systems – 5G, wired broadband, MANETs
• Medical – Diagnostics, imaging, prosthetics
• Video and imaging – Surveillance, traffic systems, video codecs
• Edge computing – Networking gear, gateway systems
• Automotive – Body electronics, in-vehicle communications
• Energy infrastructure – Smart grid, power equipment

The non-volatile flash-based configuration enables reliable instant-on edge computing systems in harsh operating environments. MAX 10 provides a flexible alternative compared to custom ASIC implementations.

MAX 10 vs MAX5 Comparison

As Intel’s most recent low-cost FPGA offering, the MAX 10 provides significant improvements over the prior MAX5 generation:

• Up to 10X higher logic density with 50K LEs
• Addition of hard transceiver blocks
• Higher speed grade options up to 400 MHz
• More embedded memory blocks
• SEU immunity for reliability
• Lower power due to 14nm process
• Additional hard IP including ARM cores

The enhancements make the MAX 10 suitable for more complex embedded systems compared to MAX5 devices.

Conclusion

The Intel MAX 10 is an extremely flexible low-power FPGA family that provides an optimal combination of programmable logic, hardened blocks and I/O tailored for edge computing, embedded vision, industrial and communication systems.

Leveraging Intel’s mature design tools and a rich ecosystem of proven IP enables rapid development of robust products. The non-volatile flash-based configuration offers reliable instant-on performance for industrial deployments.

With its aggressively priced and scalable portfolio, the Intel MAX 10 offers compelling capabilities as a replacement for CPLDs, microcontrollers and ASICs across a diverse range of embedded applications demanding real-time intelligence and connectivity at the edge.

What is Intel MAX 10 FPGA? – FQA

Q1. What applications is the Intel MAX 10 FPGA suited for?

The MAX 10 with its low cost, low power, reliability and small form factor is ideal for industrial automation, embedded vision, aerospace, medical, imaging, edge computing systems.

Q2. How does the MAX 10 architecture differ from SRAM-based FPGAs?

MAX 10 uses flash memory for non-volatile configuration unlike SRAM FPGAs that need external flash at power up. This enables instant on capability.

Q3. What are some key components in the Intel MAX 10 FPGA?

Key components are the 14nm low-power logic fabric using ALMs, ample embedded memory blocks, variable precision DSP blocks, clock management, transceivers and rich Intel FPGA IP.

Q4. What are some benefits of the MAX 10 FPGA?

Benefits include low cost, power efficiency, compact footprint, robustness, reliability through radiation immunity, mixed voltage operation, built-in security and abundant hardened blocks.

Q5. How does MAX 10 improve upon Intel’s prior MAX5 FPGA generation?

MAX 10 enhances the MAX5 with up to 10X higher density, addition of hard transceivers, higher speed grade options, more memory blocks, reliability through SEU immunity and lower power consumption.

What is PCB Insulation?

PCB insulation involves the use of dielectric materials to separate and protect the conductive layers of a circuit board. As electronic devices often generate high temperatures, proper insulation is essential to maintain performance and reliability. PCB manufacturers utilize dielectric materials to ensure that the board’s components remain isolated and secure.

Key reasons for insulating printed circuit boards include:

• Maintaining adhesion at operating temperatures
• Reducing signal interference between layers
• Preserving voltage integrity and signal quality
• Supporting effective thermal management during production

Insulation plays a critical role in ensuring the durability and functionality of PCBs in various applications.

PCB Insulation Materials

Different PCB applications require specific insulating materials. Here’s an overview of common types:

1. Metal Coating:
   • Excellent conductivity and heat resistance
   • Protects against powerful electrical ion flow
   • Ideal for high-current devices
2. FR-4 (Flame Resistant 4):
   • Made from flame-resistant fiberglass
   • Suitable for double-sided PCBs
   • Cost-effective and heat-resistant
   • Withstands physical stress
3. Flex Insulation:
   • Designed for flexible PCBs
   • Thin, solid coating that doesn’t restrict movement
   • Often applied as a PCB insulation spray
4. FR-2 (Flame Resistant 2):
   • Combination of plastic and paper
   • Lighter than FR-4, best for single-layer PCBs
   • Less fire-resistant but durable and water-repellent
   • Used in inexpensive electronics due to lower cost
5. Radio Frequency Coating:
   • Specialized for devices using radio frequencies
   • Ideal for aerospace and in-flight electronics
   • Effectively manages high frequencies

Choosing the right insulation material is crucial for ensuring optimal PCB performance and longevity in specific applications.

How does the insulation aid PCB design and operation?

In recent times, most PCBs come in multiple layers. This is due to technological advancements. The doubled and many layered PCBs are more solid with high speed, thick with more components on the board. These advantages are with complexities that include signal routing.   

To deal with these hitches, a perfect choice of PCB insulation that manages the layers is vital. The selection procedures for consideration are as follows:

Temperature Progression/Movement

The impact made by high temperature on the board during production is a key factor to ponder about. A flexible PCB design needs many movements as against the woody PCB design.

Board Classification

The insulating material that fits the majority of the classification of PCBs is the FR -4. However, interruption caused by the control placed on PCBs with high speed is a factor to look into. This requires that insulation should be high enough to defy such interruptions.

Insulation density and signal layers

Another major factor to consider in selecting insulation for PCBs is its thickness. If a thin insulation is the choice, the base insulator beside the signal layer might disconnect. This disconnection between the signal layers will reduce the electromagnetic interference. Even so, choosing a thicker insulator on a double signal layer will allow routing on the next layer.

The Height of the PCB

The depth of the PCB can be a restraining factor to the elevation of the insulation in the design. In as much as size plays a major role in the usage of multiple layered PCBs.

• Read More about : PCB Conformal Coating

PCB Insulation Coating

A freshly produced PCB comes with the expectation of perfect performance. As well as the projection that all components of the PCBs are well suited for work without itches.

Nonetheless, the PCB is open to mitigating factors that could hamper its efficiency. Environmental variables such as corrosion, dust, temperature and dirt could affect the PCB. Also factors such as voltage surge, overburden voltage and accidental impact could mitigate.

The durability and integrity of the PCB could be reduced as a result of these demeaning factors. As such, manufacturers adopted the PCB insulation coating to remove these negative factors.

The insulation coating provides coverage for the PCB against all environmental variables. It is suitable for use in a broad range of environments to protect the PCB from all kinds of mitigating factors.

The coverage provided by the insulation coating enhances higher current incline. Thus, producers are able to match the compactness and integrity demands by end users.

Define PCB Insulation Coating

Insulation coating means the method of applying resistant materials to the PCB layer. This can either be through brushing, dipping or spraying of the coating material on the PCB. Thus, the PCB is well protected against destruction caused by tough environments.

Furthermore, the PCB insulation coating also enhances the stoppage of electrical discharge. Insulation coating increases the lifespan of the PCB. Mechanical and heat pressure, damages during installation and brutal handling are practically eliminated.

Composition of PCB insulation coating materials

For a PCB insulation coating to serve as a perfect coverage to the PCB, some attributes are salient. These attributes are exceptional electrical conduction, good temperature properties, chemical inertness and absorption.

Furthermore, insulation coating will enhance the resistant capacity of PCBs against environmental variables. As well as increasing the lifespan of the PCBs.

The insulation coating materials are basically divided into five categories.  They are epoxy resin, polyurethane, organic silicon, parylene and acrylic acid resin. This is due to various contributing elements that make up the coating materials.

Categories of Insulation Coating Materials

Epoxy Resin Coating

This type of PCB coating is routinely applied on the PCB. This is due to its components and characteristics. Epoxy resin coating has high corrosion, moisture, and is temperature-resistant. It also  has an exceptional permanency strength.

Equally, epoxy resin sprayed PCB is prone to a bad performance in cold environments and it shrinks. Alteration is difficult on a PCB with epoxy resin except if it is stripped physically. Thus, damage to its components as well as excessive inner distress to frail devices will occur.

Polyurethane Coating

This insulating coating can be solidly stiff, humidity sensitive and hard to take off. Yet, it is highly durable, defies mugginess and it is resistant to acid and soluble. Polyurethane is suitable for a broad range of applications.

Due to its solid nature, rectifying any defect on a PCB coated with polyurethane is tough.  The process of curing takes a lot of time which might change its face color to yellow at high heat conditions. Also, it might likely stimulate screw ravaging.

Organic Silicon Coating

The PCB insulation coating made up of organic silicon is best suitable for high circuit PCBs. This is due to its numerous dominant resistors. It is pliable and it provides an admirable resistance to moisture and heat.

Although the silicon remnants on the PCB are hard to detach, it is poor at sustaining mechanical stability as well as resisting corrosion.

Parylene Coating

Parylene coating is a unique preservative coating used in the electronic industry. It breaks the organic compound in the vacuum valve and lays the coating evenly on the surface of the product.

More so, the parylene coating is the most efficient for highly compatible devices. It also serves as the best suited for high frequency PCBs as it provides total cover, it is also stout and thin.

Nonetheless, parylene coating is costly which stands as the only disadvantage to its choice.

Acrylic Acid Resin coating

This type of insulation coating favors electrical devices. Modification on this insulation coating is simple and it is relatively cheap.

Furthermore, the acrylic insulation coating possesses a very good moisture resistant ability. Also it has a flexible density adaptation and dries quickly.

Fixing a PCB coated with this type of insulation is technologically simple. The process is dependent on the evaporation of the soluble.

Circuit Board Insulation

Insulation is as important to the circuit board as housing is important to human lives. Insulation serves as the shield against likely attacks on the PCBs.

Circuit board insulation is the use of non conductive materials to detach the layer from conducting components on the circuit board.

The contributory role of the circuit board is quite significant. Its existence has made the operation of electronic gadgets very effective. The circuit board consists of integrated components to allow perfect functionality. These include the transistors, the inductors as well as resistors, capacitors and Diodes.

Understanding of the board’s fabrication and its automated attributes is important. This is to make sure its production is of the best quality, thus best operation of the circuit board.

PCBs get descriptions in accordance to the number of layers they have. Nonetheless, during the pile up system, decisions on various parameters come to fore. They include insulation surface, their setting and kind of materials

Furthermore, taking a precise decision depends on the knowledge the producer has. The factors to consider are physical, electrical, temperature and mechanical properties. In order to take right decisions, the under listed objectives will be a guidance

Aim of PCB insulation among layers

• Insulation aids veracity and signal
• Reduction or getting rid of signal interruption among the layers
• Sustain gluing during temperature inversion

Conclusion

PCB insulation is an aspect of the manufacturing process that is very crucial. Insulating your PCBs promotes durability, integrity and safety of the PCB. PCB being the bedrock foundation on which the majority of electronic gadgets thrive lately; sustaining the growth of the industry should be a priority.

Printed circuit boards have continued to be the core of most electronic devices. The manufacturing of these boards requires some steps. The PCB slot is a vital aspect of the PCB design. Manufacturers must understand the PCB slot before commencing on any device.

The presence of slots in a circuit board has several benefits. The effect of slots in circuit boards can’t be underestimated. PCB slots are available in different types. Therefore, it is important to have detailed knowledge about these slots.

What is a PCB Slot?

A PCB slot is a hole in the circuit board that is too big to be formed by normal drilling methods. Manufacturers need to cut out these holes with a routing bit during the fabrication of the PCB. A slot PCB can either be non-plated or plated.

Types of PCB Slot

The two major types of PCB slots are the plated slot and non-plated slot.

Plated slot

In PCB manufacturing, a plated slot has copper plating. The plated slot is the type that has no circular shape. A PCB slot that features copper on the bottom and top is a plated one. This type of slot is ideal for electrical connections. Plated through hole slots are ideal for component packaging. Multilayer PCB always feature this type of PCB slot.

In PCB manufacturing, there are several component types for circuit boards assembly. The majority of through-hole part outlines feature round holes to take square or round leads. Most through-hole assemblies match this configuration. However, several parts use rectangular leads that don’t fit into square or round holes. Therefore, a plated slot is a better option.

Big blade-style connectors should incorporate plate through slots as the pins’ size increases. When the parts are small, manufacturers can make use of round holes featuring rectangular pins. However, round holes use up more space on the circuit board. Plated slots are more ideal for size-constrained designs.

Non plated slot

The non plated slot features a hole bigger than the pad’s copper size. Sometimes, there might be no copper. In a non-plated slot, the copper of the pad overlays.  The manufacturer drills the non-plated slot after the electroless copper process.

Defining PCB Slot on Circuit Boards

If you are including slots in your PCB design, it is better to put them in Gerber mechanical layer. This layer is the safest way that shows the slots and the profile of the circuit board. There are two ways to do this:

• Use flashes or draws featuring the right end size of the slot
• Use a 0.50mm line to draw the slots. The line helps to analyze the clearance of the copper to the circuit board edge.

You can combine the slots’ definition with the PCB contour into the Gerber file. The mechanical layer must be with the copper layers. However, ensure the copper layer also features the PCB outline. If no mechanical layer is available, you may have to use another layer.

Don’t define slots in a legend layer or copper layer only. This is because they are easy to misunderstand. Indicate large cut-outs in a legend or copper layer. However, ensure you put a clear outline. Also, it is very important you indicate the slots in a README file. Do this when you are skeptical about the right one.

Some CAD systems enable PCB manufacturers to define slots in the drill file. However, the manufacturer must define the slots using an X and Y dimension. The X and Y dimension refers to slot width and slot length respectively.

What is the Smallest PCB Slot?

The smallest width for a slot of rigid-flex and flex circuit is 0.50mm. While the smallest length for a slot is 1.0mm. This is because of the thickness of a rigid-flex and rigid PCB. Therefore, the mechanical NC milling should create the slots. The thicknesses of a flex circuit are thin. So, a laser can cut these slots.

If the length of a slot is longer, the slot will be straighter in length. Note that, the smallest length of a slot is 2 times of the width of the slot. For instance, if the width of a slot is 0.60mm, the length of the slot will be 1.20mm.

Slots Milling

The manufacturer mills out the slots from the rigid PCB material. Then, the PCB fabrication makes use of a NC grooving cutter bit. This cutter functions like a CNC machine. Also, the cutouts’ inside corners will feature a round edge to them. Make sure you keep an eye on this in enclosure designs.

The smallest radius for inside corner is 0.50mm. The smallest tool for routing out circuit boards is 1.0mm.  Milling slots create air gaps for voltage isolation on the circuit board.

How to Use Eagle to Create Slot PCB

You might wonder if it is possible to create slots in Eagle. Slotted holes are popular in PCBs since components need to manipulate rising current. Many components feature wide pins. This is because a wide pin provides a component with more mechanical integrity.

Manufacturers can create slot PCB. It is important to use a through hole pad that has a diameter that fits your slot. An ideal pad for this operation is Oblong pad.

Draw the slots

Draw the slot outlines to draw your slotted holes. You can do this in a different way. Using the dimension layer is a great way to do this. However, this method has its limitation. The autorouter can’t get to the inside of the pad. Thus, there will be some dimension errors.

Ensure you set the pad’s drill size to fit within the slot PCB outline. This will help prevent any confusion and ensure a better result. The PCB manufacturer will mill the area within the outline from the board.

Get mill data to board manufacturer

Ensure you export a Gerber file to your manufacturer. While exporting the file, include a note. This note will specify that the manufacturer must mill the contents on the Gerber file from the board.

Defining Plated and Non-plated Slots in PCB design

The PCB fabrication process involves etching a copper sheet. This sheet is then plated on a substrate and holes are drilled on it. Before the plating process, these slots are non-conductive. Manufacturers use the electroless deposition process for PCBs with over one copper layer.

However, designers must know that not every slot will need plating. Therefore, designers need to abide by the rules of manufacturers to know which slot will be plated.  Sometimes, designers expect some features in the circuit boards. However, they get an entirely different board in the end. Mounting slots are examples of such.

For instance, there will be issues if your design depends on a certain slot being plated. Unfortunately, you realize that the slot hasn’t been after receiving the board. Therefore, we will point out the difference between plated slots and non-plated slots.

How to consider a slot as plated

Before a slot is considered plated, it must meet certain conditions. Otherwise, it is a non-plated slot.  In a plated slot, the copper of the pad alongside the solder stop mask must overlay. The pad’s copper must be more than the slot with at least 6 mil in width.

How to consider a slot as non-plated

Sometimes, some PCB slots are non-plated due to a mechanical or electrical reason. Any slot that features properties that don’t meet the plated slot conditions is a non plated slot. A slot PCB  is non-plated, when the hole is bigger than the pad’s copper size. Furthermore, when the copper of the pad overlays and is bigger than the hole. However, there is a space clearance of 6 mil between the hole and the copper. Such conditions meet the requirements of a non-plated slot.

Applications of Non-plated and Plated Slots

• Milling slots create air gaps for isolation of voltage on circuit boards

There can be temporary electrical arcs between traces in a circuit board featuring high voltages. Repetition of electrical arcs can result in PCB carbonation. This can cause a short circuit in the long run. As a result of this, PCB designers include a milling PCB slot between suspect traces.

• Plated slots are ideal for parts featuring square or rectangular leads

These slots fit in for parts with square/ rectangular leads rather than the rounded ones. The footprint for slots is better than for large holes. This is because the space between the wall of the hole and the lead must contain enough solder.

Best Practices for Plated Slots

For a PCB assembly, there are several component types and footprints. Designers use circular holes to design most through-hole part footprints. This is because the circular holes can accommodate square or round leads. This is an ideal configuration for through-hole components. However, many parts use rectangular leads. These leads don’t fit into square or round holes. It is better to incorporate a plated slot footprint.

When the footprint leaves more space around the component leads, the circular hole configuration will be vulnerable to some defects. This can lead to solder joint voiding. This type of defect occurs when more solder fills the holes. Manufacturers become more concerned as the pins’ size increases. Therefore, large rectangular connectors should incorporate plated slots instead of circular holes.

Some manufacturers can work around circular holes for rectangular pins. Also, the circular holes end up taking more space on the circuit board itself.  Using big circular holes is not ideal for layout demanding dense component populations. Incorporating plated slots can provide solutions in size-restricted designs.

PCB designers need to consider a few things while designing non-circular holes.  However, the design process of non-circular holes is straightforward. Plated slots are commonly utilized in component footprints. Most programs for PCB layout feature an option to define a hole as oval or circular. In addition, some clients identify slot holes on the design layer of their Gerber files.

Designers can also design non-plated slot PCB in a similar way. They can then designate it as Mechanical or NPTH in the CAD software. They can also design them on the Board Outline Gerber layer. It is important that manufacturers pay attention to the design rules of PCB slot.

What to Consider When Creating Plated Slots

Designers need to define some things in the EDA tools to create plated slots. Most EDA tools allow designers to create plated slots through a manual process. Here, the designer identifies all the aspects of the hole rather than placing a standard pad.  The three most important factors to consider when creating a plated slot are;

• The shape of the hole
• The copper’s shape on the top layer
• The copper’s shape on the bottom layer

Plated slots differ from other holes in PCB designs. This is because they are drawn on the board outline layer. When PCB manufacturers receive manufacturing files, they interpret the board outline as cutting information. The manufacturer will route the board inside the already drawn shape. This will be done if there is a shape on the board outline layer.

A drawn hole inside the pads on the bottom and top of a PCB is interpreted as a plated slot. Therefore, designers need to draw the intended holes in the footprint on the board outline layer. The slot will display in the board outline file when producing the manufacturing files. Plated slots enable designers to make use of parts with non-circular pins and leads.

Frequently Asked Questions

What is the size of the plated slot on PCB?

0.5mm is the minimum size for a plated slot. If manufacturers realize the through-plating within the PCB, it is a plated-through slot. While through-plating on the outer edge of the PCB is sideplating.

What is the benefit of a PCB slot?

A PCB slot helps to connect the circuit board to other PCBs. It also helps to connect the board to the chassis of a device.

Can slot PCB increase the price of the overall circuit board?

No, slots in a PCB will not increase the price of the overall board. It will not also increase the lead time of your project.

Conclusion

Slot PCB is a vital aspect in PCB design. It is very important to understand how these slots work in PCB designs. The plated and non-plated slots have their function. However, plated slots are more popular in the PCB industry.