Quick Presets

Copper Layers

Prepreg Layers

Core Layers

Total Board Thickness
1.600mm
1600 µm
vs 1.6mm
+0 µm
Copper (8L)
280 µm
Prepreg (4L)
598 µm
Core (3L)
600 µm

Stackup Visualization

L1 – Top SignalSIG 35µm
Prepreg 1 (PP1) 114µm
L2 – GND PlaneGND 35µm
Core 1 (FR-4) 200µm
L3 – Inner SignalSIG 35µm
Prepreg 2 (PP2) 185µm
L4 – PWR PlanePWR 35µm
Core 2 – Center (FR-4) 200µm
L5 – GND PlaneGND 35µm
Prepreg 3 (PP3) 185µm
L6 – Inner SignalSIG 35µm
Core 3 (FR-4) 200µm
L7 – PWR PlanePWR 35µm
Prepreg 4 (PP4) 114µm
L8 – Bottom SignalSIG 35µm
SOLDER MASK (BOTTOM)
Outer Signal
Inner Signal
GND Plane
PWR Plane
Prepreg
Core
💡 Common 8-Layer Targets
1.0mm: High-density mobile/wearable
1.6mm: Standard multilayer (most common)
2.0mm: Industrial, automotive
2.4mm: Power systems, thick copper
⚡ 8-Layer Design Tips
Signal Integrity: L3 & L6 are shielded by adjacent planes – ideal for high-speed signals.
Power Distribution: L4 & L5 form a tightly-coupled power/ground pair – excellent for decoupling.
📐 Impedance Control
Outer layers (L1, L8): Microstrip impedance
Inner layers (L3, L6): Stripline impedance
Adjust PP thickness to tune impedance values.