Every PCB manufacturer seeks the best materials for their PCB needs. They seek materials with great features and properties, to ensure the reliability of their PCB products. One of the main properties that they seek is if the material has excellent thermal stability. One of such materials is the Arlon 37N PCB Material.

This material from Arlon has the necessary features that make it useful in different applications. If you are here to learn more about this material, welcome. You are in the right place. In this article, we will talk about all the properties of the Arlon 37N, why it is useful in different applications, and its recommended process conditions.

Read on to gain vast knowledge in this regard.

What is the Arlon 37N PCB Material?

The Arlon 37N PCB Material is a low-flow polyimide prepreg that suits polyimide bonding multilayer rigid-flex. It also suits the attachment of heat sinks to the polyimide MLBs, as well as other applications where there is a need for uniform or minimal resin flow.

Furthermore, the Arlon 37N PCB Material has great thermal stability. Also, it can be cured for a temperature of 350 degrees Fahrenheit, which is low. The Arlon 37N PCB Material also has excellent and great thermal stability.

The Applications of the Arlon 37N PCB Material include industrial and commercial PWB electronics, space, aerospace, and military. Lastly, it meets the requirements of the IPC-4101/42.

What are the Properties of the Arlon 37N PCB Material?

The following properties below, shows what the Arlon 37N PCB Material has to offer.

Physical Properties

The Arlon 37N PCB Material has the following physical properties. It has a flammability rating of V0 as well as a thermal conductivity of 0.3 W/mk. Furthermore, it has a density of about 1.6 g/cm3, as well as a water absorption value that is less than 1.0%

Thermal Properties

The Arlon 37N PCB Material has the following thermal properties.  Its temperature for glass transition is at 200 degrees Celsius.

Also, its decomposition temperature is 322 degrees Celsius at the initial. Then at a weight loss of 5%, the value becomes 340 degrees Celsius. At 50 – 260 degrees Celsius, the Arlon 37N PCB Material’s expansion along the Z-axis is 2.3%.

For the X, Y axis it has a coefficient of thermal expansion (CTE) of 17 ppm/C. The T260 are all higher than 60 minutes, while for T300, T288, the values are 2 minutes and 5 minutes respectively

Electrical Properties

The Arlon 37N PCB Material has the following electrical properties. Its dielectric constant is 4.25 at 1 MHz. It has a volume resistivity of 8.2 × 10⁹ MΩ-cm for C96/35/90, while at E24/125, it has a volume resistivity of 4.7 × 10⁹ MΩ-cm. Also, at 1 MHz, it has a dissipation factor of 0.018

Furthermore, this PCB material has an electrical strength of 52.4 kV/mm and an arc resistance is 124 seconds. Its surface resistivity at E24/125 and C96/35/90 is 1.2 × 10⁹ MΩ and 4.4 × 10⁶ MΩ respectively

Mechanical Properties

The Arlon 37N PCB Material has the following mechanical properties. Its Poisson’s Ratio is 0.17 and its young’s modulus for CD/MD is 2.1 Mpsi or 14.5 GPa.

In addition, its peel strength with respect to copper is 1.2 N/mm after thermal stress. Then at elevated temperatures, it stands at 0.9 N/mm, while after process solutions, the value is 1.6 N/mm. Also, the tensile strength is 221 Mpa or 32 kpsi.

Recommended Process Conditions of the Arlon 37N PCB Material

Due to the different storage conditions, you should dry the Arlon 37N PCB Material at 736 mm Hg. This should be done between 12 – 24 hours.

Furthermore, the Arlon 37N PCB Material laminates properly either with hot start or cold press starts. We recommend that you use either vacuum assist or the vacuum assist lamination to get rid of air and moisture. Furthermore, low-flow materials don’t remove air voids, same for standard prepreg. What vacuum will do is that it will assure that the final product comes void-free.

For the lamination cycle, vacuum the package. This should be done for thirty minutes and at 736 mm Hg, before you go ahead to apply pressure. Also, maintain this vacuum beyond the resin’s set point i.e. above 160 degrees Celsius.

Make use of a platen temperature that falls within 370 degrees Fahrenheit and 380 degrees Fahrenheit. Also, control the rise in heat to 8 – 12 degrees Fahrenheit every minute between 210 to 300 degrees Fahrenheit.

The pressure you should use should fall between 180 and 350 psi. This depends on the complexity and size of the panel.

In addition, note that the cure time should be 9 minutes. Furthermore, subsequent processing has to b e similar to those utilized in rigid flex printed circuit boards.

What are the Applications of the Arlon 37N PCB Material?

The applications of the Arlon 37N PCB Material include those where uniform and minimal resin flow is important. Also this is useful during the attachment of heat sinks to the polyimide MLBs. Also, it is applicable in bonding polyimide multilayer rigid-flex.

Other areas where the Arlon 37N PCB Material is useful includes Industrial and commercial PWB electronics, space, aerospace, and the military. This shows the reliability of this PCB material.

What are the Benefits of the Arlon 37N PCB Material?

The benefits of this material is as follows

• RoHS/WEEE compliant
• Mechanical and electrical properties that meet the IPC 4101/42 requirements
• Great thermal stability
• It is curable at low temperature of 177 degrees Celsius or 350 degrees Fahrenheit
• Great bond strength to copper Kapton polyimide, as well as other metals
• The material’s temperature for glass transition has an expansion characteristics that is similar to that of polyimide, which increases the reliability of the PTH greatly
• Comes in different fiberglass styles and flow ranges for the best process flexibility

Conclusion

We hope you have been able to learn much about the Arlon 37N PCB Material. You can contact us at RayMing PCB for all your questions regarding the manufacturing of this material. We are here to make the process easy for you.

If you have been searching for some reliable information on the Shengyi Q160 and Shengyi Q160 PCB, you are in the right place.

We will be discussing the characteristics, application areas, as well as other features of the Q160. Please continue reading as we explain the topic further.

What is Shengyi Q160?

Shengyi Q160 is a raw material for printed circuit boards, with great characteristics. Its thermal conductive performance is ≥0.7 W/m·K.

Furthermore, its tracking resistance is excellent at CTI≥600V. The Shengyi Q160 and Shengyi Q160 PCB are applicable for LED lighting.

What are the Properties and Characteristics of the Shengyi Q160?

Temperature of glass transition (Tg)

Shengyi Q160 has a Tg of 130. This is the temperature at which the PCB changes from its hard to its soft nature. This makes it a suitable material for printed circuit boards (Shengyi Q160 PCB). At this temperature, you can be sure of the printed circuit board’s mechanical stability all through the PCB’s operational life.

Decomposition Temperature (Td)

The Shengyi Q160 and its printed circuit board (Shengyi Q160 PCB) have a decomposition temperature of 360 degrees centigrade. Furthermore, this temperature is one at which the Shengyi Q160 material decomposes chemically. This means the Shengyi Q160 material loses a minimum of 5% of its mass.

Thermal Stress

 Also, the Shengyi Q160 and Shengyi Q160 PCB have a thermal stress of 60S with no delamination. This is achieved under the condition of 288 degrees centigrade and with the use of dip soldering.

Thermal stress is the creation of mechanical stress by a material’s temperature change. These stresses could cause plastic deformation or fracturing. This depends on other heating variables that include constraints and material types.

Coefficient of Thermal Expansion (CTE) at Z-axis

The CTE for the Z-axis at 50 to 260 degrees centigrade stands at 2.8%. This shows how much the Z axis of the Shengyi Q160 PCB will contract or expand when cooled or heated.

Volume Resistivity

Its volume resistivity after moisture resistance stands at 1.5 x 10⁸ MΩ.cm. Furthermore, at E-24/125, its volume resistance stands at 2.8 x 10⁶ MΩ.cm. This value aids in measuring the electrical resistance and insulation of the Shengyi Q160 PCB material. Once this value is high, then the circuit will experience a less movement of electric charge.

Surface Resistivity

Its surface resistivity after moisture resistance stands at 1.8 x 10⁷ MΩ.cm. Furthermore, at E-24/125, its surface resistivity stands at 3.5 x 10⁶ MΩ.cm. At this value, you can measure the insulation or electrical resistance of the Shengyi Q160 PCB material. Furthermore, it is affected by temperature and moisture.

Dissipation Factor

The Shengyi Q160 and Shengyi Q160 PCB material has a dissipation factor or loss tangent of 0.013. This value indicates the power that was lost as a result of the material.

When the dissipation factor of a material is low, it means that less power is lost. It is proportionate with frequency; this means that when there is an increase in frequency, it also increases.

Dielectric Constant

The Shengyi Q160 and Shengyi Q160 PCB material has a dielectric constant of 5.1. This value depends on the frequency. This means that it drops as frequency increases.

Also, this value is significant for impedance considerations and signal integrity. These factors are very significant for electrical performance of high frequency.

Benefits of the Shengyi Q160 PCB Material

You can enjoy several benefits when you use the Shengyi Q160 for your printed circuit boards.

Water absorption is at a low rate

The Shengyi Q160 PCB has a Tg of 130. This means that they function effectively in applications carrying much moisture. You can also be sure that water will not gain easy entrance into the PCB.

Its insulation properties are high

When insulating the Shengyi Q160 PCB, you will not have any problems. This also means you don’t have to be bothered about electric current leakage. Why this is so is because it has a temperature of glass transition at 130 and due to this, its insulation properties are high.

Its Arc resistance is high

With its Tg at 130, it possesses great insulation abilities. This helps in sustaining the discharges of the surface. With a current of at least 10 ma, this means that its arc resistance is high. Its arc resistance stands at 130s. This takes place most especially when there is neither electrical nor structural damages.

What Testing Techniques can we use for the Shengyi Q160 PCB Material?

Three major techniques are applicable when you want to test the Shengyi Q160 PCB material. These are thermal as well as dynamic mechanical analysis, and lastly, the differential scanning calorimetry.

Thermal Mechanical Analysis

This has to do with measuring the coefficient of thermal expansion of polymers during the test. In addition, this is a mechanical approach that uses heating and also measures your test samples. This is what it then makes use of to calculate the coefficient of thermal expansion. Note that you don’t have to use this method when using amorphous polymers. Why? Because the polymers’ heating will occur excessively

Dynamic Mechanical Analysis

Note that this is a very sensitive technique that helps in the measurement of a material’s responses when you apply stress. This also considers the way the Shengyi Q160 PCB material reacts to stress when you apply temperature at different ranges.

Differential Scanning Calorimetry

When testing for the Shengyi Q160 PCB material, it is very necessary to makes use of the most common technique. It should also be used traditionally.

For this testing technique, you’ll make use of a heat flow technique. Then you compare the supplied heat with the test samples.

In addition, you will discover a compared reference, which is also heated. This may reveal the right transition points to you. Using these reference transition points, you will be able to calculate the Tg.

Conclusion

We hope we have been able to enlighten you on what the Shengyi Q160 PCB material is all about. This includes its features, properties, benefits, and testing techniques. However, if you need more clarification, please feel free to contact us.

We quite understand that the Shengyi Q260 material is great for printed circuit boards, due to its high properties. However, you wish to learn more because you could only find a little information on the web right? That’s why we are here.

This article discusses what the Shengyi Q260 PCB material offers. These include its general properties, which includes its temperature for glass transition, thermal stress, coefficient of thermal expansion (Z-axis), volume resistivity, dielectric breakdown, dissipation factor, dielectric constant, flexural strength, water absorption, flammability, thermal conductivity, and more.

If you wish to widen your knowledge in this regard, please stay and continue reading.

What is Shengyi Q260?

The Shengyi Q260 is a material for printed circuit boards, with lots of outstanding uses. Some include its great thermal conductivity, great ability for mechanical processes, and great thermal resistance.

They are also useful in different applications, which include automotive electronics, LED lighting and display, household electrical appliances, and power base boards.

Properties of the Shengyi Q260 PCB Material

Below are the main properties of the Shengyi Q260 PCB material.

Coefficient of Thermal Expansion (Z-axis)

Before Tg, the Shengyi Q260 PCB material has a CTE of 28 ppm/℃. After Tg, the value changes, making it become 265 ppm/℃. Also, at a temperature of 50 to 260 degrees centigrade, the value stands at 3.5%.

Thermal Stress

Another property of this material is thermal stress, which stands at >30s. This value is possible with two conditions. Also, it occurs at a temperature of 288 degrees centigrade and with solder dip.

Temperature for glass transition (Tg)

The temperature for glass transition of the Shengyi Q260 PCB material is 122 degrees centigrade.

Dielectric constant

It also has a dielectric constant of 4.8 at 1MHz. The dielectric constant is dependent on the frequency. This value is very important for impedance considerations and signal integrity. Also, these factors are very important to ensure a high electrical performance.

Dissipation Factor

For dissipation factor, the lower the value, the higher the efficiency of the insulating system. Furthermore, the Shengyi Q260 PCB material’s dissipation factor or loss tangent at 1MHz is 0.014. From the value it is clear that this material has a low dissipation factor.

Also, this means that the ability of this material to serve as a material for insulation or hold energy is high. Once again, this is one reason why it is very useful for printed circuit boards.

Water Absorption

The water absorption is at 0.13%. This shows that the Shengyi Q260 PCB material has a low rate of water absorption. Therefore, you can be sure that this material will not absorb water easily and that is why it is very useful for different applications.

Thermal Conductivity

The Shengyi Q260 PCB material has a thermal conductivity of 1.0 W/m·K. Also, this is the value at which the Shengyi Q260 PCB material transports energy as a result of random molecular motion through a specific temperature gradient.

Arc Resistance

This material also has an arc resistance of 140s. This refers to the material’s resistance to effects of low-current, high voltage, as well as resisting the formation of any conducting path along the surface. Also, this value is affected by the ionization degree, the arc’s cross section and the arc’s length.

Benefits of the Shengyi Q260 PCB material

It has a good thermal conductivity

This means that the rate at which the transfer of heat occurs by conduction via a specific area is high. Also, there must be a temperature gradient exit that is perpendicular to that specific area.

It has a High CTI

CTI, which means comparative tracking index, reveals the extent at which a printed circuit board’s insulating material has the ability to resist the flow of any unwanted current between the board’s traces. This also measures the ability of a PCB substrate to be able to withstand breakdowns. Also, with the Shengyi Q260 PCB material, you can be sure it has a high CTI or an Excellent tracking resistance.

Cost effective

This means that the Shengyi Q260 PCB material is very productive and effective with respect to the amount it costs. It offers lots of great benefits that covers the overall cost and even offers much more for printed circuit boards.

Great Mechanical Processability

It is very easy to process Shengyi Q260 PCB material. Processability becomes simple because of its closeness to the best possible temperatures necessary for processing. Also, this means that with the Shengyi Q260 PCB material you will easily achieve the necessary schedules for processing.

Applications of the Shengyi Q260 PCB material

The Shengyi Q260 PCB material is applicable in various fields. These include power base boards, led lighting and display, household electrical machines, and automotive electronics.

Household electrical machine

The Shengyi Q260 PCB material is very useful in household electrical machines. These machines aid household functions like food preservation, cleaning, and cooking. Some of these household appliances include microwave, kettle, blender, and refrigerator.

Led lighting and display

The Shengyi Q260 PCB material is also applicable in Led lighting and display. This pcb material can be found in FLB capacitors. These capacitors aid in regulating the quantity of electricity that flows into a specific lighting fixture.

Power base board

This material is also useful in power base boards due to its high quality. It brings in all these qualities into the power base boards, thereby ensuring its reliability. This is why this heating system effectively controls your room’s temperature.

Automotive electronics

You can also apply the Shengyi Q260 PCB material into automotive electronics. These include those electronic systems used in radios, vehicles, computers, ignition, in-car entertainment, etc.

Conclusion

The Shengyi Q260 PCB material has a lot of great properties and it offers great value for your money. Choosing the Shengyi Q260 material for your printed circuit board also ensures the reliability of your product.

When it comes to multilayer circuit boards, there are PCB laminates you should consider using. The reason is, if you choose the wrong laminate for your board, the layers would not get bonded firmly. That is why the Shengyi SP175M is a good choice for designers and engineers.

The Shengyi SPI75M has some properties which make this laminate different from others. It is not just about these properties, it also has areas where you can apply Shengyi SP175M.

In this article, we shall discuss more on the main properties of this laminate, areas it is applicable, its features, and other interesting things you need to know about it.

What is Shengyi SP175M PCB Material?

This is a type of PCB laminate that works perfectly in bonding layers in the circuit board. Interestingly, it works for different boards. However, this laminate helps in connecting the multilayers in the PCB board.

Accordingly, this laminate has the propensity for high performance in the circuit board. It is suitable for different applications and multilayer devices. It can bond layers together for long without loosening up. Plus, it has properties that enable it to withstand any moisture or high temperature.

Note that, there are some kinds of laminates that can’t withstand environmental pollution. Any exposure to heat has negative effects on them. Although all laminates may have similarities they share but each laminate has some considerable degrees of temperature they can be exposed to.

One can use this type of laminate for some hardware like motherboards. Hence, it is because of the multiple layers of this hardware that makes the Shengyi SP175M applicable in such an area. 

Main Properties of Shengyi SP175M PCB Material

Note that this laminate has properties that you may find in other types of laminates. However, these main specifications make them connect layers together. Also, it may be hard to find these properties in laminates designers use for their single sided circuit boards.

There are physical properties as well as electrical properties in this type of laminate. There are classified aspects of these properties that are open for testing.

For instance, engineers and designers test the glass transition temperature of Shengyi SP175M so as to know the point at which the components may change when exposed to different degrees of temperature.

The following are properties to consider when using the Shengyi SP175M on your applications.

Physical Properties

There is no way you apply this laminate without considering its physical properties in relation to its strength. Therefore, one main feature to look out for in the physical property is the extensive feature. Also, the intensive feature makes up the physical property of Shengyi SP175M.

Hence, when measuring the physical components of this laminate ensure it doesn’t alter the chemical element or identity.

Electrical Properties

Importantly, this is one property of this laminate that measures the reaction of Shengyi SP175M to the electric field. One, you need to examine how it reacts to exposure to any electric field. Thus, this electrical property is the measurement of Shengyi SP175M PCB laminate resistance to electric current.

Hence, the electrical properties of Shengyi SP175M feature some dielectric strength, resistivity, thermoelectricity, and electrical conductivity. Thus, it also consists of the temperature coefficient of resistance. These are key components to check out for in electrical properties.

Thermal Properties

As an engineer, you need to consider the thermal properties of Shengyi SP175M PCB laminate. Here, you need to examine the components that change when there is expose to different degrees of temperature.

Chemical Properties

At this point, you consider this laminate reaction to chemical exposure. Although this is a potent laminate that retains its stability despite exposure to chemical reaction. In addition, this involves chemical reactivity of Shengyi SP175M.

Mechanical Properties

This implies that you examine the physical components that change as a result of force exertion on the PCB laminate. In some cases, the physical features of other laminates change after reaction to force.

Features of Shengyi SP175M

At this point, let us consider the features of this laminate. Some of these features may be found in other laminates. However, don’t forget that they all appear in varying degrees.

Exceptional Thermal Reliability

This laminate has exceptional thermal reliability. Therefore, you don’t have to worry if your appliances would function under high temperature.

Low Water Absorption

This laminate has low water absorption. This implies that it doesn’t allow the passage of water through it. Any form of moisture isn’t a threat to it.

Low Z Axis CTE

Interestingly, this laminate doesn’t have much expansion under increasing temperature. It retains its stability under high temperature.

Which Areas Can You Apply Shengyi SP175M PCB Material?

This laminate is applicable in various areas. However, you need to measure its properties carefully before using it in your applications. Mostly, it works for multilayer circuit boards.

High Aspect Ratio

When it comes to where it is suitable, it is an application related to high aspect ratio. It is for multilayer circuit boards.

Computer and Communication Equipment

This is one area where laminate is widely applicable. It is present in computers and many communication equipment.

Thus, it is also a kind of laminate you can use for mobile phones. Primarily, it makes it possible for the production of waterproof phones. Shengyi SP175M PCB laminate is useful in this regard.

Router, Switch, and Server

This is a type of laminate that aids faster processing of data through networks. It helps in connecting two WANs with the internet. Hence, this laminate helps server and switch operation.

Conclusion

With the Shengyi SP175M, you can be confident that the multilayers in your circuit board would be bonded nicely. Also, it can withstand heat and high temperature. As one of its properties, you need to study its reaction to force.

Therefore, this laminate is useful in different applications. It is present in modern day phones and computers. It makes the processing of communication equipment faster. When it comes to exposure to chemical reaction, this laminate may not be affected and wouldn’t change mechanical strength.

The significance of PCB materials in printed circuit boards cannot be overemphasized. They are also useful in different applications like military and medical, just to mention a few. Isola has been involved in many PCB materials. However, we will focus on just one in this article, which is the Isola P25N PCB Material.

The Isola P25N PCB Material has high thermal performance and great thermal properties. Therefore, if you have been searching for a PCB material that meets these requirements, you can work with the Isola P25N PCB Material. We know, you may be new to this topic, the more reason why we are here to help you understand what it is all about. In this article, we will discuss what the Isola P25N PCB Material is, its properties and its applications.

Please be relaxed, because we have a lot in store for you.

What is the Isola P25N PCB Material?

The Isola P25N PCB Material is made up of a system that suits industrial, commercial, or military electronic applications that require a better performance as well as great thermal properties.

Furthermore, the Isola P25N PCB Material utilizes a thermoplastic resin and polyimide, which is completely cured without using MDA (Methylenedianiline). What results is a polymer that features a high temperature for glass transition without possessing the difficulties that follow brittleness, as well as low bond strength that links with the traditional type of thermoset Polyimides.

The attributes of this material include high temperature and either a low or no flow prepreg. Its typical market applications include consumer electronics, aerospace and defense, and in medical and industrial instrumentation.

What are the Main Features of the Isola P25N PCB Material?

Below are the major features of the Isola P25N PCB Material.

Lead-Free Assembly

The Isola P25N PCB Material works fine with lead-free assembly. What this means is that the material works with lead-free assembly to help in preventing the use of any hazardous material. To explain better, it doesn’t utilize lead all through the manufacturing process.

High thermal reliability

The high thermal reliability of the Isola P25N PCB Material can survive all through the assembly of the printed circuit board without any possible defects such as delamination or blisters. Furthermore, it is reliable in the environment of operation through the material’s entire lifetime.

RoHS Compliant

The Isola P25N PCB Material is RoHS compliant. For this feature, this means the material has passed through tests for any prohibited substances.

What are the Applications of the Isola P25N PCB Material?

Below are those fields, where the Isola P25N PCB Material is useful

Aerospace and Defense

Choosing a specific material to use in the aerospace and defense field is very important. This is because the requirements are very demanding and must function effectively even in extreme and severe conditions.

These involve the ability of the Isola P25N PCB Material to resist radiation, humidity, and temperature cycling. It should also have the ability to resist shock and vibration. All these qualities are present in the Isola P25N PCB Material, which makes it suitable for military applications.

Consumer Electronics

A reliable PCB material like the Isola P25N PCB Material is also very important for use in consumer electronics. This is because it plays a role in reducing any possible errors as well as short circuits. As we know, printed circuit boards play a huge role in the technological world of today and it keeps improving. This is why there is a need to use high-quality PCB materials to get the best possible performance.

Medical

Medical printed circuit boards are useful in heart-related applications and the cardiovascular field. They also play a higher role in applications for medical imaging such as MRIs. Also, you can find them in monitoring gadgets and devices like monitors for body temperature. This is why the Isola P25N PCB Material is very useful here as it ensures the high-quality production of these medical PCB.

General Properties of the Isola P25N PCB Material

Temperature for Glass Transition (Tg)

This property helps in adding to the board’s thermal performance. The Tg of Isola P25N PCB Material is 250 degrees Celsius.

High Decomposition Temperature

The Isola P25N PCB Material has a decomposition temperature of 383 degrees centigrade at a weight loss of 5%. At this value, the Isola P25N PCB Material decomposes chemically.

Coefficient of Thermal Expansion (CTE)

The coefficient of thermal expansion reveals the amount of contraction or expansion that you should expect when cooling or heating the material. Before Tg, Isola P25N PCB Material has a CTE of 55 ppm/°C. Furthermore, at the X and Y axis, the coefficient of thermal expansion stands at 13/14 ppm/°C before Tg.

Thermal Conductivity

Thermal conductivity reveals the rate where the transfer of heat from a source happens to the material’s cooler region. The thermal conductivity of the Isola P25N PCB Material is 0.4 W/m·K.

Dielectric constant (Dk)

The dielectric constant of the Isola P25N PCB material comes in different values. At 100 MHZ, the value is 3.75, while at 500 MHz, its value is 3.72. Furthermore, at 1 GHz, it has a value of 3.70. At 2 GHz, the Dk is 3.67. However, the material in general features a dielectric constant of 3.67.

Dissipation Factor (Df)

Just like the dielectric constant, the dissipation factor of the Isola P25N PCB Material comes in different values. At 100 MHZ, the value is 0.0140, while at 500 GHz, its value is 0.0157. Furthermore, at 1 GHz, it has a value of 0.0180. At 2 GHz, the Df is 0.0198. However, the material in general has a dissipation factor of 0.018. The Isola P25N PCB Material has a low dissipation factor. This means that its insulating system is very efficient.

Conclusion

At the end of this article, you should understand the features, properties, and the applications of the Isola P25N PCB Material. You can surely bank on this material for your PCB needs. Please contact RayMing PCB today for your high-quality Isola PCB manufacturing.

The importance of PCB material in different applications cannot be overemphasized. In this article, we will be discussing one of the materials from Isola. This is the Isola 185HR PCB Material.

If you wish to know more or gain vast knowledge about the Isola 185HR PCB Material, please continue reading. This is because we will be discussing what it is and its features, its properties, application, and more. Let us begin by revealing to you what the Isola 185HR PCB Material is all about.

What is the Isola 185HR PCB Material?

The Isola 185HR PCB Material is a high-performance and proprietary resin system. This has a temperature for glass transition of 180 degrees Celsius for multilayer applications of printed wiring boards where there is a need for maximum thermal reliability and performance.

Furthermore, the manufacturing of the Isola 185HR PCB Material is possible making use of the patented technology of Isola, which is reinforced using electric grade glass fabric.

With this system, you get a decomposition temperature of 340 degrees Celsius. Also present is a lower coefficient of thermal expansion at the Z-axis. Furthermore, it delivers lower loss in contrast to the competitive products that are present in the space.

In addition, the Isola 185HR PCB Material is also UV blocking and laser fluorescing for the best compatibility with the AOI (Automated Optical Inspection) systems, solder mask imaging, and optical systems for positioning.

What are the Applications of the Isola 185HR PCB Material?

Below are some of the typical applications of the Isola 185HR PCB Material. These include aerospace and defense, consumer electronics, automotive and transportation, medical & instrumentation, and networking & communication.

Aerospace & Defense

The Isola 185HR PCB Material can play a huge role in aerospace and defense. This is because this material has what it takes to tolerate harsh environments, temperatures, pressure, and extreme stress. Some areas where this material is useful in the aerospace and defense field include helicopters, systems for radio communication, drones, radar installations, and more.

Consumer Electronics

Another aspect where the Isola 185HR PCB Material is applicable is consumer electronics. This material allows the routing of power and signals between these consumer electronics and devices. This is possible due to the different components playing different roles.

Automotive and Transportation

The Isola 185HR PCB Material is useful in the automotive and transportation filed. These include areas like transmission sensors, digital displays, ECU and ECL control modules, GPS systems, transmission sensors, power relays, on board radars, vehicle sensors and more.

Networking & Communication

Also, the Isola 185HR PCB Material is necessary for the networking and communication industry. This material is very important in the printed circuit boards used in manufacturing these electronic communication equipment.

Medical & Instrumentation

The Isola 185HR PCB Material could play a significant role in peacemakers, heart-related applications, cardiovascular field, and more. Also, they play a significant role in applications for medical imaging such as MRIs.

Features of the Isola 185HR PCB Material

Below are the major features of the Isola 185HR PCB Material.

CAF Resistant

The Isola 185HR PCB Material is CAF resistant. CAF here stands for conductive anodic filament. This means that this material has the ability to prevent the printed circuit board from going into the failure mode. CAF occurs whereby a salt (conducting), which contains copper can start forming in the printed circuit boards. This could cause the PCB to fail.

Lead-Free Assembly

Furthermore, the Isola 185HR PCB Material is compatible with lead-free assembly. This means that this material can work with lead-free assembly to prevent any use of hazardous materials. Explaining further, it means an assembly that doesn’t make use of lead all through the manufacturing process.

UV Blocking

The Isola 185HR PCB Material also has the UV blocking feature. This means that material has the ability to block the harmful rays of the sun. Also, this is because the material can absorb UV radiation.

ADI Fluorescence

Also, the Isola 185HR PCB Material features ADI fluorescence. This is another reason why pcb engineers love this pcb material.

RoHS Compliant

The Isola 185HR PCB Material is RoHS compliant. This means that this material has undergone tests for banned substances. This is usually conducted by independent authorities, and the test will reveal that the levels of those substances are less than the required RoHS threshold.

High thermal reliability

What this feature means is that the Isola 185HR PCB Material can survive all through the assembly of the printed circuit board without any defect like delamination or blisters. Also, it is reliable in the operation environment all through the lifetime of the product. Both aspects of thermal reliability shows the reliability of this printed circuit board material.

What is the Thermal Performance of the Isola 185HR PCB Material?

The thermal performance of the Isola 185HR PCB Material has to do with the temperature for glass transition and the decomposition temperature.

The Isola 185HR PCB Material has a temperature of glass transition of 180 degrees Celsius. This is a high Tg value, which means that this material has the ability to develop glassy-state properties like rigidity, stiffness, and brittleness, when it cools.

Also, the Isola 185HR PCB Material has a decomposition temperature of 340 degrees Celsius. This shows how strong this material is because you will need a high temperature of 340 degrees to be able to decompose it chemically.

What is the Electrical Performance of the Isola 185HR PCB Material?

The electrical performance of the Isola 185HR PCB Material has to do with the dielectric constant and the dissipation factor.

The Isola 185HR PCB Material has a dielectric constant of 4.01. This means that the material is significant for impedance considerations and signal integrity. Also, it has a dissipation factor of 0.020, which is very low. From this, it is clear that the material has the ability of holding energy or serving as an insulator.

Conclusion

We hope we have been able to explain what the Isola 185HR PCB Material offers. RayMing offers the best services when it comes to the Isola 185HR PCB Material. Please contact us today to get great value for your money.

In this article, we will be revealing to you all the necessary information concerning the Isola IS400 PCB Material. This is another PCB material that can serve different PCB needs as well as different applications.

Therefore if you have any questions or you wish to be knowledgeable in this regard, please keep reading.

What is the Isola IS400 PCB Material?

The Isola IS400 PCB Material is described as a prepreg and laminate that serves multilayer printed circuit board applications, which require a thermal performance that is demanding as well as high reliability.

This Isola material works with proprietary technology and features the fiberglass fabric. In addition, it features a low coefficient of thermal expansion at the Z-axis. Furthermore, its decomposition temperature value is 330°C.

Features of the Isola IS400 PCB Material

The following are the main properties of the Isola IS400 PCB Material

• Its temperature for glass transition is 150°C
• Also, it makes use of fiberglass fabric (E-glass)
• The laminate appears as a full-size panel sheet having a thickness that ranges between 0.05 – 2.4 mm
• Its dielectric constant is 3.90, while its dissipation factor is 0.022
• The prepreg also comes as a roll or panel
• Furthermore, it makes use of HTE or RTF copper foil of grade 3

Applications of the Isola IS400 PCB Material

This Isola prepreg material and laminate is majorly useful in the transportation and automotive industry. Furthermore, the Isola IS400 PCB Material is very useful in the PCB industry because its thermal resistance is high.

Resin System Type Used in the Isola IS400 PCB Material

The Isola IS400 PCB Material makes use of the epoxy resin system that has very low costs of material. Also they ensure different formulation variations.

Also, epoxy resins’ temperature of glass transition falls within 110 – 170°C. However, this type of resin system works fine with most PCB fabrication processes of Isola.

Enhancing the Copper Bond Present in the Isola IS400 PCB Material

The Isola laminates can experience failure of the copper bond due to shear that is produced in a thermo-mechanical way or an oxidation happening underneath the foil.

There are some copper treatments available, which both reduces the impacts of the attack from secondary oxidation, as well as enhances the bond.

This copper foil is treated by the growing nodules of copper that gives the bonding some “tooth” asides from the normal grain structure.

Also, in order to reduce any oxidation attack, the nodules are oxidized lightly by the manufacturers. Later on, they are treated subsequently using zinc or brass.

Furthermore, in some cases, they make use of nickel with treatments of chromate conversion as well as supplementary inhibitors of oxidation.

Different Fabric Styles of Fiberglass Used in the Isola IS400 PCB Material

The production of the Isola IS400 PCB Material makes use of different fabric styles of fiberglass. Whatever style of glass fabric you decide to use has to do with the amount of resin that it can possibly hold for filling and bonding.

However, the selection also has to do with the manner in which the style of fabric will affect how thick the printed circuit board will be or the completed Isola laminate.

Moreover, some options rely mostly not just on the thickness of the laminate but also on the secondary features. These include the cost, CTE control, stiffness, dimensional stability, and the dielectric constant.

Below are some of the commonly-used fabric styles for fiberglass when dealing with the Isola laminates. These include 7628, 2313, 2116, 1080, 106, and 104.

Fabrics that have lightweight and have their resin contents high usually provide resin-rich and smooth laminate surfaces. In addition, they make sure that there’s a superior fill present in the inner patterns.

Furthermore, fiberglass fabrics that are heavier provide a better dimensional stability. Also, it ensures the construction of a thicker Isola IS400 PCB Material at a reduced cost.

Also, making use of heavier fabrics, most especially the 7628, can affect the surface smoothness and drilling characteristics.

In addition, the heavy fabrics may be useful sometimes in the Isola IS400 PCB Material. This helps in reducing any costs that may break or deflect small drills.

What Differentiates the E-glass and the S-glass Fabric of the Isola IS400 PCB Material?

Denoted accurately as S2-Glass, the S-Glass has to do with a fiberglass of high-strength, which was initially developed to serve structural sectors.

This fiberglass type useful in the Isola IS400 PCB Material is quite different from the E-glass present in the composition and properties.

In composition terms, the S-Glass is made of a larger percentage of Silicon Dioxide and Aluminum Oxide, in contrast to E-Glass.

It is much more difficult to manufacture it compared to E-Glass because it requires a special drawing procedure. Also, it requires a melting point that is higher.

Also, the dielectric constant and the dissipation factor of the S2-Glass is lower in contrast to that of E-Glass. This is as a result of the higher percentage of silicon dioxide.

However, this fiberglass also features a lower coefficient of thermal expansion in contrast to the E-glass. Moreover, similar to the E-Glass, it is possible to place finishes on the S-Glass.

What this implies is that it works fine with virtually all resin system types for the Isola IS400 PCB Material. Therefore, use the S2-Glass whenever you need an enhancement in the dielectric constant and/or the coefficient of thermal expansion.

Quality Certifications of the Isola IS400 PCB Material

Yes, there are some necessary quality certifications, which the Isola IS400 PCB Material ought to have. These include the

• RoHS Certification
• BSI Certification
• CE Certification
• UL Certification
• REACH Certification

Etching and Imaging the Isola IS400 PCB Material

Yes you can image the Isola IS400 PCB Material making use of conventional dry films. Furthermore, these Isola laminates works fine with cupric chloride and ammonia etchants

Conclusion

Depending on what your requirements are, we at RayMing PCB offer high-quality Isola IS400 PCB Material as well as other Isola PCB materials and laminates. Contact us today to get the best value for your money!

The demand for high performance PCBs in electronic applications is rising. The PCB material is a core material for PCB fabrication. Therefore, its importance can’t be overemphasized. When we say PCB material, we don’t necessarily mean PCB laminate.

Some PCB materials are compounds that help to fill clearance holes. Arlon is a prominent PCB material manufacturer. This company produced the Arlon HF-50 PCB material to meet great demands.

What is Arlon HF-50 PCB Material?

Arlon HF-50 is a polyimide compound that helps in filling holes in metal core PCBs. Hence, this PCB material help manufacturers to fill holes drilled via the metal for through hole interconnections. Also, the ‘HF’ in Arlon HF-50 simply stands for Howefill.  Arlon HF-50 manufacturing is based on a polyimide chemistry. Therefore, this material is completely compatible with other Arlon polyimide laminates and processes.

This material is specifically formulated to enhance thermal conductivity. Also, it improves crack resistance and resin shrinkage back in holes.

Processing Guidelines for Arlon HF-50 PCB Material

Arlon HF-50 PCB material is a free-flowing powder. Some settling occurs during storage or shipping. Therefore, users should tumble it before use. Also, this helps to ensure even distribution of contents. Copper surfaces treatment can help to enhance bonds to metal. Therefore, use oxide process to treat copper surfaces. Also, you can treat aluminum surfaces by using passivation & chemical film deposition.

• Sift Arlon HF-50 onto the package on the two sides of the core you need to fill. Ensure you sift it onto the material. Also, sift more Arlon HF-50 on the core board’s top. Focus on areas with cutouts or holes. You can use a template to achieve this. Also, don’t forget to level the surface.
• Make use of pieces of prepreg on any of the side of the sifted Arlon HF-50. Place the powder evenly into the holes.
• Regulate the rate of heatup at 4.5-6.5^oC per minute. Also, use full pressure. However, this depends on the size of the panel. Cure HF-50 at 218^oC for 2 hours. Follow laminating instruction when laminating a core board with laminate and prepreg. Also, it is important to abide by the laminating instructions for the particular polyimide system used. This will offer full cure of all the components.
• After the cure, cool tit in the press. Also, ensure you use the suggested cooling rate which is about 4^oF/min.
• Panel can be either sanded or ground if required before subsequent operations. The drilling and plating processes will be similar to that of polyimide.

Thermal and Mechanical Properties of Arlon HF-50

Arlon HF-50 is an optimized polyimide hole fill PCB material with great properties. Due to these properties, it replaces HF 60B. Arlon HF-50 is a highly preferred polyimide compound in the PCB industry. This polyimide hole fill compound is ideal for multilayer PCB designs.

Exceptional Tg value

The glass transition temperature of this polyimide compound is more than 250^oC. Therefore, it functions well when in PCB laminates. This means that this compound can function well in PCBs subjected to high temperatures.

Excellent thermal conductivity

The thermal conductivity of Arlon HF-50 PCB material is above 0.5 W/m-K. Due to this value, Arlon HF-50 features enhanced thermal conductivity.

Low Z-axis CTE

The CTE on the Z-axis is 26 ppm/^oC. Also, this is a very low Z-axis CTE. Therefore, this material doesn’t expand in size when subjected to high levels of temperature.

Water absorption rate

The water absorption rate of Arlon HF-50 PCB material is 0.4%. This is a bit high. Normally, PCB materials should have a water absorption range between 0.1 and 0.2%.

Benefits of Arlon HF-50 PCB Material

Arlon HF-50 PCB is a very reliable PCB material that features great benefits. Due to these benefits, it is a great alternative to other polyimide compounds.

Non-MDA polyimide

Arlon HF-50 PCB material is a polyimide compound free of MDA. Therefore, this material replaces composite materials that feature methylenedianiline (MDA). Generally polyimide materials feature high heat-resistance. Due to this, they are widely used in applications that require rugged materials.

Compatible with other polyimide materials

Arlon HF-50 is highly compatible with other Arlong polyimide materials. Also, it is specially formulated based on polyimide chemistry. Therefore, it is compatible with 35N, 85HP, and others.

Low shrinkage

Another great benefit of using Arlon HF-50 is its low shrinkage. This material reduces resin shrinkage back into the holes. Also, it minimizes radial cracking when used to fill clearance holes.

Excellent thermal properties

Arlon HF-50 PCB material offers excellent thermal properties. Therefore, this ensures thermal reliability. This polyimide powder features low Z-axis CTE and very high Tg.

Applications of Arlon HF-50 PCB Material

Arlon HF-50 PCB material is different from other polyimide products. This is because it is a polyimide compound formulated for filling holes in metal core PCBs. Typically, Arlon HF-50 PCB material helps to fill up clearance holes in metal core PCBs. Therefore, its areas of applications are quite different.

Aluminum cores

The use of polyimide compound to fill aluminum core PCBs is very common. However, not all compounds function well in aluminum cores. Arlon HF-50 PCB material features enhanced mechanical and thermal properties. Therefore, it is ideal for aluminum cores. Arlon HF-50 increases the thermal conductivity of aluminum cores when used to fill clearance holes.

Copper cores

Arlon HF-50 PCB material is a high performance polyimide compound with great properties. Due to these properties, Arlon HF-50 is widely used in high performance boards. Also, this compound is ideal for filling holes due to its excellent properties. One of the most important benefits of this compound is its thermal resistance. Copper cores PCB fabrication requires materials with great thermal resistance.

Copper-Invar Copper

Copper-Invar Copper strengthens PCBs in high temperature environments. Also this PCB material controls expansion when used in circuit boards. However, the use of Arlon HF-50 in copper-invar-copper contributes to its exceptional performance in PCBs.

Conclusion

Arlon HF-50 is anon-MDA polyimide compound with great properties. This article provided in-depth information about Arlon HF-50 PCB material and its uses. We hope you have been able to gain more knowledge with this information.

PCB materials are necessary in printed circuit boards and can serve different applications as well. There are so many PCB materials from Isola, but the one we’ll be focusing on in this article is the Isola IS415 PCB Material.

This material is known for its high thermal performance and its usefulness in different applications. If you are confused about the topic, we expect that. That’s why we are here to enlighten you on what the Isola IS415 PCB Material is, its properties and areas where it is applicable.

Please stay on this page to learn all you need to.

What is the Isola IS415 PCB Material?

The Isola IS415 PCB Material sets a high industry standard for epoxy materials with a high thermal performance. Also, it works great for designs that require a signal integrity that is high.

The engineering of this product is to meet the high demands of the lead-free multiplayer PCB assembly. Also, it focuses on delivering CAF resistance, thereby having a strong IST result. Furthermore, it maintains fr-4 processing.

In addition, the Isola IS415 PCB Material offers superior thermal and chemical performance as well as a great electrical performance and consistency of the product.

The attributes of this product includes a density interconnect that is high, thermal reliability that is high and a high speed digital. Furthermore, the market applications of the Isola IS415 PCB Material include computing and peripherals.

What are the Features of the Isola IS415 PCB Material?

Below are the major features of the Isola IS415 PCB Material.

CAF Resistant

The Isola IS415 PCB Material is CAF resistant. CAF here stands for conductive anodic filament. This means that this material has the ability to prevent the printed circuit board from going into the failure mode. CAF occurs whereby a salt (conducting), which contains copper can start forming in the printed circuit boards. This could cause the PCB to fail.

UV Blocking

The Isola IS415 PCB Material also has the UV blocking feature. This means that material has the ability to block the harmful rays of the sun. Also, this is because the material can absorb UV radiation.

Lead-Free Assembly

Furthermore, the Isola IS415 PCB Material is compatible with lead-free assembly. This means that this material can work with lead-free assembly to prevent any use of hazardous materials. Explaining further, it means an assembly that doesn’t make use of lead all through the manufacturing process.

High thermal reliability

What this feature means is that the Isola IS415 PCB Material can survive all through the assembly of the printed circuit board without any defect like delamination or blisters. Also, it is reliable in the operation environment all through the lifetime of the product. Both aspects of thermal reliability show the reliability of this printed circuit board material.

ADI Fluorescence

Also, the Isola IS415 PCB Material features ADI fluorescence. This is another reason why pcb engineers love this pcb material.

RoHS Compliant

The Isola IS415 PCB Material is RoHS compliant. This means that this material has undergone tests for banned substances. This is usually conducted by independent authorities, and the test will reveal that the levels of those substances are less than the required RoHS threshold.

What are the Properties of the Isola IS415 PCB Material?

Below are the main properties of the Isola IS415 PCB Material

Low Temperature for Glass Transition

This is denoted as Tg. This helps in measuring the temperature whereby a printed circuit board material changes into a rubber-like state from its solid state. The property helps in contributing to the board’s thermal performance. The Tg of Isola IS415 PCB Material is 200 degrees Celsius.

High Decomposition Temperature

The Td of the Isola IS415 PCB Material is 370 degrees centigrade at a weight loss of 5%. Decomposition temperature helps in measuring the temperature whereby the Isola IS415 PCB Material decomposes chemically. Furthermore, it is very ideal for a printed circuit board material to have a decomposition temperature that is above 320 degrees Celsius.

Coefficient of Thermal Expansion (CTE)

The CTE value specifies the amount of contraction or expansion to expect when you cool or heat the material. Before Tg, the Isola IS415 PCB Material has a CTE of 45 ppm/°C. Furthermore, for post Tg, it has a CTE of 240 ppm/°C. Also, during total expansion that falls between 50 – 260 degrees Celsius, it has a typical value of 2.8%.At the X and Y axis, the coefficient of thermal expansion stands at 13 ppm/°C before Tg.

Thermal Conductivity

Thermal conductivity has to do with the rate whereby the transfer of heat from a source occurs to a cooler region in the material. The thermal conductivity of the Isola IS415 PCB Material is 0.4 W/m·K.

Dielectric constant (Dk)

The dielectric constant of the Isola IS415 PCB Material varies. At 1 GHz, 5 GHz, and 10 GHz, it has a dielectric constant of 3.71. Furthermore, at 2 GHz, it has a dielectric constant of 3.72, while at 100 MHz, it has a dielectric constant of 3.75.

However, generally, the material has a dielectric constant of 3.72. The dielectric constant has to do with the ability of the material to store charges.

Dissipation Factor (Df)

The dissipation factor of the Isola IS415 PCB Material varies. At 100 MHZ, the value is 0.0107, while at 1 GHz, its value is 0.0131. Furthermore, at 2 GHz, it has a value of 0.0120. At 5 GHz, the Df is 0.0127, while at 10 GHz, it has a value of 0.0125.

However, generally, the material has a dissipation factor of 0.0120. This value reveals how the Isola IS415 PCB Material will perform when used in different applications. This material has a low dissipation factor. This means that its insulating system is very efficient.

Conclusion

As we have explained in this article, it is clear that the Isola IS415 PCB Material possess great qualities. It will also serve different PCB needs. Please if you have any questions, feel free to reach out to us

Unarguably, Shengyi SH260 PCB serves as one of the best laminates you could ever use for your multilayer circuit boards. Interestingly, just like every other laminate, this type of laminate has some special features which make it stable for use.

No doubt, this PCB laminate is applicable in various areas. So, you need to find out more about the Shengyi SH260 PCB if you have interest in design. This article focuses on everything you can know about this laminate.

What is Shengyi SH260 PCB Material?

It is paramount to first know what Shengyi SH260 means. Primarily, it is a kind of laminate that one uses to bond layers of the circuit board. Moreover, this is applicable to multiple layers of the PCB. It firmly connects every layer of the board making it ready for use.

Among several laminates, this is one that can resist dust particles. Some laminates are weak and gradually the layers of the board begin to loosen up after some months. However, this is a blend of durability and stability because it doesn’t only last long but retains its stability in any environment.

This is a PCB material that has a propensity for high performance. Thus, this is a polyimide laminate which has ultra low water absorption. The Shengyi SH260 PCB has a prepreg raw component with non-MDA thermochemistry. It comes with copper density which is rigid and can last long without any negative effect from heat.

 Also, it has strong mechanical and electrical properties. This Shengyi SH260 is very effective for communication boards. Hence, it helps faster processing and can easily transmit electrical circuits. This is a laminate that has a tendency to bond panels together with composite of raw FR-4 material.

 Therefore, it has several surface finishes that connect thin layers of the circuit board. The tensile strength of this kind of PCB laminate is high. Shengyi SH260 is produced from substrate components that are non-conductive. Plus, it comes with copper circuitry which could be on the external surface. Also, this could be present internally. It works for applications of high density with multiple layers.

What Are The Features of The Shengyi SH260?

This is a PCB material that has many features that make it beneficial to your board. When designing the circuit board, this is a kind of laminate that can help bond your multiple layers. Moreover, this is why it works with high performance.

Fire Resistance

This is a PCB laminate that has a fire barrier. So, it definitely can withstand fire without damaging effect. Fire doesn’t affect the structure of this kind of laminate. Still, it works under heat intensity and can be described as flame resistant.

No amount of heat, fire, or flame can destroy this Shengyi SH260 structurally. To simply put, it is fireproof. For an assigned time, it stays under fire and never transmits heat. Also, there is no harm or damaging effect on the side exposed to fire.

Lower Z Axis CTE

When it comes to PCB material with lower Z axis CTE, the Shengyi SH260 is one to consider. Invariably, this is also property of some other laminates.

As a result of this, it offers some PTH dependency. This low CTE is about 1.20%. No matter the increasing temperature, this laminate doesn’t in any way expand its coefficient thermal expansion. Note that, no degrees of temperature can cause Shengyi SH260 to have much expansion.

Mechanical Strength

This is a different kind of laminate because no matter the high temperature, it retains its mechanical strength. So, it is not like some laminates that cannot retain their bonding strength when exposed to high degrees of temperature.

This laminate retains both its bonding strength as well as mechanical strength whenever it exposes to increasing temperature. That is why it has non-MDA thermochemistry too.

Lead Free Compatibility

This laminate has lead free processing which is compatible with its chemistry which is halogen free. It doesn’t need any inclusion of materials which contain lead for processing. It also has a very tough resin component which makes it unique among several laminates.

Weather Resistance

The same way it is fire resistant, moisture resistant, and chemical resistant, it is weather resistant. Still, this laminate doesn’t become weak whenever you expose it to harsh weather conditions or UV radiation. It works well in any kind of weather. Also, it has low moisture absorption.

Where is Shengyi SH260 PCB Applicable?

Interestingly, this is a class of laminate that works in different designs and industries. It always bonds multilayer circuit boards.

Aircraft

This is a laminate that circuit boards in airplanes use. It works perfectly for high density components. It makes the connection of circuits possible.

Power Supply

The Shengyi SH260 PCB works for the power supply and industrial services. It is a laminate you can find in electrical transformers.

Optical Communication

This also works for satellites and POTS. It works specifically for networking in local areas and helps with transmitting current. It aids processing and high performance in optical communication services.

Burn-in-Board

Shengyi SH260 PCB is applicable for burns in boards. It aids burn in procedure and easily discovers any defects in boards.

Why Choose The Shengyi SH260?

There are tons of reasons you should consider choosing this Shengyi SH260 laminate.

Easy to Use

Well, this is not a complicated kind of laminate. It has a simple design and can be used easily.

Affordable

In addition, this is not pricey. Although it is durable, it is cheap to get.

Mechanical Strength

This maintains its structure no matter the high temperature it gets exposed to. It is weather resistant and comes with halogen free FR-4 material. Therefore, high temperature is never a threat to this PCB laminate material.

Conclusion

Shengyi SH260 has a lot of advantages tied to its unique features. This waterproof laminate can withstand any form of moisture. Therefore, it has low water absorption which doesn’t allow water flow through it.

There are many areas where you can apply this laminate. It also has many reasons engineers use it. It has a way of retaining its stability under high temperature.