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What are the Recommended Process Conditions of the Arlon 37N PCB Material?

Every PCB manufacturer seeks the best materials for their PCB needs. They seek materials with great features and properties, to ensure the reliability of their PCB products. One of the main properties that they seek is if the material has excellent thermal stability. One of such materials is the Arlon 37N PCB Material.

This material from Arlon has the necessary features that make it useful in different applications. If you are here to learn more about this material, welcome. You are in the right place. In this article, we will talk about all the properties of the Arlon 37N, why it is useful in different applications, and its recommended process conditions.

Read on to gain vast knowledge in this regard.

What is the Arlon 37N PCB Material?

The Arlon 37N PCB Material is a low-flow polyimide prepreg that suits polyimide bonding multilayer rigid-flex. It also suits the attachment of heat sinks to the polyimide MLBs, as well as other applications where there is a need for uniform or minimal resin flow.

Furthermore, the Arlon 37N PCB Material has great thermal stability. Also, it can be cured for a temperature of 350 degrees Fahrenheit, which is low. The Arlon 37N PCB Material also has excellent and great thermal stability.

The Applications of the Arlon 37N PCB Material include industrial and commercial PWB electronics, space, aerospace, and military. Lastly, it meets the requirements of the IPC-4101/42.

What are the Properties of the Arlon 37N PCB Material?

The following properties below, shows what the Arlon 37N PCB Material has to offer.

Physical Properties

The Arlon 37N PCB Material has the following physical properties. It has a flammability rating of V0 as well as a thermal conductivity of 0.3 W/mk. Furthermore, it has a density of about 1.6 g/cm3, as well as a water absorption value that is less than 1.0%

Thermal Properties

The Arlon 37N PCB Material has the following thermal properties.  Its temperature for glass transition is at 200 degrees Celsius.

Also, its decomposition temperature is 322 degrees Celsius at the initial. Then at a weight loss of 5%, the value becomes 340 degrees Celsius. At 50 – 260 degrees Celsius, the Arlon 37N PCB Material’s expansion along the Z-axis is 2.3%.

For the X, Y axis it has a coefficient of thermal expansion (CTE) of 17 ppm/C. The T260 are all higher than 60 minutes, while for T300, T288, the values are 2 minutes and 5 minutes respectively

Electrical Properties

The Arlon 37N PCB Material has the following electrical properties. Its dielectric constant is 4.25 at 1 MHz. It has a volume resistivity of 8.2 × 109 MΩ-cm for C96/35/90, while at E24/125, it has a volume resistivity of 4.7 × 109 MΩ-cm. Also, at 1 MHz, it has a dissipation factor of 0.018

Furthermore, this PCB material has an electrical strength of 52.4 kV/mm and an arc resistance is 124 seconds. Its surface resistivity at E24/125 and C96/35/90 is 1.2 × 109 MΩ and 4.4 × 106 MΩ respectively

Mechanical Properties

The Arlon 37N PCB Material has the following mechanical properties. Its Poisson’s Ratio is 0.17 and its young’s modulus for CD/MD is 2.1 Mpsi or 14.5 GPa.

In addition, its peel strength with respect to copper is 1.2 N/mm after thermal stress. Then at elevated temperatures, it stands at 0.9 N/mm, while after process solutions, the value is 1.6 N/mm. Also, the tensile strength is 221 Mpa or 32 kpsi.

Recommended Process Conditions of the Arlon 37N PCB Material

Due to the different storage conditions, you should dry the Arlon 37N PCB Material at 736 mm Hg. This should be done between 12 – 24 hours.

Furthermore, the Arlon 37N PCB Material laminates properly either with hot start or cold press starts. We recommend that you use either vacuum assist or the vacuum assist lamination to get rid of air and moisture. Furthermore, low-flow materials don’t remove air voids, same for standard prepreg. What vacuum will do is that it will assure that the final product comes void-free.

For the lamination cycle, vacuum the package. This should be done for thirty minutes and at 736 mm Hg, before you go ahead to apply pressure. Also, maintain this vacuum beyond the resin’s set point i.e. above 160 degrees Celsius.

Make use of a platen temperature that falls within 370 degrees Fahrenheit and 380 degrees Fahrenheit. Also, control the rise in heat to 8 – 12 degrees Fahrenheit every minute between 210 to 300 degrees Fahrenheit.

The pressure you should use should fall between 180 and 350 psi. This depends on the complexity and size of the panel.

In addition, note that the cure time should be 9 minutes. Furthermore, subsequent processing has to b e similar to those utilized in rigid flex printed circuit boards.

What are the Applications of the Arlon 37N PCB Material?

The applications of the Arlon 37N PCB Material include those where uniform and minimal resin flow is important. Also this is useful during the attachment of heat sinks to the polyimide MLBs. Also, it is applicable in bonding polyimide multilayer rigid-flex.

Other areas where the Arlon 37N PCB Material is useful includes Industrial and commercial PWB electronics, space, aerospace, and the military. This shows the reliability of this PCB material.

What are the Benefits of the Arlon 37N PCB Material?

The benefits of this material is as follows

  • RoHS/WEEE compliant
  • Mechanical and electrical properties that meet the IPC 4101/42 requirements
  • Great thermal stability
  • It is curable at low temperature of 177 degrees Celsius or 350 degrees Fahrenheit
  • Great bond strength to copper Kapton polyimide, as well as other metals
  • The material’s temperature for glass transition has an expansion characteristics that is similar to that of polyimide, which increases the reliability of the PTH greatly
  • Comes in different fiberglass styles and flow ranges for the best process flexibility

Conclusion

We hope you have been able to learn much about the Arlon 37N PCB Material. You can contact us at RayMing PCB for all your questions regarding the manufacturing of this material. We are here to make the process easy for you.