FPC lamination process and its main compaction material introduction

FPC lamination process and its main compaction material introduction



FPC circuit board is also called flexible circuit board, or "flexible board". In the industry, FPC, is a printed circuit board made of flexible insulating substrate ( mainly polyimide or polyester film), which has many advantages that hard printed circuit boards do not have. For example, it can bend, roll, fold, use FPC can greatly reduce the volume of electronic products, meet the needs of electronic products in the direction of high density, miniaturization, high reliability, therefore, FPC in space, military, mobile communications, Laptop computers, computer peripherals, PDA, digital cameras and other fields or products have been widely used.



FPC machine


FPC lamination process: lamination and opening die feeding / closed die prepressing / cooling / opening / cutting process ready TPX detached film\ steel\ silica gel and dust adhesive cloth or dusting paper to clean steel before the production of the following process: 1. Board\ silica\ off film surface dust, Sundries, etc. The size of the detached film (500m*500m) is opened and placed in the laminated area. After one cycle of each lamination, 400 pieces of spare steel plates are needed, so that the continuous production will not break the material. When laminating operation, you should wear gloves with both hands or fingers with 5 fingers. It is strictly forbidden to touch soft plates with bare hands. D. When the plate is stacked, the steel plate is placed first. Keep this stack of 10 layers (except for special requirements), with the number of FPC placed on each layer to determine the number of pendulable FPC layers per 1PNL plate size (the distance from the plate to the four sides of the silica gel should be maintained above 7cm), The FPC should be placed in the middle of the silica gel as far as possible, and each plate should be spaced at a distance of 2 cm. The thickness of the FPC should be consistent in each layer (for example, the single panel cannot be mixed with the multilayer), and every opening and every layer of FPC should be the same. And the position and order of the pictures are roughly the same. When placing, the FPC coating surface or the paste reinforcement surface should be faced up, and the detached film should be flat and covered on the soft plate without wrinkling or folding. After the operation, the stacked FPC should be laid flat on the transport belt. To the next procedure.


FPC lamination material

  1. Detached membrane


With the aid of strict quality control and curing through the back stage, it has the characteristics of high temperature resistance, good separation effect and no pollution in the pressing process. The detached film can be supplied in the form of rolls and customized sizes to meet the different specifications of the customer and provide the appropriate and onlook-applied liquid pressure required to drive the laminate components to the dense lamination. It eliminates air entering the bottom of the protective layer and between the circuit board.




  1. TPX detached membrane


the effect is similar to that of the above type membrane, but some manufacturers of FPC circuit board have strict requirements. TPX detached film is a kind of high performance molecular material and can be used for all kinds of applications of high performance demoulding film. It is used as the main circuit board and cutting edge material of flexible printing substrate (FPC) by its excellent demembrane and heat resistance. Demoulded film for various occasions, with single-layer and multi-layer products, can be selected according to the use.


3.Steel plate


pcb material


4.Silicone cushion / silicone cushion


divided into red rubber pad and green rubber pad, it is a kind of synthetic elastic cushion made from silicone gel and polymer. The intermediate layer is glass fiber substrate, which greatly improves the strength and times of use of red silicone cushion. It has the characteristics of buffer, detachable, thermal equalization and so on. It is mainly used in hot pressing situations with high buffer requirement, such as: circuit board (FPC,PCB, soft and hard bonding board), solar energy, aerospace, power locomotive, die pressing, etc. Busbar compression and other fields.


5.The cushioning pad used repeatedly


it is developed and produced in accordance with the ultra-high temperature press used in the PCB industry at present. When the pressing temperature of the circuit board exceeds 260 ℃, the general auxiliary materials such as Kraft paper, cushioning pad and other auxiliary materials can no longer meet the high temperature pressing demand. Higher temperature resistant fibre must be used