Once in ten years of intergenerational upgrading, 5 G brings PCB/ copper clad material demand and value-added dual increase. China's IMT-2020 (5G) propulsion group has proposed 5G "five key technologies". The ecology of the wireless access network device industry chain has changed greatly. 1) 5G RF will be introduced into Massive MIMO ( large-scale antenna array) technology. The number of 5G base stations is increasing significantly compared with 4G, and we estimate that 2/3 of the antenna output of mobile base stations will be transferred to the PCB industry chain, so we estimate that the value of high-frequency PCB/ copper clad material for 5G base station antennas will be more than 10 times that of 4G. 2) 5G network will carry more broadband flow. Routers, switches, IDC and other equipment investment will be increased, and the demand for high-speed PCB/ copper clad material will increase significantly. In addition to the increase of demand, the high performance equipment will use high frequency (antenna) high speed (IDC/ base station) board material with higher added value, which will bring the added value and consumption of PCB/ copper clad material industry chain to increase.
RF-35 power amplifier-Taconic material pcb
5 G communication equipment will be the core driving force of PCB industry in the next 3 years. PCB industry has entered a mature period, the traditional application market has been saturated, the key to growth depends on the downstream emerging subdivision. Prismark believes cars and communications equipment will become a new engine for industry growth over the next five years. Whether automotive electronics (life-related) or communication equipment (single equipment value, involving a wide range), manufacturers will directly equipment upstream material certification. The automobile intelligent driving and new energy vehicle market has been growing rapidly in recent years, but the certification threshold of the automobile plate market is higher, especially the core components with high added value, such as ADAS, energy management, which are difficult for Chinese mainland manufacturers to break through in a short time. Comparatively speaking, the downstream equipment manufacturers in the field of communication in China have already realized the transition from follower to leader in the 5G era. 5 G is expected to achieve a higher-end upstream high-frequency / high-speed plate material substitution. We believe that PCB will be the core driver of industry growth in the next 3 years.
Rogers High-frequency PCB
5 G bring high-end materials localization opportunities, from cycle to growth. Copper clad laminate is the main material of PCB. Copper clad Laminate products have traditional products and high-end products. The traditional products are mainly epoxy glass fiber board (FR-4 and modified FR-4) and simple composite materials (CEM-1, CEM-3). At present, the production capacity has been basically transferred from Europe, America and Japan to mainland China; The output value of copper clad material in mainland China has accounted for 65% of the world. At the same time, high-added special materials copper clad laminates are still monopolized by foreign companies such as Rogers, Taconic and Panasonic. Special materials copper clad material generally refer to copper clad laminates made with special resin fillers of a certain proportion. The main filling materials include PTFE (millimeter wave radar and very high frequency communication). Hydrocarbons (6GHz base station radio frequency), PPE/CE (high-speed multilayer PCB) and so on. Special material copper clad laminate has higher added value and higher unit price than traditional FR-4 products, so it is not affected by the periodic fluctuation of raw materials. As demand increases in the coming 5G and automotive electronics, high-end manufacturers can share the dividends of growth in emerging downstream areas. In the 5G age, domestic companies with high-end production capacity are expected to gradually break through foreign monopoly, desalinate the original cycle attribute, and welcome the double promotion of performance and valuation.
Taconic RF60A HF 2 Layer Antenna PCB
5 G equipment PCB sharing will be determined by the "Process+Material". Upstream high-end materials are important, but the process and design have a great impact on the final performance of PCB products. "Process+Material" will share the industry added value of 5G. 5G high frequency / high speed boards need PCB impedance control during the design process. The performance of 5G equipment PCB is very high, such as the number of layers, area (large area, small thickness to diameter ratio), drilling precision (small holes size, plate alignment), wire (line width, line space) and so on. Therefore, higher technological cooperation is needed in the process of PCB processing.
RayMing Technology is ready to provide 5G antenna PCB manufacturing services for all 5G customers , contact us for a quote today!