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Why TQFP Package is an Ideal Package Option for Integrated Circuits

Integrated circuits are usually packaged differently. IC packages encase and protect the circuit material from physical damage and corrosion. These packages are available in different types. Also, there are different ways to classify these packages.

The most common materials used in packaging integrated circuits are ceramics or plastics since they feature improved electrical conductivity. Our main topic focuses on the TQFP package, a type of IC package.

What is a TQFP Package?

A TQFP package is a type of IC package which refers to tin quad flat package. This IC Package has a smaller footprint. As the full name of TQFP suggests, this IC package is a thin variant of the quad flat package. TQFP package has gull wings which extend from all the sides of the package. This package is available in various body size ranging from 5m square to 20 mm square.

The TQFP package features the same footprint as the LQFP. This indicates that these two IC packages have the same size. Also, there are a variant of the quad flat packages. Despite their similarities, the leads of TQFP are shorter than that of LQFP. TQFP has proved to be very useful when reducing the overall PCB thickness.

It is a perfect option when you need to make a printed circuit board more compact. The gull wings present in TQFP package extends from all the four sides. This package is one of the thinnest IC package in the market. The pin counts of this IC package starts from 32 to about 256 pins. Its body sizes also ranges from 7 x 7, 14 x 14, and 10 x 10.

TQFP packaging process requires the use of a low loop wire bonding process and a good package control. The IC packaging process integrated in TQFP packaging is the flatpack package. When Quad Flat Package (QFP) gained popularity, this package was commonly used in Europe. However, the QFP became popular across other countries like the United States.

Presently, the US’ military standard for surface mount components packaging in circuit boards is the flatpack package. The TQFP package is ideal for electronic projects that need cost-effective, reliable packages.

How TQFP Package Tackles Some Industry Problems

Spartan 6 TQFP Package
Spartan 6 TQFP Package

TQFP is a reliable IC package widely integrated in printed circuit boards. This type of IC package has helped to provide solutions to some common problems in the industry. TQFP package solves problems associated with PCB designs. Below are some of the problems solved by this package

Die shrinking

TQFP package provides a long lasting solution to die shrinking. Die shrinking occurs when the design chip contents i.e the geometries for he layout of the die shrinks down to a smaller node to help in minimizing the footprint’s size in a package. TQFP package makes die shrinking less noticeable below where it is positioned.  

TQFP package prevents die shrinking through the enhanced thickness of the die wire.

IC package portability

Some IC packages are not portable. With TQFP packages, it is possible to get the portability needed. This is because of the thinness of its quad flat package.

Benefits of TQFP IC Package

There are several advantages of using the TQFP package in printed circuit boards. These advantages give them edge over other type of QFP packages.

Suitable for smaller electronic devices

Due to the thin profile of the TQFP, this package is ideal for use in smaller electronic devices. They help PCB manufacturers to fabricate smaller circuit boards which are used in smaller electronics.

Environmentally friendly

TQFP package comprises green materials. The materials used in the production of this IC package are lead-free and as such it is environmentally friendly. Also, this makes TQFP package RoHS compliant and as well standardized.

Smaller package form factor

This is another advantage of TQFP. The TQFP package has a smaller package which makes it ideal for high frequency applications. Also, its reduced parasitic parameter is a big advantage of this IC package.

Package reliability

An IC package should offer the necessary reliability needed for its utilization in certain applications. TQFP package has several pin counts which makes it a reliable option. The numerous pin counts help this IC package perform better in several applications.

TQFP keeps providing benefits for engineers and designers. This cost-effective package delivers mechanical and thermal stability.

Limitations of TQFP IC Package


Despite the benefits of this IC package, it has got its won limitations. Therefore, PCB manufacturers need to expect some design challenges when integrating this package on their PCB projects. Some of the limitations of TQFP package include:

Solder bridges problem

For a TQFP package, the spaces need to be decreased form more pins. In as much as this sounds as a good idea, there are some problems associated with this. Decreasing the spaces for more pins has placed more demands on soldering. Therefore, PCB manufacturers are more likely to experience solder bridges when using the TFQP package.

Minimized spacing

Another disadvantage of using the TFQP package is decrease spacing. Amongst the quad flat package types, TQFP has the smallest spacing. This is because of the reduction of spaces available. The available spaces have been reduced from 50 mil to 20 mil and 12 mil. The reduction in spacing helped to provide more spaces to add more pins. However, this has posed some problems.

Possible Challenges Associated with Working with TQFP

Designers and engineers can encounter some possible challenges when working with the TQFP package. Due to these challenges, TQFP isn’t straightforward. Therefore, you will need to pay attention to some of these problems while working with this package.

Avoid mishandling the pins

The pins on TQFP are small and have little spacing. The little spacing and small pin size can cause damages, especially when the pins are mishandled in the packaging process. Therefore, it is crucial to keep the pins in a safe position. You can make use of the pick and place machines for the whole packaging process. These machines reduce errors by eliminating human inputs in most aspects of the design. Also, these machine perform their functions without damage.

Another way to avoid mishandling the pins is careful storage. It is advisable to store the pins in a safe place. You can request for proper storage as this keeps the pins protected from any form of damage.

Be careful with the TQFP pins

TQFP packages have more pins which helps in increasing the density of this package. However, it can result in some possible issues. For instance, you want to maintain proper spacing between one pin and the next pin. Doing this will help in preventing any overlap in the performance of the pin.

Benefits of SMT Integration in TQFP

Surface mount technology (SMT) is a packaging type for TQFP. The integration of SMT in TQFP offers these benefits:

Improved EMC performance

EMC also referred to as electromagnetic compatibility refers to the capability of electronic devices and components to perform well despite their proximity.

Automated methods

Surface mount technology integrates automation to place components on a PCB. This automation minimizes human inputs and as such, saves costs.

Applications of TQFP

TFQP is the thinnest quad flat package. It offers a wide range of benefits and as such, it is widely used in various applications like

  • Semiconductor applications like gate arrays and microcontrollers
  • Computing applications
  • Communications boards such as integrated service digital network and Ethernet
  • Telecommunications
  • Chipsets for Laptops and Tablets
  • Video/ audio applications
  • Data acquisition

Frequently Asked Questions


What is the Difference Between TQFP vs LQFP?

The TQFP package features the same footprint as the LQFP. This indicates that these two IC packages have the same size.. Despite their similarities, the leads of TQFP are shorter than that of LQFP. While TQFP stands for Thin Quad Flat Package, LQFP stands for low-profile flat package. Also, there are a variant of the quad flat packages. TQFP has proved to be very useful when reducing the overall PCB thickness.

LQFP is easier to mount due to its longer leads. The lead count range of TQFP is between 32 to 176 while that of LQFP is between 32 to 208. TQFP is usually compared to LQFP due to their similarities. However, the main difference between these two IC packages is in their height. LQFP has a height that is about 1.7mm while the height of TQFP is less than 1.2mm.

How does TFQP Integrate Limited Spacing With More Pin Counts?

The thin quad flat package features limited spacing, however, this package type makes up for this weakness by using more pins. TQFP can use certain gate arrays like the Pin Grid Array and Ball Grid Array packages. This integration helps in minimizing the challenges that comes with spacing the leads. Also, it enables smooth connections around the package and as well as improve the pin count of smaller IC packages.


TQFP is a good IC package option that has proved to be effective. As a variant of the quad flat package, it features a very small footprint. This IC package has its advantages and disadvantages. We have explained how TQFP works and its use cases in this article.




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