RO4000 LoPro Laminates are advanced circuit materials designed for high-frequency applications. Developed by Rogers Corporation, these laminates offer exceptional electrical performance and reliability. They feature low dielectric loss, tight thickness control, and excellent thermal stability. Rogers RO4000 LoPro Laminates are ideal for multilayer boards in telecommunications, aerospace, and defense industries. Their unique properties enable improved signal integrity and reduced insertion loss in high-speed digital and RF/microwave circuits.

Download RO4000 LoPro Laminates Datasheet :

The RO4000 LoPro series of laminates, developed by Rogers Corporation, represents a significant advancement in high-frequency circuit materials. This summary provides an overview of the key information typically found in the RO4000 LoPro laminates datasheet, offering insights into the material’s properties, applications, and performance characteristics.

1. Introduction to RO4000 LoPro Laminates

RO4000 LoPro laminates are designed to meet the demanding requirements of high-frequency and high-speed digital applications. These materials offer a unique combination of electrical and mechanical properties, making them suitable for a wide range of advanced PCB designs.

1.1 Key Features

• Low dielectric constant for improved electrical performance
• Low dissipation factor for reduced signal loss
• Excellent thermal stability for consistent performance
• Compatible with standard FR4 processing techniques
• Low profile copper foil for enhanced signal integrity

1.2 Target Applications

• High-frequency RF and microwave circuits
• Antenna arrays and beam-forming networks
• Power amplifiers and low noise amplifiers
• Satellite communications systems
• High-speed digital boards

Read more about：

• Rogers 4350B
• Rogers 4003C
• Rogers 3003
• Rogers 5880
• Quick turn PCB Fabrication

2. Material Properties

2.1 Dielectric Properties

The datasheet typically provides detailed information on the material’s dielectric properties, which are crucial for high-frequency applications:

• Dielectric Constant (Dk): 3.36 to 3.66 (depending on specific grade)
• Dissipation Factor (Df): 0.0021 to 0.0037 (frequency-dependent)
• Dielectric Strength: > 31 kV/mm

These properties are usually specified across a range of frequencies, often from 1 GHz to 10 GHz or higher.

2.2 Thermal Properties

Thermal characteristics are essential for understanding the material’s behavior under various operating conditions:

• Coefficient of Thermal Expansion (CTE):
  • X-axis: 14 ppm/°C
  • Y-axis: 16 ppm/°C
  • Z-axis: 32 ppm/°C
• Thermal Conductivity: 0.64 W/m/K
• Glass Transition Temperature (Tg): > 280°C

2.3 Mechanical Properties

Mechanical properties are important for assessing the material’s durability and processing characteristics:

• Tensile Strength: 141 MPa
• Flexural Strength: 276 MPa
• Young’s Modulus: 26.5 GPa
• Poisson’s Ratio: 0.15

2.4 Electrical Properties

In addition to dielectric properties, the datasheet may include:

• Volume Resistivity: > 1.7 x 10^10 MΩ•cm
• Surface Resistivity: > 4.2 x 10^9 MΩ
• Electrical Strength: > 31 kV/mm

3. Available Grades and Thicknesses

The RO4000 LoPro series typically includes multiple grades optimized for different applications:

3.1 RO4003C LoPro

• Dk: 3.38 ± 0.05 (10 GHz)
• Available thicknesses: 0.203 mm (8 mils) to 1.524 mm (60 mils)

3.2 RO4350B LoPro

• Dk: 3.48 ± 0.05 (10 GHz)
• Available thicknesses: 0.254 mm (10 mils) to 1.524 mm (60 mils)

3.3 Copper Foil Options

• Low-profile reverse-treated electrodeposited copper
• Available weights: 1/2 oz (17 μm), 1 oz (35 μm), 2 oz (70 μm)

4. Laminate Construction

The datasheet provides information on the laminate construction, which is crucial for understanding its behavior and processing requirements:

• Glass fabric reinforcement type
• Resin system composition
• Copper foil type and treatment

This section may also include details on the material’s uniformity and consistency across the panel.

5. Processing Information

While detailed processing guidelines are usually provided in a separate document, the datasheet may include key processing parameters:

5.1 Lamination

• Recommended lamination temperature: 182°C to 199°C
• Recommended lamination pressure: 200-350 PSI

5.2 Drilling

• Recommended drill speeds and feeds
• Special considerations for high aspect ratio holes

5.3 Plating and Etching

• Compatibility with standard plating processes
• Recommended etchants and process parameters

6. Electrical Performance Data

The datasheet typically includes graphs and charts illustrating the material’s electrical performance:

6.1 Dielectric Constant vs. Frequency

A graph showing how the dielectric constant varies across a wide frequency range, typically from 1 GHz to 50 GHz or higher.

6.2 Dissipation Factor vs. Frequency

A chart illustrating the change in dissipation factor over the same frequency range.

6.3 Insertion Loss Performance

Comparative data showing the insertion loss performance of RO4000 LoPro laminates against other common PCB materials.

7. Environmental and Reliability Data

Information on the material’s performance under various environmental conditions:

7.1 Moisture Absorption

• Typical value: < 0.1%
• Test method: IPC-TM-650 2.6.2.1

7.2 Flammability Rating

• UL 94 V-0

7.3 Lead-Free Process Compatibility

• Suitable for lead-free soldering processes
• Maximum temperature resistance

7.4 Chemical Resistance

Data on the material’s resistance to various chemicals commonly used in PCB processing.

8. Regulatory Compliance

The datasheet includes information on the material’s compliance with various industry standards and regulations:

• RoHS compliance
• REACH compliance
• UL certification details

9. Comparison with Other Materials

A section comparing RO4000 LoPro laminates with other Rogers materials and competing products, highlighting its unique advantages.

10. Storage and Handling Recommendations

Brief guidelines on proper storage and handling of the material to maintain its properties and ensure optimal processing:

• Recommended storage conditions
• Shelf life information
• Handling precautions

11. Ordering Information

Details on how to order RO4000 LoPro laminates:

• Product codes for different grades and thicknesses
• Standard panel sizes
• Minimum order quantities

12. Technical Support and Additional Resources

Information on how to obtain technical support and access to additional resources:

• Contact information for Rogers Corporation’s technical support team
• Links to processing guides, design tools, and application notes
• Information on sample availability for testing and evaluation

Conclusion

The RO4000 LoPro laminates datasheet provides comprehensive information on the material’s properties, performance characteristics, and processing requirements. This data is essential for engineers and PCB designers working on high-frequency and high-speed digital applications. By understanding and utilizing the information provided in the datasheet, designers can optimize their circuit designs and ensure optimal performance in demanding RF and microwave applications.

It’s important to note that datasheet information may be updated periodically, and users should always refer to the latest version provided by Rogers Corporation for the most accurate and up-to-date information. Additionally, for specific design requirements or advanced applications, it’s recommended to consult directly with Rogers Corporation’s technical support team.