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Taconic EZ-IO-F: The Next Generation Spread Weave Laminate

As a printed circuit board designer, you must think ahead to stay ahead of the competition. You do not want to develop a PCB that becomes obsolete shortly after production, considering the heavy investment involved. An excellent way of ensuring this not only entails producing an excellent design or contracting a top-tier manufacturer but using quality materials.

So, have you heard of Taconic EZ-IO-F? This excellent printed circuit board laminate represents the next frontier for PCB materials. It fuses top-level technology with advanced materials to ensure an unprecedented quality of PCBs for diverse applications. Want to know more? Continue reading as we delve deeper to help you understand.

What is Taconic EZ-IO-F PCB?

In most cases, the technology and materials involved in fabricating printed circuit boards inform their names. The situation is no different with Taconic EZ-IO-F PCB. It is a type of printed circuit board that uses the thermally stable (EZ-IO-F) composite that derives its existence from nanotechnology, PTFE, and spread weave.

So what makes EZ-IO-F unique? It has nanoparticle silica, ensuring an incredible drill quality that matches the FR4 material. The laminate has a low fiberglass content with a consistent impedance and dielectric constant – all suggested through skew testing.

EZ-IO-F primarily arose for next-gen digital circuitry. However, it also got developed for microwave applications that operate at an ever-increasing frequency (high). Such higher frequencies need a combination of microwave and digital circuitry onto a single printed wiring board (PWB). By design, the EZ-IO-F challenges the finest FR4 material or laminate during fabrication    

EZ-IO-F primarily arose for next-gen digital circuitry. However, it also got developed for microwave applications that operate at an ever-increasing frequency (high). Such higher frequencies need a combination of microwave and digital circuitry onto a single printed wiring board (PWB). By design, the EZ-IO-F challenges the finest FR4 material or laminate during fabrication, especially for the more complex 30 plus layer for digital applications.

Benefits of Taconic-IO-F Laminates

You can always benefit from the numerous advantages of Taconic-IO-F material. It not only confines you to enjoying very low skew and nanotech-based PTFE laminate but others as well. It encompasses an incredible drill quality akin to FR4 (a thousand hits/bits). Fr4 registration, low fiberglass content of less than 10%, and a less than 0.18% dielectric constant variation also come as benefits.

Others include:

  • A stable dielectric constant regarding temperature
  • Ability to make forty plus layers, primarily on large format printed wiring boards
  • It is also resistant to CAF

Application

  • Testing of semiconductors at or above 25 Gbps
  • Measurement and tests
  • Backplane routers and optical data transport
  • Hybrid FR4-based printed wiring boards – combining digital and microwave signals.
  • Defense and space

What about the Skew Testing?

You mostly find skew testing proposing an utmost skew of 0.3 picoseconds per inch besides a skew average of less than 0.1ps/inch devoid of artwork rotation. A 15-degree artwork rotation demonstrates a maximum skew of 0.05 ps/inch plus a skew average of almost zero. However, the skew proves flat over a 1-20 GHz frequency.

Taconic EZ-IO-F Manufacture

EZ-IO-F mostly gets manufactured on top of no-profile copper. However, please note that the most recent ULP copper performs better than rolled copper and consequently acts as the new standard when it comes to high-performance laminates. You can achieve a lot more with rolled copper or ULP copper vs. HVLP.

If you want to achieve a strip-line channel possessing a 5 wt% fiberglass, you must combine EZ-IO-F with AGC FR-28-0040-50S with a DF of 0.0018 at 10 GHz. The AGC contains a non-reinforced prepreg that makes the strip-line properties possible. AGC prepregs (fastRise) come as the lowest commercially available prepregs, which you can then laminate at a 420-degree Fahrenheit, like FR-4.

The EZ-IO-F’s low insertion loss only compares to the PTFE laminate’s fusion bonding – a costly process that results in excessive movement. An excellent example includes operating it at 77 GHz, which compares and competes with every fusion bonding laminate favorably. What’s more, it lacks the challenges and costs common with fusion bonding.

You can obtain EZ-IO-F with a remarkably low-profile resistor foil. Further, the design of the nanoparticle, besides the absence of surface porosity, allows the etching of fine lines (a range of 2-4 mils and spaces)

A Case in Point – EZ-IO-F 0050

Do you want to know about the EZ-IO-F specifications? Let us use this excellent model – EZ-IO-F 0050 as our model.

Typical values of EZ-IO-F 0050

PropertyTest MethodUnitValueUnitUnit
Dielectric Thickness Mil5, 3.5mm0.09, 0.13
Df @ 10 GHzModified IPC-650 2.5.5.5.1 0.0014, 0.0015 0.0014, 0.0015
DK @ 10 GHzModified IPC-650 2.5.5.5.1 2.8, 2.85 2.8, 2.85
Dielectric BreakdownIPC-650 2.5.6.2/ASTM 299-13kV39.8kV39.8
Dielectric Breakdown IPC-650 2.5.6.2/ASTM D149-09kV23.8kV23.8
Dielectric Potency/StrengthIPC-650 2.5.6.2/ASTM D149-09V/Mil628V/mm24724
Compressive ModulusASTM D695-15psi507,000N/mm23496  
Peel Strength (0.5 oz. ULP)IPC-650 2.4.8 sec. 5.2.2 lbs/in6N/mm1.05
Peel Strength (1 oz. ULP- MD)IPC-650 2.4.8 sec. 5.2.2 lbs/in 6N/mm 1.05 
Peel Strength (1 oz. ULP- CD) IPC-650 2.4.8 sec. 5.2.2  lbs/in 6N/mm 1.05 
Peel Strength (1 oz. ULP- MD) IPC-650 2.4.8 sec. 5.2.2 (Thermal Stress) lbs/in 6N/mm 1.05 
Peel Strength (1 oz. ULP- CD) IPC-650 2.4.8 sec. 5.2.2 (Thermal Stress.) lbs/in 6N/mm 1.05 
Peel Strength (1 oz. ULP- MD) IPC-650 2.4.8 sec. 5.2.2 (Chemical Exp.) lbs/in 6N/mm 1.05 
Peel Strength (1 oz. ULP- CD) IPC-650 2.4.8 sec. 5.2.2 (Chemical Exp.)lbs/in 6N/mm 1.05 
Arc Resistance ASTM D495-14Seconds248Seconds 2.48
Dimensional Stability (MD)IPC-650 2.4.39A (Thermal etch) mils/in0.45mm/M 0.45
Dimensional Stability (CD)IPC-650 2.4.39A (Thermal etch) mils/in0.44mm/M0.44
Dimensional Stability (MDIPC-650 2.4.39A (Thermal stress) mils/in0.42mm/M0.42
Dimensional Stability (CD)IPC-650 2.4.39A (Thermal stress)mils/in0.33mm/M0.33
Surface ResistivityIPC-650 2.5.17.1A (Elevated temperature) Mohms/cm1.67 x 106 Mohms1.67 x 106 
Surface ResistivityIPC-650 2.5.17.1A (HumidityMohms/cm2.29 x 104 Mohms2.29 x 104 
Volume ResistivityIPC-650 2.5.17.1A (Elevated temperature) Mohms/cm3.58 x 107 Mohms/cm3.58 x 107 
Volume ResistivityIPC-650 2.5.17.1A (Humidity)Mohms/cm3.94 x 1010Mohms/cm3.94 x10 1010 
CAFIPC-650 2.6.25 Pass Pass
IST, HATSCustomer-specific Pass Pass
CTE (X) 45 – 125°CIPC-650 2.4.42/ASTM D3386 ppm/°C19ppm/°C19
CTE (Y) 45 – 125°C IPC-650 2.4.42/ASTM D3386 ppm/°C25ppm/°C25
CTE (Z) 45 – 125°C IPC-650 2.4.42/ASTM D3386ppm/°C49ppm/°C49
Thermal ConductivityASTM E1461 W/M*K0.49W/M*K0.49
Thermal ConductivityASTM E1461 W/M*K0.53W/M*K0.53
Specific HeatASTM E1461 J/gK1.18J/gK1.18
DiffusivityASTM E1461mm2 /s0.214mm2 /s0.214
DensityASTM D792-13 )Method A)g/cm32.12g/cm32.12
HardnessASTM D2240-15 77.3 77.3

You need to note that all the values illustrated are typical and not specific for distinctive purposes. Additionally, the values need to get used for single-ply construction. 

Where can You Get Taconic EZ-IO-F PCB Laminates?

If you want to design or make a Taconic EZ-IO-F printed circuit board, picking a manufacturer that can source for the specific Taconic EZ-IO-F laminate becomes important. What better place to turn to than RayMing PCB for your Taconic EZ-IO-F laminate or materials? The company will take care of your material sourcing needs and your fabrication and assembly needs. But any other top PCB manufacturer with a demonstrated PCB fabrication history can also source for Taconic EZ-IO-F laminates.

Benefits of Picking the Right PCB Material – EZ-IO-F Laminate

PCB substrates, of which Taconic EZ-IO-F laminates belong, need a careful selection to ensure the PCB designs come off. Because of this, you must consider performance during your PCB design phase for your specific application. Key performance aspects include mechanical and electrical attributes, mainly when your application areas include complicated microwave areas. Therefore, it becomes crucial to ensure mechanical and electrical reliability.    

A low thermal coefficient of Dk offers electrical stability, which most engineers or designers who deal with oscillators, delay lines, and filters desire. However, the good news encompasses the fact that Taconic, Rogers, and ISOLA materials prove reliable for high-speed and high-performance applications.   

Crucial Aspects to Consider in Picking a Taconic EZ-IO-F Laminate

  • A very low Z-axis CTE (coefficient of thermal expansion) becomes necessary if you want to get superior reliability, especially for the plated through-hole.
  •  It is also imperative to realize a narrow positional tolerance range to match the Y and X CTE (coefficient of expansion) of the Taconic EZ-IO-F material.
  • Enhancing the reliability of the surface mount can be realized by limiting the solder joint stress and allowing the PCB laminate to expand. As a result, it will expand to a minimum CTE, which proves beneficial due to the low tensile modulus.  
  • The stable dissipation factor makes it possible for you to understand how and why losses occur. It also helps in understanding their distribution across the operating frequency bandwidth.
  • Low (Df) dissipation factor
  • Thermal performance
  • Skew mitigation attributes
  • Jitter reduction
  • Attributes to enhance rise times
  • Low Z-axis CTE
  • Conductor loss cutback

How Taconic EZ-IO-F Compares to RF-30A and TSM-DS3M

Taconic has plenty of parts and products valuable in designing and manufacturing printed circuit boards. The EZ-IO-F, therefore, comes as one of the products. But how can it compare to other trademark products or laminates from Taconic?

Part NameEZ-IO-FRF-30ATSM-DS3M
Loss factor0.0015, 0.00140.00200.0011
Dk + Tolerance2.80, 2.77 ± 0.052.97 ± 0.052.94 ± 0.05

Final Thoughts

If you want excellent PCB material for your printed circuit board design, you need to get a Taconic EZ-IO-F laminate. While picking a Taconic EZ-IO-F material can prove difficult, the insights provided will go a long way in picking your EZ-IO-F material.