In PCB manufacturing and electronic device manufacturing, a lot of abbreviations and acronyms are being used. Each of these abbreviations and acronyms has its meaning and what they stand for. In most cases it is important to know what these abbreviations and acronyms mean. Abbreviations related to a particular industry could have different meanings.ย Letโs explore some EMS acronym manufacturing list in this article.
EMS Abbreviation Manufacturing
Abbreviations used in electronic manufacturing services (EMS) are usually engineering and manufacturing related terms. These manufacturing abbreviations list can make it easy to express yourself when writing or compiling a list. Here are some EMS abbreviation manufacturing lists.
AOI
This means automated optical inspection. AOI is a type of inspection method that uses cam data to check the size, feature, positioning, and shape of copper. Also, this inspection can be used in discovering โopenโ traces or โshorts.โ
ATE
Automatic Test Equipment, popularly called ATE is a piece of equipment that always checks for functional parameters in order to determine if there is any low performance. It does this automatically. Furthermore, this equipment can carry out fault isolation.
ATG
ATG is also called Automatic test generation, which is a test program. This program functions according to the principle of circuit technology. There is no need for any manual programming effort when making use of this program.
ACF
The anisotropic conductive film, which is also known as ACF is simply an adhesive interconnect system. It is commonly used in LCD manufacturing.
BOM
The Bill of Material (BOM) is a comprehensive list that offers complete details of the materials used in the production of circuit boards and electronic devices. These materials include components, parts, and subassemblies. In addition, this document reveals the quantity of every material that is required for the assembly process.
BGA
There are different packaging methods for ICs. The Ball Grid Array (BGA) is one of those. This IC packaging method helps to attach ICs on an electronic board.
CAM
CAM also means Computer Aided Manufacturing. It refers to the use of computer programs and systems in different stages of a manufacturing process in which a human operator makes decision and a computer system offers the data manipulation functions.
CAD
Computer Aided Design (CAD) helps engineers and developers to make a design and view it on a graphics screen. It could also be viewed in a computer pinout. In electronics manufacturing, you can view the result in a printed circuit layout.
CBGA
This refers to ceramic ball grid array. It comprises ceramics as its substrate. CBGA can have solder columns or solder balls to enable connections.
CEM
Contract Electronic Manufacturing, popularly referred to as CEM entails the manufacturing of electronic equipment or device on behalf of the OEM (original equipment manufacturing). The OEM owns the brand name. It usually based on the industry that supplies manufacturing and contact design for electronics OEMs.
CSP
One of the most common packaging systems in electronics production is the Chip Scale Package (CSP). This package has numerous benefits. Some of which include saving of space for circuit board routing and reduced package size. CSP enhances PCBA yields and also reduce the cost of manufacturing circuit boards.
CCD
The Charge Coupled Device (CCD) is a popular abbreviation in EMS manufacturing. It enables the flow of electric charge to occur from a capacitor to another. CCD is a semiconductor device that electronic manufacturers use in digital image capture.
DUT
Electrical testing is crucial in PCB production. The Device Under Test (DUT) is an electronic board that is currently going through electrical testing.
DRC
This means Design Rule Check. In PCB manufacturing, there is a need to verify some processes to ensure there are no errors. With DRC, a manufacturer can check if there is any defect or error with the PCB layout. Before a manufacturer commences with the final production, he needs to check the PCB designs. The design rule check will help you verify if a PCB design meets the required standards.
ENIG
There are several surface finish options for coating PCB surface. The Electroless Nickel Immersion Gold (ENIG) uses electroless nickel plating and then immersion gold for coating a circuit board surface. The immersion gold protects the surface from oxidation and corrosion. Since ENIG contains no lead, it is environmentally ideal.
EMI
Electromagnetic Interference EMI is a common terminology in electronics production. It occurs when electromagnetic fields experience interference. This usually causes distortion. EMI can make electronics devices to function poorly. It is possible to reduce EMI levels by understanding the cause.
EMC
Electromagnetic Compatibility (EMC) is when electronic devices operate without interfering with one another. It defines the capability of electronic devices to interact within their environment without experiencing any problem.
Field programmable array is a semiconductor device you can program after manufacture. It works around a set of configurable logic blocks (CLBs) which are always connected through programmable interconnects. The FPGA comprises many programmable interconnect wiring, flip-flops, and logic elements.
IPC
There are many organizations that cater to the PCB manufacturing process. The Institute of Printed Circuits (IPC) is an example of such organization. It was established to ensure PCB manufacturers strictly adhere tostrict manufacturing standards. This organizations established standards which help manufacturers meet their goals of producing high quality PCBs.
ESD
Electrostatic discharge (ESD) occurs when two objects comes in contact and discharge static electricity.ย This occurrence occurs in electronic devices and could be caused by an electrostatic field or direct contact. ESD as it is popularly called can cause severe damage electrical equipment. There are ways to prevent ESD from occurring.
MES
MES is a Manufacturing Execution System which keeps track of the PCB production process. In addition, this system makes sure all of the steps in the process are carried out as expected. MES achieves this by gathering accurate data from each production line.
ICT
ICT stands for In Circuit Test. This test uses an electrical probe to test a populated PCB. It checks for defaults such as opens, shorts, capacitance, missing components, and resistance. ICT is generally performed to check the manufacturing of printed circuit boards. Also, in-circuit test detect any manufacturing faults in PCBAs by using the bed-of-nails fixture.
IPD
The Integrated Passive Devices (IPD) are manufactured with wafer fab technologies like photolithography and thin film processing. IPDs can be in form of wire bondable components or flip chip mountable.
JEDEC
The Joint Electronic Device Engineering Council, popularly known as JEDEC is a communication network and regulatory organization that represents the microelectronics industry. This organization comprises leaders from popular computer manufacturing companies across the world.
LDI
Laser Direct Imaging uses a computerized laser beam to project circuit path on the circuit board. This imaging technology is capable of writing patterns on resists that are highly sensitive. It supports digital PCB production process and offers high resolution.
LPI
Liquid Photo Imageable is a type of ink which is manufactured by using photographic imaging methods. This ink is a combination of two different components which provides a coating for PCB surfaces. LPI is primarily made for curtain coat and spray applications. It is an accurate way of applying mask.
MOSFET
The full meaning of MOSFET is Metal Oxide Semiconductor Field Transistor. This is a field-effect transistor that varies the width of a channel where charge carriers flow. Charge carriers leaves through the drain when they enter the channel at the source.
OEM
OEM is a commonly used EMS abbreviation. It stands for Original Equipment Manufacturer. OEMs produce and supply components or products needed by other companies. They own the brand name of a particular product.
SPC
SPC deals with the use of statistical methods for analyzing the result of a specific process. This checks the variation and then takes action to ensure statistical control.
RoHS
This means Restriction of Hazardous Substances. This abbreviation is used during EMS manufacturing. This standard is set up for regulating the utilization of hazardous substances in manufacturing electronic equipment. The electronic manufacturers must make use of substances like cadmium, PBB, PDBE, lead, etc.
SiP
This also means Systems in a Package. SiP is a package that is composed of integrated circuits which are in one module. The SiP performs most of the functions of the electrical system. SiP can be found in phones and music players.
PCB Manufacturing Abbreviation List
HASL
This is also called Hot Air Solder Leveling. This refers to a surface finish whereby a solder layer covers the copper parts left exposed. This option of surface finish is very cheap and usually utilized in the manufacturing of PCB. HASL deposit a fair and even coating and always makes the PCB surface rough.
SMT
SMT can be described as an assembly method which deals with the direct placement of electronic components on the surface of the circuit boards. This assembly method is very popular, and it deals with the utilization of automated machines and equipment such as the reflow soldering machines.
FR4
FR4 also means flame retardant 4. This is a material used for the manufacturing of circuit boards. The material is made up of both epoxy and woven fiberglass.
FPC
FPC or flexible printed circuits are made up of a layer containing different traces, which are attached to the dielectric layer of a circuit board. The flexible printed circuits could have just one side, two sides, or many sides.
COB
COB also means chip on board. This is a technology that deals with the placement of interconnects as well as unpackaged semiconductor die making use of some techniques such as wire bonding. For such a process, the manufacturer will mount the bare chips on the printed circuit board. After this, he or she will attach the wires and then use epoxy or plastic in covering the chip.
DIMM
This refers to the Dual Inline Memory Module. Also, this is a printed circuit board having at least one RAM chips having pins. The pins help in linking the DIMM onto a computerโs motherboard. In addition, the DIMM includes a 168-pin connector and can enable 64-bit transfer of data.
This also means dual in-line package. This is a through hole package, which has leads attached on the packageโs opposite sides.
HDI
HDI also means high density interconnect. This is a PCB which possesses a high density for each of the units. This HDI boardโs wiring density is greater compared to the conventional printed circuit boards. This is why the HDI boards are usually lighter and smaller and have better electrical performance.
PCBA
PCBA means Printed Circuit Board Assembly. This is a board having all the important electronic components attached on it. It is useful for manufacturing different electrical and electronic equipment.
PTH
This refers to plated through hole. This is a technology for PCB mounting, which utilizes leads. Here, these leads are placed inside the PCB holes. These leaded components help in soldering the pads on the circuit board
PCB
PCB or printed circuit board is the basis whereby different electronic devices are created. It offers electrical connection between the electronic components.
OSP
This also means Organic Solderability Protective. This is a coating utilized for PCBs. This is a water-based PCB coating that helps with bonding to copper.ย The OSP coating provides some protection for the copper till soldering is done. Benzimidazoles are the most common compounds used in this coating.
SMD
SMD, also called surface mount device is a well-known abbreviation utilized in both PCB and EMS manufacturing. Furthermore, SMDs are usually mounted on the surface of the printed circuit board and achieved through automated processes.
PLCC
PLCC is a Plastic Leaded Chip Carrier. It is an integrated circuit package with J leads on all its four sides. The lead counts of this chip carrier is always within the range of 20 and 84.
DFM
Design for Manufacturing (DFM) involves assessing the design of a PCB assembly to reduce manufacturing defects. DFM helps to minimize the cost of manufacturing a printed circuit board. A PCBA can have a poor design as regards manufacturing. Therefore, DFM is a crucial process in PCBA manufacturing.
Conclusion
We explained the meaning of some acronyms and abbreviations in EMS and PCB production. The information provided above can help you communicate effectively with your OEM.
