8 Steps to Manufacture a Perfect Aluminum PCB

I) Cut Lamination

 

1. The process of Cut Lamination

 

Picking - Sheets Cutting

 

2. The purpose of Cut Lamination

 

Cut large sizes of incoming material into the required size for production

 

3. Precautions for Cut Lamination

 

A. Checked for the first piece size

 

B. Pay attention to aluminum scraping and copper scraping

 

C. Pay attention to blister

 

II) Drilling

 

Drilling Process of Aluminum PCB Manufactturing

 

 

1. The process of drilling

 

Eyelet - Drilling - Inspection board

 

2. The purpose of drilling

 

Positioning the plate for drilling provides assistance for subsequent production processes and customer assembly

 

3. Precautions for drilling

 

A. Check the number of holes and the size of the holes

 

B.avoid the scratching of the sheet

 

C. Check the burr of the aluminum surface, the hole deviation

 

D. Timely inspection and replacement of the drill tool

 

E. Drilling is divided into two stages, first drill: Drill the tooling hole after Cutting Lamination. Second drills: drill the tool hole in the unit after solder mask

 

III) Dry/wet film imaging

 

 

Dry File Imaging Process of Aluminum PCB Manufactturing

 

 

1, Dry / wet film imaging process

 

Grinding plate - film - exposure - developing

 

2. Dry / wet film imaging purposes

 

Presenting the parts needed to make the circuit on the sheet

 

3. Dry / wet film imaging considerations

 

A. Check if there is an open circuit after development

 

B. Whether there is deviation in the development alignment to prevent the generation of dry film

 

C. Pay attention to the bad circuit caused by the surface Scratch

 

D. There should be no air residue during exposure to prevent poor exposure

 

C. After the exposure, it should be still for more than 15 minutes before developing.

 

IV) Acidic/alkaline etching

 

1. Acid/alkaline etching process

 

Etching - Stripping - drying - inspection board

 

2. Acid/alkaline etching purpose

 

After the dry/wet film is imaged, the required circuit portion is retained, and the excess portion circuit is removed.

 

3. Acidic / alkaline etching considerations

 

A. Note that the etching is not clean, excessive etching

 

B. Pay attention to circuit width and space

 

C. Copper surface is not allowed to have oxidation, scratching phenomenon

 

D. Stripping to be cleaned

 

V) Solder mask and silkscreen process

 

 

Soldermask and Silkscreen Process of Aluminum PCB Manufactturing

 

 

1. Solder mask, silkscreen process

 

Silkscreen - Precure - exposure - development - Legend

 

2. The purpose of solder mask and silkscreen the purpose

 

A. Solder mask: protect the circuit that does not need to solder, prevent tin from entering the short circuit

 

B.Silkscreen: play a show role

 

3. Solder mask, silkscreen notes

 

A. Check the board for any rubbish or foreign objects

 

B. Check the cleanliness of the stencil

 

C. After silk screen printing, Precurefor more than 30 minutes to avoid bubbles on the circuit.

 

D. Pay attention to the thickness and uniformity of silkscreen

 

E. Precure plate should be completely cooled to avoid sticking to the film or destroying the gloss of the ink

 

F. The ink is placed face down when developing

 

VI) V-CUT, Rout out

 

 

Rout out Process of Aluminum PCB Manufactturing

 

 

1. V-CUT, the process of the rout out

 

V-CUT - rout out - remove protective film - rout burr out

 

2. V-CUT, the purpose of the rout out

 

A. V-CUT: The single PCS and panel connect a little, it is easy packaging and separate.

 

B. Rout outboard: remove the excess part of the board

 

3. V-CUT, the considerations for the rout out

 

A. Pay attention to the deep of V during the V-CUT process, the defects of the edges, burrs

 

B. Please pay attention the burr, rout Deviate, checking and replace the tool in time

 

C. Finally, avoid scratching the board when removing the burr.

 

 VIIElectronic test, OSP

 

 

Electronic Test and OSP Process of Aluminum PCB Manufactturing

 

 

1. Test, OSP process

 

Circuit test - withstand voltage test - OSP

 

2. The purpose of OSP and E-test

 

A. Circuit test: check if the completed circuit is working properly

 

B. Withstand voltage test: test whether the completed circuit can withstand the specified voltage environment

 

C. OSP: Make the circuit be better soldered

 

3. Testing, OSP considerations

 

A. How to store qualified and defect products after how to distinguish after testing

 

B. After the OSP is placed

 

C. To avoid damage to the circuit

 

 

Aluminum PCB Manufactturing

 

 

 VIII) FQC, FQA, packaging, shipping

 

1. The process

 

FQC - FQA - Packaging - Shipping

 

2. Purpose

 

A. FQC checking overall board and confirms the product

 

B. FQA sampling verification

 

C. Package and ship to customers according to requirements

 

3. Pay attention

 

A. FQC pays attention to the confirmation of the appearance during the visual inspection, making a reasonable distinction

 

B. FQA really checks and verifies the inspection standard of FQC

 

C.to confirm the number of packaging, to avoid mixing, wrong board and packaging damage

 

Aluminum substrate storage conditions

 

Aluminum substrates are generally stored in a dark, dry environment. Most aluminum substrates are prone to moisture, yellowing and blackening. Generally, they should be used within 48 hours after opening vacuum packaging.