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Benefits and Applications of Rogers DiClad 870/880 Series Laminates

The benefits of the Rogers DiClad 870 and 880 series laminates include low dielectric constant values, low moisture absorption, and a unique routing design. The two-layer, woven PTFE laminates are also available in 48″ x 54″ sizes. They are ideal for PCB applications that require high frequency and registration stability. Read on to learn more.

Unique routing design

A unique routing design is necessary for specific PCB circuitry applications, including those requiring high-speed RF performance. For example, encapsulation and edge plating of PCB circuitry need a particular pattern of routing, and this unique design is equally essential for non-standard Rogers laminates without glass reinforcement. The routing design also must be compatible with the fabrication process of the panel, as part processing may be done during fabrication while the panels are in a carrier panel.

Both the DiClad 870 and 880 laminates use low-density, woven-fiberglass composites reinforced with woven fiberglass. These materials are ideal for high-frequency PCB applications requiring low dielectric constants and improved registration and dimensional stability. In addition, for a more reliable and complex routing process, Rogers offers TMM and IsoClad laminates.

In addition to their unique routing design, Rogers PCB materials are essential in various technologies. The latest advancements in semiconductor technology have made signal processing possible at higher frequencies. The high-frequency Rogers laminate is ideal for digital PCB applications requiring high-speed performance at 10 GHz. High-frequency PCB applications may also require FR-4 materials. If your design calls for a high-frequency PCB, Rogers DiClad laminates are the best choice.

When determining the right thickness for your PCB, you should also consider how many circuits your design needs. Naturally, the higher the number of layers, the higher the overall price. However, you should never forget that custom designs may require specialized skills. In addition, these custom designs may require special equipment or tools. Once you have determined what thickness you need, you can select the suitable substrate for your needs.

Low dissipation factor

The low dissipation factor of Rogers DUREL(r) drivers enables these high-performance laminates in automotive and aerospace applications. DiClad 870 and 880 laminates feature a controlled PTFE/glass ratio for superior low-loss properties and a lower dissipation factor. These materials are also flame retardant and are lead-free solder compatible.

Rogers DiClad 870/881 laminates feature a low dissipation factor, or Dk, than other materials available on the market. Compared to conventional PTFE laminates, these materials feature greater thermal conductivity and are suitable for multilayer PCBs. They also have the highest embedded resistor constancy in the PCB semiconductor industry.

The low dissipation factor of Rogers laminates is an advantage when processing high-frequency applications. High-frequency laminates are best for PCBs exhibiting broad electrical or mechanical variations. Compared to FR-4 substrates, Rogers laminates have a constant Df value of 0.004 or 0.020. In addition, unlike FR4 substrates, Rogers laminates exhibit a low Df.

The low dissipation factor of Roger’s dielectric materials is an advantage for microwave and radio frequency circuits. In addition, the dielectric constant of Rogers DiClad 870/880 allows for a smaller physical size. This factor is a key benefit of Rogers dielectric laminates, as they can reduce the size of the circuit board. If this factor is crucial to a particular application, the Rogers DiClad laminate is the ideal choice.

The high-frequency Rogers PCB material features excellent temperature stability, low moisture absorption, and a uniform coefficient of thermal expansion. These properties make Rogers DiClad 870/880 an ideal choice for RF/microwave applications. In addition, when it comes to reliability, Rogers DiClad 870/880 offers unrivaled performance and reliability.

Low dielectric constant

DiClad laminates are PTFE with woven fiberglass composite materials used for PCB substrates. The unique blend of fibers and composite materials provides dissipation factor flexibility and low dielectric constant. These properties make Rogers DiClad materials the ideal choice for various applications, including aerospace, automotive radar sensors, and 5G wireless communication.

While FR-4 laminates are cheap and easy to work with, their dielectric constants vary when exposed to high temperatures. While Rogers materials are relatively expensive, they can produce high-quality circuit boards. High-frequency PCB applications require a material with a higher dielectric constant, making Rogers materials ideal for this use. Rogers DiClad 870/880 laminates are available in various dielectric constants.

The Rogers DiClad 870/870/80 laminates are ideal for high-reliability plated through-hole applications. The combination of glass-reinforced and PTFE laminates offers the benefits of both high-frequency materials while minimizing the risks of outgassing in extreme conditions. High-frequency PCBs are also more sensitive to heat than other materials, and Rogers DiClad 870/880 laminates are highly flexible and easy to fabricate.

Because of the high dielectric constant, Rogers diClad, 870/880 laminates are essential in high-frequency PCB applications. These PCB substrates are typically 24″ x 18″ in size. Therefore, the size of the panels depends on the Rogers laminates used and their dielectric constants. If they do not match, the filter’s operation will be a problem.

The dielectric constant of Rogers DiClaD 870/880 laminates is 2.60 nm. These materials are suitable for microwave and millimeter-wave applications. The thin metal cladding used in these laminates helps improve thermal stability. In addition, the materials are compatible with standard PTFE-based printed circuit board substrates. These materials are ideal for use on high-reliability PCBs.

Thermal conductivity

The composite material that is PTFE-based and woven with reinforcement of fiberglass used to manufacture Rogers DiClad laminates provides low dielectric constants. In addition, we control the fibers and PTFE content ratios, resulting in a high-performance material with low dissipation factors, improved reinforcement, and superior dimensional stability. These laminates are available in sizes up to 48″ x 54″.

In addition to the thermal conductivity, Rogers offers a broad range of bonding and adhesion materials that complement their high-frequency circuit materials. The range includes Prepregs and Bondply. These materials feature high-frequency compatibility, making them ideal for multilayer PCBs. They are also available in large-format-sized sheets. And they are extremely strong – the same properties as copper!

The Rogers Corporation is a global corporation with manufacturing facilities in the United States, China, Belgium, Hungary, and South Korea. In addition, it has sales offices and joint ventures in many countries. The company has two divisions, Advanced Connectivity Solution and Rogers Technologies (Suzhou) Co., Ltd., which process high-frequency copper-clad laminate materials in China. The company also has several high-frequency PCB manufacturing partners, including Rayming PCB & Assembly.

The electrical properties of Rogers DiClad 870/80 material play an essential role in high-frequency PCB design. The highest-frequency PCB applications require high-frequency laminates. The dielectric constant measures the material’s capacity to store electrical charge. The higher the dielectric constant, the better. The dielectric constant of Rogers DiClad 870/880 material means less signal loss in high-frequency PCB applications.

Thermal stability

The thermal stability of Rogers DiClad 880 and 870 laminates is comparable. The primary differences between the two materials are their compositions and dielectric constants. DiClad 880 uses fewer woven fiberglass layers and higher PTFE content. As a result, both materials offer lower dielectric constants and dissipation factors. In addition, they are available in both standard and large-size sheet sizes.

The thermal stability of Rogers DiClad 880 and 850 laminates is the key to its application. When used in electronics, it must be able to handle a wide temperature range. For example, FR-4 laminates exhibit substantial temperature variations (Td), while Rogers DiClad 870/880 laminates show no temperature variation. Therefore, high-frequency Rogers laminates are so popular.

A variety of materials are available for high-frequency PCB applications. The RO4000 and TMM laminates do not feature thick metal cladding. Thick metal cladding is available in several thicknesses. Some types are compatible with FR-4, which is a low-temperature material. Copper foil is also compatible with FR-4 and DiClad 870/880 laminates.

In high-frequency PCB applications, it is essential to match the dielectric constant of a Rogers material with that of the substrate. If the two materials are not compatible, it can result in a weakened solder joint or de-lamination of the PCB. Rogers DiClad 870/880 PCBs are compatible with other materials requiring different fabrication processes.