Development of Printed Circuit Board Substrate Materials
The development of printed circuit board substrate materials has gone through nearly 50 years. In addition, the industry has been in the industry for about 50 years before the determination of the basic raw materials used in it - resin and reinforcement materials scientific experiments and exploration, PCB substrate materials industry has accumulated nearly a hundred years of history. The development of each stage of the substrate materials industry is driven by innovations in electronics, semiconductor manufacturing technology, electronic mounting technology, and electronic circuit manufacturing technology. From the beginning of the 20th century to the end of the 1940s, it was the burgeoning stage of the development of the PCB substrate material industry. Its development characteristics are mainly manifested in: the resin, reinforcing materials and insulating substrates used for the substrate materials in this period have emerged in large quantities, and the technology has been initially explored. These have created the necessary conditions for the advent and development of the most typical substrate material for printed circuit boards, the copper clad laminate. On the other hand, the PCB manufacturing technology in which the circuit is the mainstream by the metal foil etching method (reduction method) has been initially established and developed. It plays a decisive role in determining the structural composition and characteristic conditions of the copper clad laminate.
CCL has been used on a large scale in PCB production, and it first appeared in the US PCB industry in 1947. The PCB substrate material industry has also entered its initial stage of development. At this stage, advances in the manufacturing technology of raw materials for the manufacture of substrate materials, such as organic resins, reinforcing materials, and copper foils, have given a strong impetus to the progress of the substrate materials industry. For this reason, the substrate material manufacturing technology has begun to mature step by step.
PCB substrate - copper clad laminate
The invention and application of integrated circuits, miniaturization and high performance of electronic products have pushed PCB substrate material technology onto the track of high-performance development. The rapid expansion of demand for PCB products in the world market has led to the rapid development of the yield, variety and technology of PCB substrate materials. At this stage of substrate material application, there has been a broad new field - multilayer printed circuit boards. At the same time, the substrate material at this stage has further developed its diversification in terms of structural composition. In the late 1980s, portable electronic products represented by small cameras such as notebook computers, mobile phones, and camcorders began to enter the market. These electronic products are rapidly moving toward miniaturization, light weight, and multi-functionality, which greatly promotes the progress of PCBs toward micropores and micro-wires. Under the above-mentioned changes in the market demand for PCBs, a new generation of multi-layer boards (BUM), which can realize high-density wiring, was introduced in the 1990s. This breakthrough in important technologies has also led the substrate materials industry to a new stage of development led by substrate materials for high-density interconnect (HDI) multilayer boards. In this new phase, traditional CCL technology is being challenged. PCB substrate materials have new changes and new creations in terms of manufacturing materials, production varieties, substrate structure, performance characteristics, and product functions.
According to relevant data, the annual output of rigid copper clad laminates in the world increased by about 8.0% during the 12 years from 1992 to 2003. In 2003, the total annual output of rigid CCL in China has reached 105.9 million square meters, accounting for 23.2% of the global total. The sales revenue reached 6.15 billion US dollars, the market capacity reached 141.7 million square meters, and the production capacity reached 155.8 million square meters. All these indicate that China has become the "superpower" in the manufacture and consumption of the world's copper clad laminates.