Manufacturing of printed circuit boards makes use of different materials. However, the PCB laminates are known as the main raw materials that are useful in the fabrication of printed circuit boards
Here’s another focus on the Arlon PCB Material. This time, we will be focusing on the Arlon 51N PCB Material. In this article, we will be discussing why this material has high reliability and why it is very useful in rigid-flex complex fabrication.
If you wish to gain much knowledge concerning the Arlon 51N PCB Material, please continue reading as we take you through different aspects of the topic.
What is the Arlon 51N PCB Material?
The Arlon 51N PCB Material is a multifunctional non-DICY epoxy prepreg system which came to be to offer high reliability via solder operations that are lead free.
The thermal stability and high decomposition of the Arlon 51N PCB Material is great for use in rigid-flex complex fabrication, as well as assembly operations whereby there is a need for minimum resin flow.
Furthermore, this material possesses great mechanical and electrical properties that meet the IPC-4101/126 prepreg requirements.
What are the Features of the Arlon 51N PCB Material?
The Arlon 51N PCB Material has a decomposition temperature that is higher than 350 degrees Celsius and it is great for solder processing that is lead free. It also provides great improvement over the traditional Epoxy FR-4 systems.
This resin system is multifunctional. Also, it has a temperature for glass transition of 170 degrees Celsius for optimal PTH reliability. Also, the bond adhesion is improved over many thermal excursions. This leads to better reliability via rework and reflow operations.
Furthermore, it is RoHS/WEEE compliant and it is compatible with any solder processing that is free of lead. In addition, the mechanical and electrical properties meets the IPC-4101/126 prepreg requirements, which is modified to become “low-flow”
In addition, for any epoxy system, this material has the best thermal performance. At T260, it os greater than 60 minutes, at T280, it is greater than 30 minutes, and at T300, it is 15 minutes.
Typical Applications of the Arlon 51N PCB Material
These are areas where you can apply the Arlon 51N PCB Material
The Arlon 51N PCB Material is useful in dielectric insulators, because they can serve as insulators. It makes it possible for these dielectric insulators to refuse the flow of electric current.
Completed PCB assemblies that requires great thermal stability
As mentioned earlier, the Arlon 51N PCB Material has great thermal stability. This is why it is very useful in PCB assembly because they offer excellent thermal stability to the finished PCB.
Applications requiring uniform or minimal resin flow
The Arlon 51N PCB Material is also very useful in any application that requires a uniform or minimal resin flow.
Bonding of rigid-flex multilayer boards
The Arlon 51N PCB Material is a multifunctional epoxy resin system. This is why it is very useful for the bonding of rigid-flex multilayer boards.
What are the Properties of the Arlon 51N PCB Material?
The Arlon 51N PCB Material has some reliable properties that ensure its high reliability and performance. Let’s consider them.
The Arlon 51N PCB Material has the following physical properties. It has a flammability rating of V0 as well as a thermal conductivity of 0.25 W/mk. Furthermore, it has a density of about 1.65 g/cm3, as well as a water absorption value of 0.15%
The Arlon 51N PCB Material has the following thermal properties. Its temperature for glass transition is 170 degrees Celsius.
Also, its decomposition temperature is 354 degrees Celsius at the initial. Then at a weight loss of 5%, the value becomes 368 degrees Celsius. At 50 – 260 degrees Celsius, the Arlon 51N PCB Material’s expansion along the Z-axis is 2.6%.
For the X, Y axis it has a coefficient of thermal expansion (CTE) of 15 ppm/C. At T260, it is higher than 60 minutes, while for T288, it takes more than 30 minutes. Then for T300, the value is 15 minutes.
The Arlon 51N PCB Material has the following electrical properties. Its dielectric constant is 4.2 at 1 MHz, while at 1 GHz, the dielectric constant is 4.1.
Also, it has a volume resistivity of 2.6 × 107 MΩ-cm for C96/35/90, while at E24/125, it has a volume resistivity of 3.3 × 107 MΩ-cm. Also, at 1 MHz, it has a dissipation factor of 0.02.
Furthermore, this PCB material has an electrical strength of 39.4 kV/mm and an arc resistance that is greater than 124 seconds. Its surface resistivity at E24/125 and C96/35/90 is 4.0 × 106 MΩ and 2.9 × 107 MΩ respectively
The Arlon 51N PCB Material has the following mechanical properties. Its Poisson’s Ratio is 6.5 and its young’s modulus for CD/MD is 2.6 Mpsi or 18 GPa.
In addition, its peel strength with respect to copper is 1.2 N/mm after thermal stress. Then at elevated temperatures, it stands at 1.2 N/mm, while after process solutions, the value is 1.1 N/mm. Also, the tensile strength is 578 Mpa or 84 kpsi.
What are the Recommended Conditions for Processing the Arlon 51N PCB Material?
First make sure that the inner-layers are processed through strip, etch, and develop making use of the normal industry practices. Furthermore, bake the inner layers using a rack at a temperature falling within 225 degrees Fahrenheit and 250 degrees Fahrenheit.
This should be done before lay-up. Also, make sure that you vacuum desiccate your prepreg for about 8 to 12 hours before you laminate.
Lamination Cycle of the Arlon 51N PCB Material
The lamination cycle of this material is as follows
- Pre-vacuum for about 30 to 45 minutes
- The rise in heat has to be controlled to about 8 degrees Fahrenheit to 12 degrees Fahrenheit every minutes
- Lamination pressure has to be between 150 to 300 PSI. Note that thus depends on complexity
- Also, the temperature of the product at the beginning of the cure should be 360 degrees Fahrenheit.
- Cure time at the temperature is 90 minutes
This article has explained everything you need to know about Arlon 51N. This PCB material offers a lot of benefits and features.