Xilinx is one of the core manufacturers of Field Programmable Gate Arrays (FPGAs). One of the reasons why the brand is trusted and patronized by thousands of engineers is because of the wide range of gate arrays they manufacture.
Xilinx ideally categorizes the FPGAs into different families or classes. Each of those Xilinx FPGA classes or families is designed to accommodate different needs for Field Programmable Gate Arrays (FPGAs). One of those Xilinx categories is Kintex-7.
Kintex-7 is one of the FPGA classes under the Xilinx brand. These categories of FPGAs are designed to provide high-end performance without attracting much cost.
The XC7K70T-2FBG676C is one of the Field Programmable Gate Arrays (FPGAs) under the Xilinx Kintex-7 family.
This article explains most of the components of the XC7K70T-2FBG676C, as well as the properties or features the gate array inherits from the primary family – Kintex-7.
What is XC7K70T-2FBG676C FPGA?
As explained earlier, XC7K70T-2FBG676C is a Field Programmable Gate Array (FPGA) categorized under the Xilinx Kintex-7 series.
One of the features that set this FPGA apart from the others is the multiple product categories. It can double as a Field Programmable Gate Array (FPGA), as well as a Programmable Logic. Either way, rest assured that you can use the gate array to facilitate the configuration and or reconfiguration of circuits.
The XC7K70T-2FBG676C FPGA has some technical components or specifications that we would like you to know.
Here are some of the technical components of the XC7K70T-2FBG676C FPGA:
The technology used in designing or reconfiguring a circuit board. This is because the technology used can either improve the aesthetics of the board or reduce the same.
There are many reasons why the Surface Mount Technology is better than the Through Hole Technology. However, we would like to explain more about the SMT so you can understand how it works.
The Surface Mount Technology (SMT) is an electronic manufacturing and assembly process whereby the components to be used for the assembly are mounted on top of the semiconductor IC.
This is both efficient and cost-saving because you do not need to use wire leads. That way, the components would be mounted or placed faster on top of the semiconductor IC, while the costs would be reduced since you wouldn’t need to purchase wire leads or the other associated materials.
2. Style of the Package
Surface Mount Components (SMT) are used in different ways. The method of placement may vary, but the results are the same.
Likewise, there are different styles of packages used for different types of SMT components. It is pertinent to note that each of those package styles works in unique ways.
That is the Xilinx Kintex-7 XC7K70T-2FBG676C FPGA was designed with Grid Array. The full name is Ball Grid Array (BGA) and it is the fourth in the hierarchy of Surface Mount Technology (SMT) components. That notwithstanding, the package style is very effective.
The Ball Grid Array (BGA) works by mounting the components underneath the IC instead of on the side of the package.
The connection pads used alongside the Grid Array package style also come with balls of solder that are melted during the soldering process.
The reason for the balls of solder is to mechanically attach the solder to the board for durability, as well as to improve the sturdiness of the board.
Moreover, the underneath placement of the SMT components in the XC7K70T-2FBG676C FPGA goes a long way to widen the pitch of the connections.
3. MSL Level
The Moisture Sensitivity Level (MSL) of the XC7K70T-2FBG676C Field Programmable Gate Array (FPGA) is one of the outstanding features of this semiconductor IC.
It has an MSL Level of 4 to 72 hours.
Now, we will tell you why the MSL Level is important both on the XC7K70T-2FBG676C or any other FPGA.
What is MSL?
MSL means Moisture Sensitivity Level. It is used to describe the handling and packaging precautions that must be in place to strengthen the durability of the semiconductor.
It also doubles as an electronic standard used for measuring or determining the time it would likely take before the moisture-sensitive device can be exposed to ambient room conditions.
Importance of MSL Level on the XC7K70T-2FBG676C FPGA
The importance or relevance of the MSL 4 to 72 Hours to the XC7K70T-2FBG676C FPGA cannot be undermined. The primary importance is that the components mounted on the XC7K70T-2FBG676C FPGA must be mounted and reflowed within 72 hours.
Doing that goes a long way to prevent the expansion of trapped moisture inside those components. The trapped moisture, would over time, trigger the delamination or internal separation of the plastic. When that happens, internal cracks, separation of the plastic from the lead-frame as well as wire bond damage are more likely to occur.
Therefore, the Moisture Sensitivity Level 4-72 hours on the XC7K70T-2FBG676C FPGA provides the needed atmosphere to quell inordinate expansion, bulging, or popping of the board.
4. Reprogramming Support
Field Programmable Gate Arrays (FPGAs) are designed to bolster or facilitate the improvement, changing, or reprogramming of the electrical components/functionalities on the board.
However, the XC7K70T-2FBG676C FPGA went the extra mile to include support for reprogramming.
This reprogramming support would go a long way to help the design engineer to make important changes in the electrical functionalities inside the device.
Besides, the reprogramming support allows the designer to make the needed changes or modifications either during the assembly process or after the device must have been packaged and shipped to the consumers.
5. High-Performance Logic
Last but not least – the XC7K70T-2FBG676C FPGA performs much more than you expect.
The high-performance of the board is because of the advanced high-performance FPGA logic that is based on real 6-input Lookup Table (LTU) technology.
The XC7K70T-2FBG676C FPGA reeks of high-performance, reduced costs, and lower power. With this device, you can be confident that the electrical device where it is applied will function better.