Our advanced QFN (Quad Flat No-Lead) and QFP (Quad Flat Package) assembly services deliver precision surface-mount technology solutions for high-density electronic applications. These ultra-compact package formats are engineered for optimal thermal performance and space efficiency in modern circuit designs.
Key Features:
- Ultra-fine pitch capabilities down to 0.4mm for maximum component density
- Advanced thermal management with enhanced heat dissipation through exposed thermal pads
- High-precision placement using state-of-the-art pick-and-place equipment with vision alignment
- Lead-free assembly compliant with RoHS and environmental standards
- Comprehensive package support from 16-pin to 256+ pin configurations
Technical Specifications: Our assembly process accommodates package sizes ranging from 3x3mm to 28x28mm, with pin counts from 16 to 256+. We maintain placement accuracy within ยฑ25 microns and support both standard and fine-pitch variants. Our reflow profiles are optimized for each package type to ensure reliable solder joint formation while preventing thermal damage.
Quality Assurance: Every assembly undergoes rigorous inspection including automated optical inspection (AOI), X-ray analysis for hidden solder joints, and in-circuit testing. Our ISO 9001 certified processes ensure consistent quality and reliability across all production volumes.
Applications: Ideal for telecommunications equipment, automotive electronics, consumer devices, medical instruments, and industrial control systems where space constraints and thermal performance are critical design factors.
Manufacturing Capabilities: From prototype to high-volume production, we offer flexible manufacturing solutions with quick turnaround times and comprehensive design for manufacturing (DFM) support to optimize your assembly for cost and reliability.
