How Xilinx XCZU9EG-2FFVB1156E Can Guarantee Improved Performance for Your Electronic Devices

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Xilinx has consistently proven its name in the field of manufacturing Programmable Logics, Integrated Circuits (ICs) and Field Programmable Gate Arrays (FPGAs).

The company has now delved into a new dimension – System on a Chip (SoC). Unlike the previous products, an SoC is designed to provide “full-suite” electronic device configuration options. With it, you can configure and optimize your electronic devices without necessarily using multiple external components.

This article explains how the Xilinx XCZU9EG-2FFVB1156E SoC may be able to turn around the fortunes of your electronic device designs and make them wholesome.

Understanding the Concept of SoC

System on a Chip (SoC) as the name connotes, is more of a “system sitting on a chip.” You can think of it as a chip that contains most of the peripherals and components you need to design your electronic products.

Xilinx XCZU9EG-2FFVB1156E’s SoC does not only have most of these components. It also has a wide range of application and offers low-cost, high-performance for the applications.

Xilinx XCZU9EG-2FFVB1156E Features

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The features of the Xilinx XCZU9EG-2FFVB1156E SoC includes but are not limited to 7 cores, multiple core processors and a host of logic cells and elements.

Talking about the core processors, it uses the trio of ARM Cortex A53, ARM Cortex R5 and ARM Mali-400 MP2.

The ARM Cortex A53 is adjudged to be one of the best processors to use when executing complex projects. According to the manufacturer, the “Cortex-A53 can be implemented in two execution states: AArch32 and AArch64. The AArch64 state allows execution of 64-bit applications. The AArch32 state allows execution of existing Armv7-A applications.”

With this explanation, you can deduce that Xilinx XCZU9EG-2FFVB1156E’s ARM Cortex A53 is capable of dual-issuing some instructions to be used during the board’s development.

We also have the ARM Cortex R5, a core processor enabling the improvement of designs in the areas of enhanced error management and extended functional security. The core processor also “provides extended fault containment for real-time applications.”

The third core processor used by Xilinx XCZU9EG-2FFVB1156E is the ARM Mali-400 MP2. It sees to the reduction of power and bandwidth consumption in the board. It also enables improved performance of the product.

Technical Specifications of Xilinx XCZU9EG-2FFVB1156E SoC

Here is a table highlighting the technical attributes of Xilinx XCZU9EG-2FFVB1156E’s System on a Chip (SoC):

Technical AttributesDescription
Screening LevelExtended Industrial
Moisture Sensitivity Level (MSL)Yes, 4 (72 hours)
Operating Temperature0-degree Celsius to 100-degree Celsius
ArchitectureField Programmable Gate Array (FPGA) and Microcontroller (MCU)
Package/Case1156-BBGA, FCBGA
PeripheralsDMA, WDT
Number of I/O328
Speed Grade2
Speed533 MHz, 600 MHz, and 1.3 GHz
Primary AttributesZynq UltraScale + FPGA, 559 Logic Cells
Number of Registers548,160
In System ProgrammabilityNo
Operating Supply Voltage (min-max)0.808 volts to 0.892 volts
RAM Size256 kilobytes
Connectivity OptionsCANbus, USB OTG, EBI/EMI, UART/USART, Ethernet, SPI, I2C and MMC/SD/SDIO.
Number of Logic Elements (LE)599,500
Pin Count1,156

Xilinx XCZU9EG-2FFVB1156E Conclusion

You can get started on the right foot with your Xilinx XCZU9EG-2FFVB1156E design by contacting a professional digital designer. RayPCB is ready to take your orders and help you configure the SoC according to your specifications.