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How Xilinx XCZU9EG-2FFVB1156E Can Guarantee Improved Performance for Your Electronic Devices

Xilinx has consistently proven its name in the field of manufacturing Programmable Logics, Integrated Circuits (ICs) and Field Programmable Gate Arrays (FPGAs).

The company has now delved into a new dimension – System on a Chip (SoC). Unlike the previous products, an SoC is designed to provide “full-suite” electronic device configuration options. With it, you can configure and optimize your electronic devices without necessarily using multiple external components.

This article explains how the Xilinx XCZU9EG-2FFVB1156E SoC may be able to turn around the fortunes of your electronic device designs and make them wholesome.

Understanding the Concept of SoC

System on a Chip (SoC) as the name connotes, is more of a “system sitting on a chip.” You can think of it as a chip that contains most of the peripherals and components you need to design your electronic products.

Xilinx XCZU9EG-2FFVB1156E’s SoC does not only have most of these components. It also has a wide range of application and offers low-cost, high-performance for the applications.

Xilinx XCZU9EG-2FFVB1156E Features

PCB fabrication and assembly services

The features of the Xilinx XCZU9EG-2FFVB1156E SoC includes but are not limited to 7 cores, multiple core processors and a host of logic cells and elements.

Talking about the core processors, it uses the trio of ARM Cortex A53, ARM Cortex R5 and ARM Mali-400 MP2.

The ARM Cortex A53 is adjudged to be one of the best processors to use when executing complex projects. According to the manufacturer, the “Cortex-A53 can be implemented in two execution states: AArch32 and AArch64. The AArch64 state allows execution of 64-bit applications. The AArch32 state allows execution of existing Armv7-A applications.”

With this explanation, you can deduce that Xilinx XCZU9EG-2FFVB1156E’s ARM Cortex A53 is capable of dual-issuing some instructions to be used during the board’s development.

We also have the ARM Cortex R5, a core processor enabling the improvement of designs in the areas of enhanced error management and extended functional security. The core processor also “provides extended fault containment for real-time applications.”

The third core processor used by Xilinx XCZU9EG-2FFVB1156E is the ARM Mali-400 MP2. It sees to the reduction of power and bandwidth consumption in the board. It also enables improved performance of the product.

Technical Specifications of Xilinx XCZU9EG-2FFVB1156E SoC

Here is a table highlighting the technical attributes of Xilinx XCZU9EG-2FFVB1156E’s System on a Chip (SoC):

Technical AttributesDescription
Screening LevelExtended Industrial
Moisture Sensitivity Level (MSL)Yes, 4 (72 hours)
Operating Temperature0-degree Celsius to 100-degree Celsius
ArchitectureField Programmable Gate Array (FPGA) and Microcontroller (MCU)
Package/Case1156-BBGA, FCBGA
PeripheralsDMA, WDT
Number of I/O328
Speed Grade2
Speed533 MHz, 600 MHz, and 1.3 GHz
Primary AttributesZynq UltraScale + FPGA, 559 Logic Cells
Number of Registers548,160
In System ProgrammabilityNo
Operating Supply Voltage (min-max)0.808 volts to 0.892 volts
RAM Size256 kilobytes
Connectivity OptionsCANbus, USB OTG, EBI/EMI, UART/USART, Ethernet, SPI, I2C and MMC/SD/SDIO.
Number of Logic Elements (LE)599,500
Pin Count1,156

Xilinx XCZU9EG-2FFVB1156E Conclusion

You can get started on the right foot with your Xilinx XCZU9EG-2FFVB1156E design by contacting a professional digital designer. RayPCB is ready to take your orders and help you configure the SoC according to your specifications.