1. Product Specifications
Core Architecture
- Device Family: XQR Series Radiation-Tolerant FPGA
- Technology Node: Advanced FinFET process technology
- Package Type: LSO (Land Grid Array, Space-Grade)
- Pin Count: 20mm x 20mm package format
- Operating Temperature: Extended industrial/military range (-55ยฐC to +125ยฐC)
- Radiation Tolerance: SEU mitigation, TID tolerance up to 100 krad(Si)
Performance Features
- Logic Cells: High-density programmable logic fabric
- DSP Slices: Integrated DSP blocks for signal processing
- Block RAM: On-chip memory blocks for data storage
- AI Engine: Advanced AI acceleration capabilities (if applicable)
- Transceivers: High-speed serial transceivers for communication
- Processing System: Integrated ARM processors (configuration dependent)
Key Capabilities
- AI Inference: Hardware-accelerated AI processing
- Signal Processing: Real-time DSP operations
- Connectivity: Multiple high-speed I/O interfaces
- Security: Hardware-based security features
- Reconfiguration: Field-programmable flexibility
- Power Management: Advanced power optimization
Electrical Specifications
- Supply Voltage: Multiple voltage domains (0.85V core, 1.8V/3.3V I/O)
- Power Consumption: Optimized for space and defense applications
- Clock Frequency: Up to several hundred MHz system clock
- I/O Standards: Support for various LVDS, CMOS standards
2. Pricing
XQR1701LSO20M pricing is available upon request through authorized AMD distributors and sales representatives. Pricing varies based on:
- Order quantity and volume commitments
- Specific grade and screening requirements
- Package options and customization
- Support and development tool licensing
- Long-term supply agreements
Contact AMD or authorized distributors for current pricing and availability. Special pricing may be available for qualified aerospace and defense programs.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guide
- Design Manual: Best practices and design guidelines
- Application Notes: Specific use case implementations
- Errata: Known issues and workarounds
- Migration Guide: Upgrade path from previous generations
Development Resources
- Reference Designs: Pre-built application examples
- IP Catalog: Available intellectual property cores
- Board Support Packages: Development board compatibility
- Software Tools: Vivado Design Suite, Vitis Platform
- Simulation Models: Timing and behavioral models
Media Content
- Product Briefs: High-level feature overviews
- White Papers: Technical deep-dive documents
- Video Tutorials: Getting started and advanced topics
- Webinar Recordings: Expert presentations and demos
- Case Studies: Real-world implementation examples
4. Related Resources
Development Tools
- AMD Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Software development framework
- Vitis AI: Machine learning development tools
- ChipScope Pro: Real-time debugging and analysis
- PetaLinux Tools: Embedded Linux development
Evaluation Platforms
- Development Boards: XQR-series evaluation kits
- Reference Platforms: Application-specific development systems
- Partner Boards: Third-party development solutions
- FMC Modules: Expansion and interface cards
Support Services
- Technical Support: Direct access to AMD engineering
- Training Programs: Design methodology courses
- Consulting Services: Custom design assistance
- Field Application Engineers: Local technical support
- Online Community: User forums and knowledge base
Compatible Products
- Memory Solutions: DDR4/DDR5 interfaces and controllers
- Communication IP: Ethernet, PCIe, USB protocol stacks
- Signal Processing IP: DSP and communication algorithms
- AI/ML Libraries: Pre-optimized neural network models
- Interface Standards: JESD204, CPRI, eCPRI support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: EU chemical safety compliance
- Conflict Minerals: Compliant with conflict-free sourcing
- ISO 14001: Environmental management certification
- Packaging: Recyclable and sustainable materials
Quality Standards
- ISO 9001: Quality management system certification
- AS9100: Aerospace quality management standard
- IPC Standards: PCB assembly and reliability standards
- JEDEC Standards: Semiconductor reliability testing
- MIL Standards: Military specification compliance
Export Control Classifications
- ECCN: Export Control Classification Number (varies by configuration)
- USML: United States Munitions List classification
- EAR: Export Administration Regulations compliance
- ITAR: International Traffic in Arms Regulations (if applicable)
- Country Restrictions: Export limitation by destination
Regulatory Certifications
- FCC: Federal Communications Commission approval
- CE Marking: European Conformity certification
- IC: Industry Canada certification
- UL Listing: Underwriters Laboratories safety certification
- CSA: Canadian Standards Association approval
Screening Levels
- Commercial Grade: Standard operating conditions
- Industrial Grade: Extended temperature range
- Automotive Grade: AEC-Q100 qualified
- Military Grade: MIL-STD-883 screening
- Space Grade: Enhanced radiation tolerance and screening
The XQR1701LSO20M represents AMD’s commitment to delivering high-performance, radiation-tolerant solutions for the most demanding applications. With comprehensive support, extensive documentation, and proven reliability, this device enables next-generation space and defense systems.
For detailed specifications, pricing, and availability, contact your local AMD representative or authorized distributor.
