Product Specifications
The XC5VSX35T-2FF665I delivers outstanding performance through its comprehensive feature set. This FPGA contains 35,840 logic cells with 4,480 configurable logic blocks (CLBs), providing extensive programmable logic resources. The device includes 192 dedicated DSP48E slices optimized for high-speed mathematical operations, making it particularly suitable for signal processing tasks.
Memory resources include 1,728 Kb of block RAM distributed across 48 dual-port block RAM modules, each offering 36 Kb capacity. The XC5VSX35T-2FF665I supports various memory configurations to accommodate diverse application requirements. The device operates with a core voltage of 1.0V and I/O voltage ranging from 1.2V to 3.3V, ensuring compatibility with multiple interface standards.
The FPGA features 440 user I/O pins in the FF665 package, a 665-ball flip-chip fine-pitch ball grid array that measures 27mm x 27mm. This compact form factor maximizes pin density while maintaining excellent thermal and electrical performance. The speed grade -2 indicates balanced performance and power consumption characteristics.
Operating temperature range extends from -40°C to +100°C for the industrial grade version, ensuring reliable operation in demanding environmental conditions. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed differential standards.
Price Information
Pricing for the XC5VSX35T-2FF665I varies based on order quantity, lead time, and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities. Educational and research institutions may qualify for special pricing programs.
The total cost of ownership should consider not only the initial device cost but also development tools, licensing fees, and support services. Xilinx Vivado Design Suite provides comprehensive development environment support for the XC5VSX35T-2FF665I.
Documents & Media
Essential documentation for the XC5VSX35T-2FF665I includes the comprehensive datasheet detailing electrical specifications, timing parameters, and package information. The Virtex-5 Family Overview provides architectural insights and application guidance.
PCB Design Guidelines offer critical information for board layout, including placement recommendations, power distribution, and signal integrity considerations. The Configuration User Guide explains various configuration modes and implementation strategies.
Application notes cover specific implementation topics such as DSP design techniques, memory interface implementation, and clock management strategies. Reference designs demonstrate practical applications and serve as starting points for custom development.
The XC5VSX35T-2FF665I Software Development Kit includes drivers, libraries, and example code to accelerate development. Video tutorials and webinars provide additional learning resources for both novice and experienced developers.
Related Resources
Development boards featuring the XC5VSX35T-2FF665I provide convenient platforms for prototyping and evaluation. These boards typically include essential peripherals, memory interfaces, and expansion connectors.
The Xilinx Vivado Design Suite serves as the primary development environment, offering synthesis, implementation, and debugging tools specifically optimized for Virtex-5 devices. IP cores and reference designs accelerate common functions implementation.
Third-party development tools and IP libraries extend the XC5VSX35T-2FF665I capabilities. Many vendors offer specialized solutions for specific application domains such as communications, video processing, and industrial control.
Training courses and certification programs help engineers maximize their proficiency with the XC5VSX35T-2FF665I. Online forums and community resources provide peer support and knowledge sharing opportunities.
Environmental & Export Classifications
The XC5VSX35T-2FF665I complies with RoHS (Restriction of Hazardous Substances) regulations, making it suitable for commercial and consumer applications worldwide. The device meets WEEE (Waste Electrical and Electronic Equipment) requirements for proper end-of-life disposal.
Export classification follows the Export Administration Regulations (EAR) with specific Export Control Classification Numbers (ECCN) that may require export licenses for certain destinations. Users must verify current export regulations before international shipment.
Environmental operating conditions include humidity tolerance up to 85% relative humidity non-condensing. The device withstands shock and vibration levels specified in relevant military and commercial standards. Lead-free package options support environmental compliance requirements.
The XC5VSX35T-2FF665I manufacturing process adheres to ISO 14001 environmental management standards. Conflict minerals reporting ensures responsible sourcing practices throughout the supply chain.
Reliability specifications include MTBF (Mean Time Between Failures) calculations and qualification test results demonstrating long-term performance stability. The device undergoes extensive testing including thermal cycling, moisture sensitivity, and electrical stress testing to ensure consistent quality and reliability.
