The XCZU9EG-2FFVB1156I is a high-performance System-on-Chip (SoC) solution from AMD/Xilinx’s Zynq UltraScale+ MPSoC family, engineered for demanding embedded applications that require powerful processing capabilities, exceptional programmability, and robust integration options.
1. Product Specifications
Processing Architecture
- Application Processing Unit (APU): Quad-core ARM Cortex-A53 MPCore with CoreSight technology
- Clock speed: 1.5GHz
- NEON and Single/Double Precision Floating Point support
- 32KB/32KB L1 Cache, 1MB L2 Cache
- Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5 with CoreSight technology
- Single/Double Precision Floating Point support
- 32KB/32KB L1 Cache and TCM (Tightly Coupled Memory)
- Graphics Processing: ARM Mali-400 MP2 for accelerated graphics capabilities
FPGA Resources
- Logic Cells: 599,550 cells
- Manufacturing Process: Advanced 20nm technology
- Speed Grade: -2 (middle tier performance)
- Operating Voltage: 0.85V
- I/O Count: 328 programmable I/O pins
Memory Interfaces
- Embedded Memory: 256KB On-Chip Memory with ECC support
- External Memory Support:
- DDR4, DDR3, DDR3L compatibility
- LPDDR4, LPDDR3 support
- Quad-SPI, NAND, and eMMC interfaces
Package Information
- Package Type: FCBGA-1156 (Flip-Chip Ball Grid Array)
- Pin Count: 1156 pins
- Package Dimensions: 35mm ร 35mm
Environmental Specifications
- Temperature Range: Industrial (I) temperature grade
- RoHS Compliance: ROHS3 Compliant
- Operating Temperature: Enhanced for industrial applications
2. Price Information
The XCZU9EG-2FFVB1156I is a premium component with pricing that varies based on quantity, region, and authorized distributor. Current market pricing typically requires a Request For Quote (RFQ) from authorized distributors due to its specialized nature and supply chain considerations.
Quantity discounts are available for bulk orders. For the most competitive pricing, submit an RFQ with your required quantity to an authorized distributor such as:
- Farnell/Newark
- Mouser
- DigiKey
- Avnet
- Arrow Electronics
Lead times generally range from 35-52 weeks depending on market conditions and availability.
3. Documents & Media
Technical Documentation
- Comprehensive datasheet detailing electrical characteristics and specifications
- Zynq UltraScale+ MPSoC Data Sheet (DS891)
- Hardware User Guide with detailed implementation instructions
- Technical Reference Manual for architecture specifications
Development Resources
- Vivado Design Suite compatibility for synthesis and implementation
- Software Development Kit (SDK) for application development
- PetaLinux support for embedded Linux development
- Reference designs for common applications
Application Notes
- Power management configurations
- Memory interfaces implementation
- High-speed communications design
- Design security implementations
- Performance optimization techniques
4. Related Resources
Development Boards & Tools
- ZCU102 Evaluation Board
- ZedBoard
- Trenz Electronic Modules
- Xilinx/AMD Adaptive SoC Developer Zone
Programming & Development
- JTAG debugging support
- Boot mode configurations
- Vivado IP integrator
- Xilinx Software Command-Line Tool (XSCT)
- Vitis AI development environment compatibility
Community Support
- Xilinx/AMD Developer Forums
- Application examples and guides
- Third-party IP cores and solutions
- Reference designs library
5. Environmental & Export Classifications
Environmental Information
- RoHS 3 Compliant
- REACH Compliant
- Lead-free manufacturing process
- Halogen-free package materials
Export Classification
- ECCN: 5A002.A.4
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- Export controls may apply when shipping to certain countries
- Subject to specific regulations for encryption-enabled devices
Packaging & Shipping
- Industry-standard anti-static packaging
- Vacuum-sealed trays for protection
- Temperature-controlled shipping recommended
- Full traceability through authorized distribution channels
