Product Specification
The XCZU6CG-1FFVC900E is a powerful Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from AMD Xilinx, designed to deliver exceptional processing performance for demanding applications. This advanced device combines ARM-based processing with programmable logic capabilities.
Key Technical Specifications:
- Device Family: Zynq UltraScale+ MPSoCs
- Package Type: FFVC900 (Flip-Chip Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (Standard performance grade)
- Total I/O Pins: 900 pins
- Processing System: Quad-core ARM Cortex-A53 Application Processing Unit (APU)
- Real-Time Processing: Dual-core ARM Cortex-R5F Real-time Processing Unit (RPU)
- Programmable Logic: Advanced 16nm FinFET+ process technology
- Memory Interfaces: DDR4, DDR3L, LPDDR4 support
- High-Speed Connectivity: PCIe Gen2/Gen3, USB 3.0, Gigabit Ethernet
The XCZU6CG-1FFVC900E features integrated ARM Mali-400 MP2 Graphics Processing Unit (GPU) and comprehensive peripheral interfaces including CAN, UART, SPI, and I2C controllers. This MPSoC delivers optimal power efficiency while maintaining high computational performance.
Price
XCZU6CG-1FFVC900E pricing varies based on quantity and supplier. Contact authorized distributors for current pricing information:
- Single Unit: Contact for quote
- Volume Pricing: Available for quantities of 100+ units
- Engineering Samples: May be available for qualified customers
- Lead Time: Typically 12-16 weeks for standard orders
Price factors include market demand, package availability, and order volume. The XCZU6CG-1FFVC900E represents excellent value for applications requiring both processing power and programmable logic flexibility.
Documents & Media
Essential Documentation for XCZU6CG-1FFVC900E:
Technical Documentation:
- Product Brief and Overview
- Datasheet with electrical characteristics
- Package and Pinout specifications
- AC/DC switching characteristics
- Power consumption guidelines
Design Resources:
- Reference designs and application notes
- Software development tools compatibility guide
- Hardware development recommendations
- Board design guidelines for FFVC900 package
- Thermal management considerations
Software Support:
- Vivado Design Suite compatibility information
- PetaLinux support documentation
- Vitis unified software platform guides
- Boot and configuration procedures
Access these resources through AMD Xilinx official documentation portal or authorized design partners specializing in XCZU6CG-1FFVC900E implementations.
Related Resources
Development Tools and Platforms:
- Vivado Design Suite: Complete design environment for XCZU6CG-1FFVC900E
- Vitis Unified Software Platform: Accelerated application development
- PetaLinux Tools: Embedded Linux development framework
- Evaluation Boards: Compatible development platforms for prototyping
Application Areas: The XCZU6CG-1FFVC900E excels in multiple domains including industrial automation, automotive systems, communications infrastructure, medical devices, and aerospace applications. Its combination of processing power and programmable logic makes it ideal for edge AI, machine learning inference, and real-time control systems.
Technical Support:
- AMD Xilinx community forums
- Application engineering support
- Third-party design services
- Training and certification programs
Complementary Products: Consider related MPSoCs in the Zynq UltraScale+ family for different performance and feature requirements. The XCZU6CG-1FFVC900E fits within a comprehensive ecosystem of compatible devices and development tools.
Environmental & Export Classifications
Environmental Specifications:
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- RoHS Compliance: Fully compliant with RoHS directives
- REACH Regulation: Compliant with EU REACH requirements
- Pb-Free: Lead-free package and assembly
Quality and Reliability: The XCZU6CG-1FFVC900E meets stringent automotive and industrial quality standards. Comprehensive testing ensures reliable operation across specified environmental conditions.
Export Classifications:
- ECCN: Consult current export control lists
- Country of Origin: Manufactured in qualified facilities
- Export Documentation: Available through authorized channels
Packaging and Handling:
- Moisture sensitivity level appropriate for FFVC900 package
- ESD precautions required during handling
- Proper storage conditions maintain device integrity
The XCZU6CG-1FFVC900E incorporates environmentally conscious design practices while maintaining the performance and reliability standards expected from AMD Xilinx MPSoCs. All environmental and export classifications are subject to current regulations and should be verified with official sources for the most up-to-date information.
For detailed environmental data and export classification verification, consult the official XCZU6CG-1FFVC900E product documentation or contact AMD Xilinx directly.
