1. Product Specifications
Core Architecture
- Processing System:
- Quad-core ARM Cortex-A53 processor up to 1.333 GHz
- Dual-core ARM Cortex-R5F processor up to 533 MHz
- 256KB RAM integrated
- FPGA Fabric:
- 930K+ programmable logic cells
- 16nm FinFET+ technology
- UltraScale+ architecture
Package Details
- Package Type: 1156-FCBGA (Flip Chip Ball Grid Array)
- Package Size: 35mm x 35mm
- Pin Count: 1156 pins
- Operating Temperature: -40ยฐC to +100ยฐC (TJ)
- Speed Grade: L2 (Low Power variant)
Integrated RF Data Converters
- RF-ADC: Up to 8 channels, 14-bit resolution, max 5 GSPS sampling rate
- RF-DAC: Up to 8 channels, 14-bit resolution, max 9.85 GSPS sampling rate
- RF Frequency Range: Supports frequencies up to 6 GHz
Connectivity & Peripherals
- Interfaces: CANbus, EBI/EMI, Ethernet, IยฒC, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Peripherals: DMA controllers, Watchdog Timer (WDT)
- High-Speed Transceivers: Integrated for high-bandwidth applications
Key Features
- Direct RF sampling capability
- Integrated soft-decision FEC
- Advanced power management
- CoreSight debug and trace
- Hardware security features
2. Pricing Information
The XCZU47DR-L2FFVE1156I is available through authorized distributors worldwide. Pricing varies based on:
- Order Quantity: Volume discounts available for bulk orders
- Market Conditions: Pricing subject to semiconductor market fluctuations
- Regional Availability: May vary by geographic location
Availability Status: Currently in stock at major distributors including E-BEST Industrial, DRex Electronics, and other authorized AMD Xilinx partners.
For current pricing and availability:
- Contact authorized distributors for RFQ (Request for Quote)
- Minimum order quantities may apply
- Lead times typically 2-12 weeks depending on volume
3. Documents & Media
Technical Documentation
- Product Datasheet: DS889 – Zynq UltraScale+ RFSoC Overview
- User Guide: UG1075 – Zynq UltraScale+ Package and Pinout Guide
- Reference Manual: Complete technical specifications and programming guide
- Package Files: ASCII pinout files in TXT and CSV formats
Development Resources
- Vivado Design Suite: Primary development environment
- SDK/Vitis: Software development kit for embedded applications
- Reference Designs: Pre-built examples for common applications
- Application Notes: Implementation guidance for specific use cases
Media Resources
- Product images and package diagrams
- Block diagrams and architectural overviews
- Performance benchmarks and case studies
- Video tutorials and webinars
4. Related Resources
Development Platforms
- AXRF47 Development Board: Complete development platform featuring XCZU47DR
- ACRF47 System-on-Module: Plug-in module for rapid prototyping
- Evaluation Kits: Starter kits for proof-of-concept development
Software Tools
- Vivado Design Suite: FPGA design and implementation
- Model Composer: High-level synthesis tools
- System Generator: Simulink-based design environment
- PetaLinux: Embedded Linux development tools
Application Areas
- 5G Wireless Infrastructure: Massive MIMO, beamforming, small cells
- Software Defined Radio: Wideband transceivers, cognitive radio
- Radar & Defense: Phased array radar, electronic warfare systems
- Test & Measurement: High-speed data acquisition, signal analysis
- Satellite Communications: Digital signal processing, modem applications
Technical Support
- AMD Xilinx Forums and Community
- Technical documentation portal
- Application engineering support
- Training and certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulations
- Halogen-Free: Environmentally friendly packaging
- Conflict Minerals: AMD Xilinx conflict minerals policy compliant
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Junction Temperature)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 85% relative humidity (non-condensing)
- Altitude: Up to 3000 meters above sea level
Export Control Classification
- ECCN: Export Control Classification Number as per US Department of Commerce
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
- Country Restrictions: May require export licenses for certain destinations
- End-Use Restrictions: Subject to dual-use technology regulations
Quality & Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Automotive-grade qualification testing
- MTBF: Mean Time Between Failures data available
- Lifecycle Support: Long-term availability and support commitment
Packaging & Shipping
- Packaging: Anti-static tray packaging
- Shipping Classifications: Non-hazardous material
- Handling Precautions: ESD sensitive device – proper handling required
- Traceability: Full supply chain traceability maintained
Part Number: XCZU47DR-L2FFVE1156I
Manufacturer: AMD Xilinx
Product Family: Zynq UltraScale+ RFSoC
Status: Active Production
Lifecycle: Long-term support available
For technical inquiries, pricing, and availability, contact your local AMD Xilinx representative or authorized distributor.
