1. Product Specifications
Core Processing System
- Processor Architecture: Quad ARM Cortex-A53 MPCore with CoreSight up to 1.2GHz
- Real-Time Processing: Dual ARM Cortex-R5 with CoreSight up to 500MHz
- FPGA Logic Cells: 930K+ Logic Cells (930,300 cells)
- Manufacturing Process: 16nm FinFET+ technology
- Operating Voltage: 0.85V core voltage
RF Data Converters
- RF-ADC Channels: 8-way 14-bit RF-ADC with maximum sampling rate of 5GSPS
- RF-DAC Channels: 8-way 14-bit RF-DAC with maximum sampling rate of 9.85GSPS
- Frequency Range: RF input and output frequency response fully supports frequency bands below 6GHz
- Direct RF Sampling: Eliminates need for external data converters
Package and Interface
- Package Type: 1517-Pin FCBGA (40x40mm)
- Pin Count: 1,517 pins total
- Speed Grade: -1 (500MHz processing system, 1.2GHz ARM cores)
- Temperature Grade: I (Industrial temperature range)
Key Features
- Software-Defined Radio: Complete software-defined radio including direct RF sampling data converters
- Integrated IP: Soft-decision forward error-correction (SD-FEC) cores with LDPC and turbo codec support
- High-Speed Transceivers: Multiple GTY transceivers for high-speed serial communication
- Memory Interfaces: Support for DDR4, LPDDR4, and other high-speed memory standards
2. Price
Current Market Pricing
- DigiKey Unit Price: $22,449.96 (1-unit quantity)
- Availability: Order today, ships today from authorized distributors
- Volume Pricing: Contact distributors for bulk pricing and lead times
- Alternative Sources: Available from Mouser Electronics, Avnet, and other authorized AMD distributors
Pricing Considerations
- Pricing subject to market fluctuations and availability
- Volume discounts available for quantities over 25 units
- Educational and development pricing may be available for qualified institutions
- Lead times may vary based on global semiconductor supply conditions
3. Documents & Media
Official Documentation
- Product Data Sheet: AMD DS889 – Zynq UltraScale+ RFSoC Overview
- Reference Manual: UG1085 – Zynq UltraScale+ Device Technical Reference Manual
- Package Documentation: Package drawings and pin assignment files
- PCB Design Guidelines: Layout recommendations and design considerations
Development Resources
- Vivado Design Suite: Complete FPGA development environment with device support
- Vitis Unified Software Platform: Embedded software development tools
- PetaLinux Tools: Linux BSP and customization tools
- Reference Designs: Pre-built designs for common applications
Technical Resources
- Application Notes: RF design guidelines, power management, and thermal considerations
- White Papers: Software-defined radio implementation guides
- Video Tutorials: Getting started guides and advanced design techniques
- Community Forums: AMD developer community support
4. Related Resources
Development Boards and Kits
- ZCU208 Evaluation Kit: Features Zynq UltraScale+ RFSoC ZU48DR with eight 14-bit 5GSPS ADCs and eight 14-bit 10GSPS DACs
- ZCU111 Evaluation Kit: Supporting 8 12-bit 4.096GSPS ADCs, 8 14-bit 6.554GSPS DACs
- Third-Party Modules: ALINX ACRF47 System-on-Module with XCZU47DR device
Compatible IP Cores
- DSP IP: Math functions, filters, and transforms optimized for RFSoC
- Communication IP: Ethernet, PCIe, and other communication protocols
- RF IP: Modulation, demodulation, and signal processing functions
- AI/ML IP: Machine learning acceleration for edge applications
Application Areas
- 5G Wireless Infrastructure: 5G baseband processing and massive MIMO applications
- Aerospace & Defense: Phased array radar and digital array radar systems
- Test & Measurement: High-speed multi-function instruments for signal generation and analysis
- Cable Infrastructure: Cable TV access and DOCSIS applications
Software Ecosystem
- MATLAB/Simulink: HDL Coder and Wireless HDL Toolbox support
- GNU Radio: Open-source software-defined radio framework
- OpenCL: Parallel computing support for FPGA acceleration
- Container Support: Docker and Kubernetes for edge deployment
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets Restriction of Hazardous Substances directive requirements
- REACH Compliant: Complies with EU chemical safety regulations
- Conflict Minerals: AMD maintains conflict-free mineral sourcing policies
- ISO Certifications: Manufactured in ISO 9001:2015 certified facilities
Operating Conditions
- Operating Temperature Range: -40°C to +100°C (Industrial grade)
- Storage Temperature Range: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Control Information
- Export Classification: Subject to U.S. Export Administration Regulations (EAR)
- ECCN Classification: Likely classified under semiconductor-related ECCN
- License Requirements: Export compliance requirements may apply – End Use Statement required for RFSoC kits
- Restricted Countries: Export restrictions may apply to certain destinations
Quality and Reliability
- Qualification Standards: AEC-Q100 automotive qualification (where applicable)
- Reliability Testing: Extensive qualification testing including thermal cycling
- Mean Time Between Failures (MTBF): >1 million hours under standard conditions
- Warranty: Standard manufacturer warranty coverage included
Packaging and Shipping
- Moisture Sensitivity Level: MSL 3 or MSL 4 (requires controlled storage)
- Packaging: Anti-static tray packaging for device protection
- Shipping: Temperature and humidity controlled shipping required
- Handling: ESD precautions required during handling and assembly
Part Number: XCZU47DR-1FFVG1517I
Manufacturer: AMD (formerly Xilinx)
Product Family: Zynq UltraScale+ RFSoC
Status: Active, in production
For the latest technical specifications, documentation, and pricing information, please contact authorized AMD distributors or visit the official AMD developer portal.
