Product Specifications
Core Features
- Part Number: XCZU28DR-2FFVG1517I
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Zynq UltraScale+ RFSoC
- Package Type: 1517-Pin FCBGA (Fine-pitch Ball Grid Array)
- Operating Voltage: 0.85V core voltage
- Process Technology: 20nm FinFET+ process node
- Speed Grade: -2 (933MHz maximum frequency)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Processing System
- ARM Cortex-A53: Quad-core 64-bit application processor
- ARM Cortex-R5: Dual-core real-time processor
- System Memory: Integrated DDR4/DDR3L memory controllers
- Peripherals: USB 3.0, PCIe Gen2, Ethernet, CAN, UART, SPI, I2C
Programmable Logic
- Logic Cells: 930,300 programmable logic cells
- DSP Slices: High-performance DSP48E2 slices for signal processing
- Block RAM: Distributed and block RAM resources
- Clock Management: Multiple PLLs and clock management tiles
- I/O Standards: Support for various single-ended and differential I/O standards
RF Data Converter Subsystem
- RF-ADCs: Up to 8 channels of 14-bit ADCs with sampling rates up to 5 GSPS
- RF-DACs: Up to 8 channels of 14-bit DACs with sampling rates up to 10 GSPS
- Frequency Range: Support for frequency bands below 6GHz (5G ready)
- Digital Signal Processing: Integrated DDCs (Digital Down Converters) and DUCs (Digital Up Converters)
- Analog Bandwidth: Up to 6GHz analog bandwidth capability
Key Applications
- 5G wireless infrastructure and base stations
- Software-defined radio (SDR) platforms
- Cable infrastructure (DOCSIS) applications
- Radar and electronic warfare systems
- Test and measurement equipment
- High-speed data acquisition systems
- Wireless backhaul solutions
Price
Contact for Current Pricing: The XCZU28DR-2FFVG1517I pricing varies based on quantity, delivery requirements, and market conditions. For the most competitive pricing and availability information, please contact authorized distributors or submit a Request for Quote (RFQ).
Pricing Considerations:
- Volume discounts available for bulk orders
- Lead times may vary based on current market demand
- Industrial temperature grade commands premium pricing
- Long-term supply agreements available for production volumes
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and pin descriptions
- User Guide: Comprehensive implementation and design guidelines
- Product Brief: Quick reference specifications and features overview
- Errata: Known issues and workarounds documentation
- Migration Guide: Transition information from previous generations
Design Resources
- Reference Designs: Pre-validated hardware and software implementations
- Application Notes: Specific use-case implementation guidance
- PCB Layout Guidelines: Board design recommendations and constraints
- Thermal Management: Heat dissipation and cooling requirements
- Power Management: Power consumption analysis and optimization
Software Tools
- Vivado Design Suite: Complete FPGA design and implementation toolchain
- Vitis Unified Software Platform: Application development environment
- System Generator: MATLAB/Simulink integration tools
- IP Catalog: Pre-verified intellectual property blocks
- Reference Software: Driver packages and operating system support
Related Resources
Development Platforms
- ZCU111 Evaluation Board: Complete development platform for RFSoC designs
- ZCU216 Evaluation Board: Advanced evaluation platform with high-speed connectivity
- Custom Development Boards: Third-party solutions from ecosystem partners
Ecosystem Partners
- Design Services: Professional design and consulting services
- IP Providers: Specialized intellectual property for specific applications
- Board Manufacturers: Custom hardware development partners
- Software Partners: Application-specific software solutions
Training and Support
- Technical Training: Hands-on courses for FPGA and SoC development
- Community Forums: Peer-to-peer technical discussions and support
- Technical Support: Direct access to AMD Xilinx engineering support
- Documentation Portal: Comprehensive online resource library
Compatible Products
- XCZU47DR-2FFVG1517I: Higher-capacity variant in same package
- XCZU27DR-2FFVG1517I: Lower-cost alternative with reduced features
- XCZU29DR-2FFVF1760I: Extended I/O variant for high pin-count applications
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Compliant: European chemical safety regulation compliance
- Conflict Minerals: Responsible sourcing certification
- Green Product: Meets environmental sustainability standards
- Halogen-Free: Reduced environmental impact packaging and materials
Export Classifications
- HTS Code: 8542.31.00.01 (Harmonized Tariff Schedule)
- ECCN: 3A001.a.7 (Export Control Classification Number)
- Export License: May require export license for certain destinations
- Country of Origin: Manufactured in advanced semiconductor facilities
- REACH Registration: European chemical registration compliance
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management standards
- IATF 16949: Automotive quality management (where applicable)
- IPC Standards: PCB assembly and soldering standards compliance
- JEDEC Standards: Semiconductor packaging and testing standards
Lifecycle Information
- Product Status: Active in production
- Recommended for New Designs: Yes
- Expected Lifecycle: 10+ years production commitment
- Migration Path: Clear upgrade path to future generations
- End-of-Life: Minimum 12-month advance notice policy
Note: Specifications are subject to change without notice. For the most current information, consult the official AMD Xilinx documentation. The XCZU28DR-2FFVG1517I represents cutting-edge FPGA technology suitable for the most demanding RF and communications applications.
