The XCVU125-3FLVC2104E is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional processing power and flexibility for demanding applications. This cutting-edge FPGA combines advanced 20nm technology with innovative architecture to provide developers with a powerful platform for accelerating complex algorithms and implementing custom logic solutions.
Product Specification
The XCVU125-3FLVC2104E features an impressive array of technical specifications that make it suitable for high-performance computing applications:
Core Architecture:
- Logic Cells: 1,228,800 logic cells providing extensive programmable resources
- CLB Slices: 76,800 configurable logic blocks for flexible design implementation
- LUT (Look-Up Tables): 307,200 6-input LUTs for efficient logic mapping
- Flip-Flops: 614,400 flip-flops for robust sequential logic operations
Memory Resources:
- Block RAM: 34.6 Mb of distributed block RAM for data storage
- UltraRAM: 360 Mb of high-density memory blocks for large data sets
- Distributed RAM: Configurable distributed memory throughout the fabric
DSP Capabilities:
- DSP Slices: 2,880 DSP48E2 slices optimized for signal processing
- 25G Transceivers: 32 high-speed transceivers for advanced connectivity
- PCIe Support: Integrated PCIe Gen3 x16 and Gen4 x8 interfaces
Package and Interface:
- Package Type: FLVC2104 (Flip-Chip Land Grid Array)
- I/O Pins: 832 user I/O pins for extensive connectivity options
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Extended commercial temperature range
Price
The XCVU125-3FLVC2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance characteristics. Current market pricing for the XCVU125-3FLVC2104E varies based on quantity, distribution channel, and regional availability.
Pricing Factors:
- Volume discounts available for large-quantity purchases
- Regional pricing variations may apply
- Lead times and availability affect pricing structure
- Authorized distributor pricing may differ from direct sales
For current pricing information on the XCVU125-3FLVC2104E, customers should contact authorized Xilinx distributors or visit official pricing portals. Educational institutions and research organizations may qualify for special academic pricing programs.
Documents & Media
Comprehensive documentation and media resources are available for the XCVU125-3FLVC2104E to support development and implementation:
Technical Documentation:
- Official datasheet with complete electrical and timing specifications
- Pin assignment and package drawings for PCB design
- Power consumption and thermal analysis guides
- Memory interface specifications and timing requirements
Development Resources:
- Vivado Design Suite compatibility guides
- Reference designs and example projects
- IP core integration documentation
- Constraint files and design templates
Application Notes:
- High-speed transceiver implementation guides
- Power management and optimization techniques
- Signal integrity considerations for the FLVC2104 package
- Thermal management best practices
Video and Training Materials:
- Webinar recordings on UltraScale+ architecture
- Tutorial videos for development workflow
- Technical presentation slides and white papers
Related Resources
The XCVU125-3FLVC2104E ecosystem includes various related resources and compatible products:
Development Boards:
- Evaluation boards featuring the XCVU125-3FLVC2104E
- Reference designs for common applications
- Starter kits for rapid prototyping
Software Tools:
- Vivado Design Suite (latest version recommended)
- Vitis unified software platform
- IP catalog with pre-verified IP cores
- Simulation and verification tools
Compatible Products:
- Other Kintex UltraScale+ family members for scalability
- Complementary Xilinx SoC and MPSoC devices
- Third-party IP providers and development tools
Community Resources:
- Xilinx developer forums and community support
- GitHub repositories with open-source projects
- Technical blogs and application showcases
- User group meetings and conferences
Environmental & Export Classifications
The XCVU125-3FLVC2104E meets stringent environmental standards and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Conflict minerals reporting compliance
- ISO 14001 environmental management certification
Export Control Classifications:
- Export Control Classification Number (ECCN) as per US regulations
- Harmonized System (HS) codes for international trade
- Country-specific import/export restrictions may apply
- End-user licensing requirements for certain applications
Quality Standards:
- ISO 9001 quality management system certification
- Automotive qualification available for select grades
- Military and aerospace specifications compliance
- Industrial temperature range operation capability
Packaging and Shipping:
- ESD-safe packaging and handling procedures
- Moisture sensitivity level (MSL) ratings
- Lead-free soldering compatibility
- Recyclable packaging materials
The XCVU125-3FLVC2104E represents a pinnacle of FPGA technology, combining high performance, extensive resources, and comprehensive support ecosystem. This makes it an ideal choice for developers working on advanced applications requiring significant computational power and flexibility in implementation.
