The XCVU095-2FFVA1760I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, engineered for demanding applications requiring exceptional processing capability and advanced features. This industrial-grade FPGA delivers outstanding performance for aerospace, defense, communications, and high-performance computing applications.
Product Specifications
The XCVU095-2FFVA1760I features robust specifications that make it ideal for complex digital signal processing and parallel computing tasks:
Core Architecture:
- Device Family: Virtex UltraScale+
- Logic Cells: 872,000 system logic cells
- CLB Flip-Flops: 1,743,000
- CLB LUTs: 548,160
- Block RAM: 53 Mb total block RAM
- UltraRAM: 360 Mb UltraRAM capacity
Processing Elements:
- DSP Slices: 768 DSP48E2 slices for high-speed mathematical operations
- Transceivers: 80 GTY transceivers supporting up to 32.75 Gbps data rates
- PCIe Blocks: 4 PCIe Gen3/Gen4 blocks for high-speed connectivity
Package & Operating Conditions:
- Package Type: FFVA1760 (Fine-pitch Flip Chip Array)
- Pin Count: 1,760 pins
- Speed Grade: -2 (balanced performance and power)
- Temperature Range: Industrial (-40ยฐC to +100ยฐC)
- Supply Voltage: Multiple voltage domains (0.85V core, 1.8V auxiliary)
Price
The XCVU095-2FFVA1760I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and industrial-grade specifications. Contact authorized Xilinx distributors for current pricing information, as costs vary based on:
- Order quantity and volume discounts
- Lead times and availability
- Geographic region and distributor terms
- Custom packaging or testing requirements
Enterprise customers should inquire about volume pricing programs and long-term supply agreements to optimize total cost of ownership for the XCVU095-2FFVA1760I.
Documents & Media
Essential technical documentation and resources for the XCVU095-2FFVA1760I include:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Packaging and pinout documentation for FFVA1760 package
- Power estimation and thermal management guidelines
- Migration guides from previous FPGA generations
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core libraries and pre-verified blocks
- Timing and constraint file templates
Support Materials:
- Evaluation boards and development kits
- Programming and configuration guides
- Debug and analysis tool documentation
- Training materials and video tutorials
Related Resources
The XCVU095-2FFVA1760I integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Vivado Design Suite for synthesis and implementation
- Vitis unified software platform for embedded development
- ChipScope Pro for real-time debugging and analysis
- Power estimation and analysis tools
Companion Products:
- Compatible memory interfaces (DDR4, HBM)
- High-speed connector solutions
- Power management ICs and modules
- Cooling and thermal management solutions
Design Services:
- Xilinx Alliance Partner network for design support
- Training and certification programs
- Technical support and consulting services
- Custom IP development partnerships
Environmental & Export Classifications
The XCVU095-2FFVA1760I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant construction with lead-free materials
- REACH regulation compliance for chemical substances
- Conflict minerals reporting program participation
- ISO 14001 environmental management system certified manufacturing
Export Control Classifications:
- Export Control Classification Number (ECCN) as per US Bureau of Industry and Security
- Dual-use technology restrictions may apply
- International Traffic in Arms Regulations (ITAR) considerations for specific applications
- Regional export licensing requirements vary by destination
Quality Standards:
- Industrial temperature grade qualification (-40ยฐC to +100ยฐC)
- Automotive-grade reliability testing available
- Military and aerospace screening options
- Extended lifecycle support programs
The XCVU095-2FFVA1760I represents cutting-edge FPGA technology, combining exceptional performance with industrial-grade reliability for mission-critical applications across diverse industries.
