Overview
The XCVU080-H1FFVB2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, designed to deliver exceptional processing power, programmable acceleration, and advanced I/O capabilities for demanding applications. Built on advanced 20nm technology, this FPGA offers an optimal balance of performance, power efficiency, and cost-effectiveness for next-generation designs.
1. Product Specifications
Core Architecture & Performance
- FPGA Family: Virtex UltraScale
- Technology Node: 20nm process technology
- System Logic Cells: 975,000 cells
- CLB Flip-Flops: 891,424
- CLB LUTs: 445,712 (6-input Look-up Tables)
- Speed Grade: -H1 (High performance)
- Operating Voltage: 1.0V core voltage (VCCINT)
Memory Resources
- Block RAM: 50.0 Mb total block RAM capacity
- Block RAM Blocks: 1,421 dedicated 36Kb blocks
- Distributed RAM: 3.9 Mb maximum distributed RAM
- Configuration: Each block RAM can be configured as one 36Kb RAM or two independent 18Kb RAMs
- ECC Support: Single-bit error correction and double-bit error detection
Digital Signal Processing
- DSP Slices: 672 dedicated DSP48E2 slices
- Multiplier: 27ร18-bit twos complement multipliers
- Accumulator: 48-bit accumulator with extensive pipelining
- Pre-adder: Integrated for improved filter performance
- Pattern Detector: 48-bit wide for convergent rounding
High-Speed Connectivity
- I/O Pins: 702 user I/O pins
- HP I/O: 780 maximum high-performance I/O (1.0V to 1.8V)
- HR I/O: 52 maximum high-range I/O (1.2V to 3.3V)
- GTH Transceivers: 32 channels supporting up to 16.3 Gb/s
- GTY Transceivers: 32 channels supporting up to 30.5 Gb/s
- Transceiver Fractional PLLs: 16 for precise clock generation
Package & Physical Characteristics
- Package Type: 2104-FCBGA (Flip-Chip Ball Grid Array)
- Package Dimensions: 47.5mm ร 47.5mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount Technology (SMT)
- Operating Temperature: 0ยฐC to 100ยฐC (TJ)
- Pin Count: 2104 pins total
Integrated Interface Blocks
- PCIe: 4 PCIe Gen3 x8 interfaces
- 100G Ethernet: 4 integrated 100G Ethernet blocks with RS-FEC
- 150G Interlaken: 6 integrated Interlaken blocks
- System Monitor: 1 built-in system monitoring block
Clock Management
- CMTs: 16 Clock Management Tiles
- I/O DLLs: 64 dedicated I/O delay-locked loops
- MMCM: Mixed-Mode Clock Managers for frequency synthesis
- PLLs: Phase-Locked Loops for precise timing
2. Pricing Information
The XCVU080-H1FFVB2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:
- Reference Price Range: $7,842.537 – $8,713.930 USD per unit
- Minimum Order Quantity: 1 piece
- Pricing Structure: FOB (Free on Board) pricing
- Market Dynamics: Prices fluctuate based on global supply chain conditions and market demand
Pricing Considerations
- Pricing varies by distributor, order quantity, and market conditions
- Volume discounts available for larger orders
- Lead times may affect pricing due to supply chain factors
- Contact authorized distributors for current pricing and availability
3. Documents & Media
Technical Documentation
- Official Datasheet: UltraScale Architecture and Product Data Sheet (DS890)
- User Guides: UltraScale Architecture PCB Design User Guide (UG583)
- Configuration Guide: UltraScale Architecture Configuration User Guide (UG570)
- Packaging Guide: UltraScale and UltraScale+ FPGAs Packaging and Pinouts User Guide (UG575)
Development Resources
- Design Tools: Vivado Design Suite for synthesis, implementation, and debugging
- Reference Designs: Available through AMD documentation portal
- Application Notes: Performance optimization and implementation guides
- Pinout Information: Comprehensive pin assignment documentation
Software & IP
- Development Environment: Vivado Design Suite
- IP Cores: LogiCORE IP library compatibility
- Programming: JTAG, SPI, and BPI configuration support
- Simulation: ModelSim, Questa, and VCS support
4. Related Resources
Development Platforms
- Evaluation Boards: VCU108 evaluation kit compatible
- Development Kits: Virtex UltraScale FPGA development boards
- Reference Platforms: PCIe acceleration cards and networking platforms
Compatible Products
- Family Variants: XCVU080-2FFVB2104E, XCVU080-3FFVB2104E alternate speed grades
- Package Options: FFVA2104, FFVD1517, FFVC1517 alternate packages
- Footprint Compatible: Migration paths within UltraScale family
Application Areas
- Data Center Acceleration: Machine learning inference and high-performance computing
- Networking Infrastructure: 100G/400G line cards and packet processing
- Aerospace & Defense: Radar signal processing and secure communications
- Broadcasting: 4K/8K video processing and transcoding
- Scientific Computing: Digital signal processing and algorithm acceleration
Technical Support
- Community Forums: AMD developer community and FPGA forums
- Training Resources: Online courses and certification programs
- Design Services: Partner ecosystem for implementation services
- Technical Documentation: Comprehensive library at docs.amd.com
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 6/6 compliant (lead-free)
- REACH Compliance: EU REACH regulation compliant
- Conflict Minerals: Conflict-free sourcing certified
- Environmental Standards: ISO 14001 manufacturing standards
Quality & Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standard testing protocols
- Moisture Sensitivity: Level 4 (72 hours) MSL rating
- ESD Protection: Class 1A ESD handling requirements
Export Control Information
- ECCN Classification: Check current export control classification
- Country Restrictions: Subject to export licensing requirements
- End-Use Monitoring: Restricted for certain military applications
- Documentation: Export licenses may be required for international shipments
Lifecycle & Availability
- Product Status: Production and actively supported
- Lifecycle Stage: Mature product with long-term availability
- Support Timeline: Minimum 10-year product lifecycle commitment
- Migration Path: Clear upgrade path to UltraScale+ family
Manufacturing Information
- Fab Location: Advanced semiconductor facilities
- Assembly: High-reliability flip-chip packaging
- Test Coverage: 100% production testing
- Traceability: Full supply chain traceability maintained
For the most current specifications, pricing, and availability information, please contact authorized AMD distributors or visit the official AMD documentation portal. Product specifications are subject to change without notice.
