The XCV812E-9FGG900I is a premium Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-EM 1.8V family. This advanced programmable logic device delivers exceptional performance and high memory bandwidth, making it the ideal choice for complex system integration applications including network switching, high-performance video graphics, and advanced communication systems.
1. Product Specifications
Core Technical Specifications
- Part Number: XCV812E-9FGG900I
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E Extended Memory (Virtex-EM) 1.8V FPGAs
- Technology Node: 0.18ฮผm CMOS process with 6-layer metal interconnect
- Package Type: 900-Pin Fine-Pitch Ball Grid Array (FBGA)
- Operating Voltage: 1.8V (1.71V – 1.89V range)
Performance Characteristics
- Logic Capacity: 254,016K Gates
- Logic Cells: 21,168 configurable logic blocks
- Maximum Operating Frequency: Up to 9 speed grade performance
- I/O Pins: 556 user-configurable I/O pins
- Extended Memory: Enhanced block RAM for high-bandwidth applications
Advanced Features
- Copper Interconnect Technology: First FPGA family to deploy copper interconnect for superior performance
- Enhanced Memory Architecture: Extended memory design optimized for high-bandwidth applications
- 6-Layer Metal Process: Aggressive metallization for improved signal integrity
- High-Speed I/O: Optimized for demanding communication and networking applications
Operating Conditions
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 85% non-condensing
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) compliant
2. Price Information
Pricing Structure
The XCV812E-9FGG900I pricing varies based on quantity, distributor, and current market conditions. For accurate pricing information:
- Quote Requests: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities over 100 units
- Lead Time: Typically 2-4 weeks for standard quantities
- Stock Availability: Check with distributors for real-time inventory
Authorized Distributors
- Mouser Electronics
- Avnet
- IC-Components
- MX-Chips Electronics
- Ovaga Technologies
- FTC Electronics
Note: Prices fluctuate based on market conditions and are updated periodically within 24 hours by most distributors.
3. Documents & Media
Technical Documentation
- Official Datasheet: Virtex-EM 1.8V FPGAs Complete Data Sheet (PDF)
- User Guide: Virtex-EM Configuration and Programming Guide
- Package Information: 900-FBGA Package Specifications and Pin Assignments
- Application Notes: Design guidelines and best practices
Design Resources
- Pin Diagram: Complete pinout documentation with signal descriptions
- Reference Designs: Sample implementations and design examples
- Timing Specifications: AC/DC switching characteristics and timing models
- Power Analysis: Power consumption guidelines and thermal considerations
Software Tools
- Vivado Design Suite: Latest version compatibility for synthesis and implementation
- ISE Design Tools: Legacy support for existing designs
- Programming Tools: Configuration and debugging utilities
- Simulation Models: VHDL and Verilog behavioral models
Development Support
- Evaluation Boards: Compatible development and evaluation platforms
- Starter Kits: Ready-to-use development environments
- Code Examples: Reference implementations and tutorials
- Technical Support: Access to Xilinx technical documentation and forums
4. Related Resources
Compatible Products
- XCV812E Family Variants: Different speed grades and package options
- XCV405E Series: Lower-density alternatives in the same family
- Development Boards: Virtex-EM evaluation and prototyping platforms
Application Areas
- High-Speed Networking: 10G to 100G network equipment and switches
- Video Processing: High-definition video graphics and processing systems
- Communications: Advanced signal processing and protocol implementations
- Industrial Control: Real-time control systems and automation
- Aerospace & Defense: Mission-critical applications requiring high reliability
Design Migration Paths
- Upgrade Options: Migration to newer Virtex UltraScale+ families
- Pin Compatibility: Cross-reference with compatible devices
- Performance Scaling: Guidelines for moving to higher-performance variants
Technical Support Resources
- AMD Support Portal: Comprehensive technical support and documentation
- Design Methodology: Best practices for FPGA design implementation
- Training Materials: Educational resources and design tutorials
- Community Forums: Access to developer community and expert advice
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Halogen-Free: Environmentally friendly packaging materials
- ISO 14001 Certified: Manufactured in facilities with environmental management systems
Quality Standards
- ISO 9001: Quality management system certification
- IATF 16949: Automotive quality standard compliance
- ISO 13485: Medical device quality management (where applicable)
- AEC-Q100: Automotive electronics qualification (related variants)
Export Control Information
- ECCN Classification: Export Control Classification Number as per US regulations
- Country of Origin: Manufactured in qualified facilities
- Export Restrictions: Subject to export administration regulations
- Documentation: Certificate of origin and compliance documentation available
Packaging and Shipping
- Anti-Static Packaging: ESD-safe packaging with Faraday cage protection
- Moisture Sensitivity Level: MSL-3 classification
- Shelf Life: Standard semiconductor shelf life requirements
- Shipping Options: Global express delivery via DHL, FedEx, UPS, TNT
Lifecycle Information
- Product Status: Active production with long-term availability
- Lifecycle Support: Extended support through 2040+ timeframe
- Obsolescence Management: Proactive end-of-life communication and migration support
- Warranty Period: Standard 1-year manufacturer warranty
Key Benefits of XCV812E-9FGG900I
โ High Performance: Superior speed grade for demanding applications
โ Extended Memory: Enhanced block RAM for data-intensive operations
โ Proven Technology: Built on mature 0.18ฮผm process with copper interconnect
โ Design Flexibility: Comprehensive I/O options and configuration capabilities
โ Long-Term Support: Reliable availability with extended lifecycle management
Contact authorized distributors for quotes, technical support, and availability information for the XCV812E-9FGG900I FPGA.
