The XCV812E-8BGG560C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E Extended Memory family. This high-performance programmable logic device delivers exceptional processing capabilities for demanding applications in telecommunications, aerospace, defense, and industrial automation systems.
1. Product Specifications
Core Architecture
- Part Number: XCV812E-8BGG560C
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Family: Virtex-E Extended Memory (EM) Series
- Technology: 0.18ฮผm CMOS process
- Operating Voltage: 1.8V (1.71V to 1.89V range)
Logic Resources
- System Gates: 254,016K gates
- Logic Elements/Cells: 21,168 cells
- Maximum Frequency: 416 MHz
- Logic Array Blocks: 404 CLBs
- Total Block RAM: 1,146,880 bits
Package Details
- Package Type: 560-pin Metal BGA (Ball Grid Array)
- Pin Configuration: 560-LBGA with Exposed Pad
- Package Designation: BG560
- Mounting Type: Surface Mount
Operating Conditions
- Operating Temperature Range: 0ยฐC to +85ยฐC (TJ)
- Commercial Temperature Grade: Available
- Speed Grade: -8 (416 MHz performance)
- Power Dissipation: Optimized for high-performance applications
Key Features
- Extended memory architecture for complex data processing
- High-speed programmable logic for real-time applications
- Advanced routing architecture for signal integrity
- Compatible with Xilinx development tools and IP cores
- Suitable for high-speed networking and telecommunications
- Support for complex digital signal processing algorithms
- Enhanced thermal performance with exposed pad package
2. Pricing Information
XCV812E-8BGG560C pricing varies based on quantity and market conditions:
- Single Unit (1+): Contact for current pricing
- Volume Pricing (10+): Request quotation for bulk discounts
- Production Quantities (100+): Significant volume discounts available
- OEM Pricing (1000+): Custom pricing for large-scale production
Important Note: Due to market fluctuations and component availability, pricing is subject to change. For the most current XCV812E-8BGG560C pricing and availability, please contact authorized distributors or submit a request for quotation (RFQ).
Lead Time: Standard lead times range from 2-12 weeks depending on quantity and current stock levels.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCV812E-8BGG560C Complete Specifications (PDF)
- Pin-out Diagrams: Detailed 560-pin BGA pin assignments
- Package Drawings: Mechanical specifications and dimensions
- Application Notes: Design guidelines and best practices
- Reference Designs: Sample implementations and code examples
Development Resources
- Xilinx Vivado Design Suite: Primary development environment
- IP Core Libraries: Pre-verified intellectual property blocks
- Simulation Models: VHDL/Verilog behavioral models
- Timing Analysis: Static timing analysis constraints
- Power Analysis: Power consumption estimation tools
Quality Certifications
- Quality Standards: ISO 9001 certified manufacturing
- Reliability Data: MTBF and failure rate specifications
- Testing Procedures: Production test coverage documentation
4. Related Resources
Compatible Development Boards
- Xilinx Evaluation Boards: Virtex-E series development platforms
- Third-Party Boards: Compatible FPGA development systems
- Reference Designs: Proven implementation examples
Design Tools & Software
- Xilinx Vivado Design Suite: Complete FPGA design environment
- IP Integrator: Graphical system-level design tool
- Synthesis Tools: High-level synthesis and optimization
- Simulation Software: ModelSim, Vivado Simulator compatibility
Technical Support
- Xilinx Support Portal: Online documentation and forums
- Application Engineers: Technical design assistance
- Training Resources: FPGA design courses and tutorials
- Community Forums: Developer community support
Alternative Parts
- XCV812E-7BG560C: 400 MHz speed grade variant
- XCV812E-6BG560C: Lower speed grade option
- XCV1000E Series: Higher capacity alternatives
- Modern Replacements: Current-generation Virtex UltraScale+ options
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS non-compliant (contains lead)
- REACH Compliance: Meets European chemical regulations
- Lead-Free Status: Not lead-free (legacy product)
- Environmental Rating: Standard commercial grade
- Moisture Sensitivity Level (MSL): MSL-3 (168 hours at 30ยฐC/60% RH)
Export Control Information
- Export Control Classification Number (ECCN): Contact manufacturer for current classification
- Country of Origin: Manufactured in various Xilinx facilities
- Harmonized Tariff Code: 8542.31.0001
- Export Restrictions: Subject to U.S. export control regulations
Packaging & Handling
- Anti-Static Protection: ESD-sensitive device requiring proper handling
- Storage Requirements: Dry storage recommended
- Shelf Life: Standard electronic component shelf life
- Packaging Material: Industry-standard anti-static packaging
Quality & Reliability
- Quality Grade: Commercial/Industrial grade
- Screening Level: Standard production testing
- Traceability: Full manufacturing traceability available
- Warranty: Standard manufacturer warranty terms
Disclaimer: Specifications subject to change without notice. For the most current technical specifications, pricing, and availability of the XCV812E-8BGG560C, please consult official AMD Xilinx documentation or contact authorized distributors. This product may have been discontinued; check with manufacturers for current alternatives and replacement recommendations.
