The XCV812E-4FG900C represents a cutting-edge field-programmable gate array (FPGA) designed to meet the demanding requirements of modern electronic systems. This versatile device combines exceptional processing power with flexible configuration options, making it an ideal choice for developers working on complex digital signal processing, telecommunications, and embedded system applications.
Product Specification
The XCV812E-4FG900C delivers robust performance through its advanced architecture and comprehensive feature set. This FPGA incorporates high-density programmable logic resources optimized for both speed and power efficiency. The device features multiple I/O standards support, enabling seamless integration with various system interfaces and protocols.
Key technical specifications include high-speed serial transceivers, abundant memory resources, and dedicated digital signal processing blocks. The XCV812E-4FG900C supports multiple voltage levels and offers extensive clock management capabilities through integrated phase-locked loops and clock management tiles. The device’s 900-pin fine-pitch ball grid array (FG900) package provides optimal signal integrity while maintaining a compact footprint suitable for space-constrained applications.
The FPGA’s architecture supports parallel processing capabilities essential for real-time applications, while its reconfigurable nature allows for field updates and customization. Advanced security features protect intellectual property and ensure system integrity across various deployment scenarios.
Price
Pricing for the XCV812E-4FG900C varies based on order quantity, packaging options, and delivery requirements. Volume pricing tiers are available for large-scale deployments, with significant cost advantages for customers requiring multiple units. Educational institutions and qualified research organizations may be eligible for special academic pricing programs.
For current pricing information and volume discounts, contact authorized distributors or sales representatives. Lead times typically range from standard stock availability to several weeks for special configurations or large volume orders. Extended warranty and support packages are available as additional options.
Documents & Media
Comprehensive technical documentation supports the XCV812E-4FG900C throughout the design and implementation process. The complete datasheet provides detailed electrical specifications, timing parameters, and mechanical package information essential for system integration.
Design guides and application notes offer practical implementation examples and best practices for common use cases. Reference designs demonstrate optimal utilization of the device’s capabilities across various application domains. Software development tools include synthesis, place-and-route, and debugging utilities specifically optimized for the XCV812E-4FG900C architecture.
Video tutorials and webinar recordings provide visual learning resources for both novice and experienced developers. CAD library files support popular electronic design automation tools, streamlining the PCB design process. Errata documents and product change notifications ensure developers stay informed about any device updates or modifications.
Related Resources
The XCV812E-4FG900C ecosystem includes development boards and evaluation kits that accelerate prototype development and proof-of-concept implementations. These platforms provide convenient access to the device’s key features while offering expansion capabilities for custom applications.
Software tools and IP cores complement the hardware platform, providing pre-validated building blocks for common functions. Third-party solutions from ecosystem partners extend the available resources, including specialized algorithms, interface controllers, and system-level components.
Training programs and certification courses help development teams maximize their productivity with the XCV812E-4FG900C. Online communities and technical forums provide peer-to-peer support and knowledge sharing opportunities. Regular technical workshops and conferences offer networking opportunities and insights into emerging applications.
Environmental & Export Classifications
The XCV812E-4FG900C meets stringent environmental compliance standards, including RoHS directive compliance for lead-free manufacturing processes. The device operates reliably across extended temperature ranges, making it suitable for automotive, industrial, and aerospace applications where environmental conditions may be challenging.
Export classification information ensures compliance with international trade regulations. The device’s classification supports global distribution while maintaining appropriate controls for sensitive applications. Documentation includes ECCN (Export Control Classification Number) details and relevant country-specific import requirements.
Environmental impact considerations include recyclability assessments and conflict mineral compliance reporting. The manufacturing process incorporates sustainable practices while maintaining the high quality and reliability standards expected from the XCV812E-4FG900C. Packaging materials are selected to minimize environmental impact while providing adequate protection during shipping and storage.
Quality certifications demonstrate adherence to industry standards for manufacturing, testing, and reliability. The XCV812E-4FG900C undergoes comprehensive qualification testing to ensure consistent performance across production lots and operating conditions.
The XCV812E-4FG900C continues to set the standard for high-performance FPGA solutions, delivering the flexibility and capability required for next-generation electronic systems. Its combination of advanced features, comprehensive support resources, and environmental compliance makes it an excellent choice for demanding applications across multiple industries.
