Product Specifications
Core Features
- Device Family: Xilinx Virtex-E
- Part Number: XCV600E-FG676AGT
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Operating Temperature: Industrial grade (-40°C to +85°C)
- Logic Cells: Approximately 600,000 system gates
- Flip-Flops: 13,824 flip-flops
- Block RAM: 288 Kbits of embedded memory
- Multipliers: Dedicated 18×18 multiplier blocks
- I/O Standards: Support for multiple voltage standards including LVTTL, LVCMOS, GTL+
Technical Specifications
- Maximum Operating Frequency: Up to 200 MHz
- Supply Voltage: 1.8V core, 3.3V I/O
- Power Consumption: Optimized for low-power applications
- Configuration Memory: External configuration required
- Package Dimensions: 27mm x 27mm FBGA package
Price Information
The XCV600E-FG676AGT pricing varies based on quantity and supplier. For current pricing and availability:
- Contact authorized Xilinx distributors
- Request quotes for volume purchases
- Check with major electronics suppliers like Digi-Key, Mouser, or Arrow
- Typical pricing ranges from $200-$500 per unit depending on market conditions
Note: Prices fluctuate based on market demand and availability. Contact suppliers for real-time pricing.
Documents & Media
Technical Documentation
- Datasheet: Comprehensive electrical and timing specifications
- User Guide: Detailed implementation guidelines and best practices
- Application Notes: Design examples and optimization techniques
- Errata Sheet: Known issues and workarounds
- Package Information: Mechanical drawings and land pattern recommendations
Development Resources
- Design Files: Reference designs and example projects
- Simulation Models: SPICE and behavioral models
- CAD Symbols: Schematic symbols and PCB footprints
- Programming Files: Bitstream examples and configuration templates
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: On-chip debugging and analysis
- System Generator: MATLAB/Simulink integration tools
- EDK (Embedded Development Kit): Embedded processor design tools
Compatible Products
- Configuration Devices: Platform Flash PROMs
- Development Boards: Evaluation and prototyping platforms
- IP Cores: Pre-verified intellectual property blocks
- Reference Designs: Proven application solutions
Support Resources
- Technical Support: Xilinx Answer Database and forums
- Training Materials: Online courses and documentation
- Application Engineers: Design consultation services
- Community Forums: User discussions and troubleshooting
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: European chemical safety compliance
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- ISO 14001: Environmental management system certified manufacturing
Export Control Information
- ECCN Classification: Check current export control classification
- Country Restrictions: May be subject to export licensing requirements
- End-Use Restrictions: Dual-use technology considerations apply
- Documentation Required: Proper export documentation may be needed
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: -40°C to +85°C operating range
- Quality Assurance: ISO 9001 certified manufacturing processes
- Reliability Testing: Extensive qualification and stress testing
The XCV600E-FG676AGT represents proven FPGA technology suitable for a wide range of applications requiring high-performance programmable logic. Its robust feature set and comprehensive development ecosystem make it an excellent choice for engineers developing next-generation electronic systems.
For the most current technical specifications, pricing, and availability information, please consult official Xilinx documentation and authorized distributors.
