1. Product Specifications
Core Architecture
- Part Number: XCV600E-7FG676C0773
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Capacity: 186.624K system gates
- Logic Cells: 15,552 cells
- Operating Frequency: 400MHz maximum
Process Technology
- Manufacturing Process: 0.18ฮผm CMOS technology
- Metal Layers: 6-layer metal process
- Core Voltage: 1.8V
Package Information
- Package Type: 676-Pin Fine-pitch Ball Grid Array (FBGA)
- Speed Grade: -7 (High-performance grade)
- Temperature Grade: Commercial (C-temp: 0ยฐC to +85ยฐC)
- Pin Count: 676 pins
Key Features
- High-speed programmable logic architecture optimized for place-and-route efficiency
- Rich hierarchy of fast, flexible interconnect resources
- Advanced system features for complex digital designs
- Superior silicon efficiency compared to previous generations
- RoHS compliance status varies by supplier
2. Pricing Information
Current Market Pricing (2025)
Standard Pricing Tiers:
- 1+ units: $684.93 – $684.86
- 10+ units: $684.25 – $672.03
- 30+ units: $683.57 – $661.84
- 50+ units: $682.89 – $651.66
- 100+ units: $682.21 – $641.48
Alternative Sources:
- Rochester Electronics LLC: $684.86 per unit
- Bulk pricing available for volume orders
Note: Prices subject to change based on market conditions and supplier availability. Contact authorized distributors for current quotations and volume discounts.
3. Documents & Media
Technical Documentation
- Product Datasheet: XCV600E Virtex-E FPGA Family Datasheet (PDF)
- Pinout Information: 676-pin FBGA package pinout diagrams
- Application Notes: Virtex-E design implementation guidelines
- User Guide: Virtex-E configuration and programming manual
Design Resources
- Reference Designs: Sample implementations and design templates
- Development Tools: ISE Design Suite compatibility information
- Simulation Models: SPICE and behavioral models for circuit simulation
- Package Specifications: Mechanical drawings and thermal characteristics
Software Support
- Design Software: Xilinx ISE Design Suite (legacy support)
- Programming Tools: iMPACT and ChipScope Pro compatibility
- IP Cores: Compatible intellectual property cores and libraries
4. Related Resources
Development Platforms
- Virtex-E evaluation boards and development kits
- Reference design platforms for rapid prototyping
- Third-party development boards supporting XCV600E devices
Compatible Products
- Similar Devices: XCV600E-6FG676C, XCV600E-7BG432C
- Higher Capacity: XCV800E, XCV1000E series
- Alternative Packages: BGA432, BGA560, FBGA900 variants
Design Tools & Software
- Programming Software: Xilinx ISE WebPACK (free version available)
- Verification Tools: ModelSim simulation environment
- Debug Tools: ChipScope Pro embedded logic analyzer
- IP Integration: CORE Generator for optimized IP cores
Technical Support
- Xilinx/AMD technical documentation portal
- Community forums and design support resources
- Application engineering support for complex implementations
- Training materials and design methodologies
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Resistance: Package-dependent thermal characteristics
Compliance & Certifications
- RoHS Compliance: Varies by manufacturing date and supplier
- REACH Regulation: Compliant with EU REACH requirements
- Lead-Free: Available in lead-free package options
- MSL Rating: Moisture Sensitivity Level classification available
Export Control Information
- ECCN Classification: Subject to U.S. Export Administration Regulations
- Country of Origin: Manufacturing location varies
- Export Restrictions: May require export licenses for certain destinations
- Military/Aerospace: Consult export control guidelines for restricted applications
Quality Standards
- Quality Grade: Industrial/Commercial grade device
- Qualification Standards: Xilinx standard qualification procedures
- Reliability Data: MTBF and failure rate specifications available
- Package Quality: Standard assembly and test procedures
Applications
The XCV600E-7FG676C0773 is ideal for:
- Digital signal processing applications
- Communications infrastructure equipment
- Industrial automation and control systems
- High-speed data acquisition systems
- Prototyping complex digital designs
- Legacy system maintenance and upgrades
Conclusion
The XCV600E-7FG676C0773 delivers proven high-performance programmable logic capabilities for demanding applications. With its robust architecture, comprehensive development ecosystem, and reliable supply chain support, this Virtex-E FPGA continues to serve critical roles in established designs while providing flexibility for future enhancements.
