Product Specifications
Core Features
- Device Family: Xilinx Virtex-E Series
- Part Number: XCV50E-FG256AGT
- System Gates: 50,000 equivalent gates
- Logic Cells (CLBs): 576 configurable logic blocks
- Total I/O Pins: 176 user I/O pins
- Package Type: FG256 (Fine-Pitch Ball Grid Array)
- Speed Grade: Standard performance optimization
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Memory and Storage Capabilities
- Block RAM: 32 Kbits total embedded memory
- Distributed RAM: User-configurable distributed memory
- Configuration Memory: SRAM-based for rapid reconfiguration
- Memory Blocks: 4 dedicated block RAM modules
Performance Specifications
- Maximum Operating Frequency: Up to 180 MHz (design dependent)
- Power Supply Requirements: 2.5V core voltage, 3.3V I/O
- Package Dimensions: 17mm x 17mm compact BGA footprint
- Pin Pitch: 1.0mm fine-pitch array
Advanced Technical Features
- High-performance routing architecture for optimal timing
- Dedicated arithmetic carry chains for fast computation
- On-chip clock management with integrated DLL
- Multiple I/O standard support (LVDS, LVCMOS, GTL)
- IEEE 1149.1 boundary scan capability
- Hot-swappable I/O support for system flexibility
Pricing Information
Current Market Pricing for XCV50E-FG256AGT:
- Unit Quantities (1-24 pieces): Contact authorized distributors for current pricing
- Small Volume (25-99 units): Quantity discounts available
- Production Volumes (100+ units): Significant volume pricing reductions
- Engineering Samples: Available for qualified development projects
Recommended Suppliers
- Digi-Key Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Future Electronics
Pricing varies based on market conditions, order quantities, and lead times. Contact suppliers directly for the most current XCV50E-FG256AGT pricing.
Documents & Media
Essential Technical Documentation
- Complete Datasheet: Electrical characteristics and timing specifications
- User Guide: Comprehensive design and implementation manual
- Application Notes: Proven design methodologies and examples
- Design Advisory: Known limitations and recommended practices
- Pin-out Documentation: Detailed package and signal descriptions
Design Support Materials
- IBIS Models: Signal integrity simulation support
- Package Models: Thermal and mechanical specifications
- Reference Schematics: Proven circuit implementations
- Layout Guidelines: PCB design best practices
- Power Estimation Tools: Accurate power consumption analysis
Development Software
- Xilinx ISE Design Suite: Professional development environment
- WebPACK Software: Free design tools for smaller projects
- ChipScope Pro: Real-time debugging and analysis
- System Generator: MATLAB/Simulink integration tools
Related Resources
Development Platforms
- Spartan/Virtex-E Evaluation Boards: Ready-to-use development platforms
- Third-Party Development Kits: Compatible evaluation systems
- Reference Design Boards: Industry-specific implementation examples
Compatible Product Family
- XCV100E-FG256: Higher gate count pin-compatible option
- XCV300E Series: Expanded logic capacity alternatives
- Spartan-II Family: Cost-optimized alternatives for volume applications
- Configuration Solutions: XC18V00 series configuration PROMs
Technical Support Resources
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineering Support: Direct technical assistance
- Training and Education: Comprehensive learning materials
- IP Core Library: Pre-verified intellectual property blocks
Design Services
- Xilinx Alliance Partners: Certified design service providers
- Reference Design Library: Proven implementation examples
- Migration Assistance: Upgrade path guidance and support
Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Compliance: Lead-free package variants available
- WEEE Directive: Compliant with electronic waste regulations
- REACH Compliance: EU chemical safety requirements met
- Green Package Options: Environmentally responsible alternatives
Export Control Information
- ECCN Classification: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Licensing: Required for specific international destinations
Quality and Reliability Standards
- Manufacturing Standard: ISO 9001 certified facilities
- Quality Grade: Commercial temperature range certified
- Moisture Sensitivity: MSL 3 rating per JEDEC standards
- Reliability Testing: Comprehensive qualification and burn-in procedures
Package and Handling Specifications
- ESD Classification: Electrostatic discharge sensitive device
- Storage Requirements: Controlled humidity and temperature conditions
- Packaging Options: Tray and tape & reel configurations available
- Lead-Free Processing: Compatible with lead-free soldering processes
Regulatory Certifications
- FCC Compliance: Electromagnetic compatibility certified
- CE Marking: European conformity standards met
- UL Recognition: Safety standard compliance where applicable
- International Standards: IEC and other global certifications
Target Applications
The XCV50E-FG256AGT excels in diverse applications requiring programmable logic solutions:
- Communications Infrastructure: Base station controllers and protocol processors
- Industrial Automation: Real-time control systems and sensor interfaces
- Medical Devices: Signal processing and data acquisition systems
- Test and Measurement: High-speed data capture and analysis equipment
- Automotive Electronics: Advanced driver assistance and infotainment systems
- Consumer Electronics: Digital video processing and multimedia applications
- Aerospace Systems: Embedded computing and signal conditioning
Key Advantages of XCV50E-FG256AGT
The XCV50E-FG256AGT offers compelling advantages for engineers seeking reliable, cost-effective programmable logic solutions:
- Compact Footprint: Space-efficient 17mm x 17mm package size
- Proven Architecture: Time-tested Virtex-E technology platform
- Design Flexibility: Rapid prototyping and field-upgradeable functionality
- Cost-Effective: Optimal price-performance ratio for mid-range applications
- Comprehensive Support: Extensive documentation and development tools
- Long-Term Availability: Established product with reliable supply chain
Technical Support and Ordering
For technical specifications, pricing information, and ordering details for the XCV50E-FG256AGT, contact your local Xilinx authorized distributor or visit the official Xilinx product pages for the most current information and support resources.
This product description provides comprehensive information about the XCV50E-FG256AGT. For the latest updates, technical support, and detailed documentation, consult official Xilinx resources and authorized distribution partners.
