Product Code: XCV400E-FG676AGT
Manufacturer: AMD Xilinx
Family: Virtex-E Field Programmable Gate Arrays
The XCV400E-FG676AGT is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family, engineered to deliver exceptional performance in demanding digital applications. This advanced programmable logic device combines high-capacity processing power with flexible design capabilities, making it the ideal choice for telecommunications, automotive, industrial automation, and embedded system applications.
1. Product Specifications
Core Architecture
- Device Family: Virtex-E 1.8V FPGAs
- System Gates: 400,000 gates
- Logic Cells: 10,800 cells
- Operating Voltage: 1.8V
- Process Technology: 0.18ฮผm CMOS with 6-layer metal structure
- Package Type: 676-pin Fine-Pitch Ball Grid Array (FBGA)
- Package Code: FG676
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
- Speed Grade: Standard performance variant
Key Features
- I/O Pins: 404 user I/O pins for maximum connectivity
- Block RAM: Integrated memory blocks for efficient data storage
- Clock Management: Advanced clock distribution and management system
- Programmable Logic: Reconfigurable architecture for design flexibility
- High-Speed Performance: Optimized for fast signal processing applications
- Industry-Standard Compatibility: Supports multiple I/O standards
Technical Specifications
- Logic Capacity: 10,800 logic cells with distributed RAM
- Memory: Embedded block RAM for data buffering
- Clock Frequency: High-speed operation up to maximum rated frequency
- Power Consumption: Optimized for low-power applications
- Configuration: SRAM-based configuration memory
- Programming Interface: JTAG boundary scan and configuration support
2. Pricing Information
Current Market Status: Contact authorized distributors for real-time pricing
The XCV400E-FG676AGT pricing varies based on quantity, lead time, and supplier. Market prices fluctuate due to:
- Global semiconductor supply chain conditions
- Volume purchase requirements
- Regional availability
- Lead time specifications
Pricing Factors:
- Minimum order quantities (MOQ)
- Bulk pricing discounts available
- OEM and volume customer pricing tiers
- Geographic region and local distributor margins
Recommended Action: Contact authorized Xilinx distributors or electronic component suppliers for current quotations and availability status.
3. Documents & Media
Official Documentation
- Datasheet: XCV400E-FG676AGT Product Datasheet (PDF)
- User Guide: Virtex-E Configuration Guide
- Application Notes: Implementation and design guidelines
- Pin Configuration: Detailed pinout diagram and ball assignment
- Package Information: Mechanical drawings and thermal specifications
Design Resources
- IBIS Models: Signal integrity simulation models
- FPGA Design Tools: Compatible with Xilinx ISE Design Suite
- Reference Designs: Example implementations and code samples
- Configuration Files: Bitstream generation utilities
- Timing Models: Performance characterization data
Software Support
- Development Environment: Xilinx ISE (legacy) / Vivado Design Suite compatibility
- Simulation Tools: ModelSim, Vivado Simulator support
- Programming Software: iMPACT configuration utility
- Debug Tools: ChipScope Pro analyzer compatibility
4. Related Resources
Development Boards & Evaluation Kits
- Virtex-E evaluation platforms
- Third-party development boards supporting FG676 package
- Prototype and demonstration systems
- Educational and training kits
Companion Products
- Configuration Devices: Serial configuration PROMs
- Clock Generation: Clock synthesizer ICs
- Power Management: Voltage regulator modules
- Interface Components: Level shifters and transceivers
- Debug Hardware: JTAG programming cables and pods
Technical Support Resources
- Online Forums: Xilinx community support
- Application Engineers: Technical assistance and design consultation
- Training Materials: FPGA design methodology courses
- Knowledge Base: Design tips, troubleshooting guides, and FAQs
- Third-Party Tools: EDA vendor software compatibility information
Compatible Alternative Parts
- XCV400E-6FG676I (Industrial temperature grade)
- XCV400E-7FG676C (Different speed grade option)
- XCV400E-8FG676C (Higher performance variant)
- XCV600E-FG676AGT (Higher capacity option)
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS non-compliant (legacy product)
- REACH Compliance: Compliant with EU REACH regulation
- Conflict Minerals: Supplier declaration available
- Lead-Free Status: Contains lead (legacy technology)
- Environmental Rating: Standard commercial grade
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- MSL Rating: Moisture Sensitivity Level classification
- ESD Sensitivity: Class 1 (human body model)
Export & Trade Classifications
- ECCN (Export Control Classification Number): Refer to current AMD Xilinx export control documentation
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country of Origin: Manufacturing location specification
- Export Restrictions: Subject to applicable export control regulations
- Trade Compliance: Compliance with international trade requirements
Quality & Reliability
- Quality Standard: ISO 9001 certified manufacturing
- Reliability Testing: Automotive and industrial grade testing
- Lifecycle Status: Legacy product – not recommended for new designs
- Warranty: Standard manufacturer warranty terms
- Traceability: Full manufacturing lot traceability available
Packaging & Handling
- Anti-Static Protection: ESD-safe packaging required
- Storage Requirements: Dry storage in anti-static containers
- Handling Precautions: Grounding straps and ESD workstation required
- Shipping Classification: Standard electronic components classification
- Disposal: Electronic waste recycling compliance required
Product Summary
The XCV400E-FG676AGT represents a proven solution in AMD Xilinx’s Virtex-E FPGA portfolio, offering robust performance for legacy system maintenance and specialized applications. While this device is no longer recommended for new designs, it continues to serve critical roles in existing systems requiring high-reliability programmable logic solutions.
Key Benefits:
- Established track record in mission-critical applications
- Comprehensive development tool support
- Wide temperature range operation
- High I/O count for complex interfacing requirements
- Cost-effective solution for volume applications
Target Applications:
- Legacy system maintenance and upgrades
- Industrial control and automation
- Telecommunications infrastructure
- Automotive electronics (where applicable)
- Aerospace and defense systems (subject to export controls)
For new design projects, consider migrating to current-generation Xilinx FPGA families that offer enhanced performance, lower power consumption, and advanced features while maintaining design methodology compatibility.
