The XCV400-5BG432C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-4 family, designed to deliver exceptional performance for demanding digital signal processing and high-speed networking applications. This advanced FPGA combines cutting-edge technology with reliable performance, making it an ideal choice for engineers and developers requiring flexible, high-performance computing solutions.
Product Specifications
The XCV400-5BG432C features robust specifications that make it suitable for complex digital designs:
Core Architecture:
- Logic Cells: 400,000 system gates
- CLB Array: 64 x 96 Configurable Logic Blocks
- Distributed RAM: 1,728 Kb
- Block RAM: 1,728 Kb total capacity
- Dedicated Multipliers: 96 embedded 18×18 multipliers
Performance Characteristics:
- Speed Grade: -5 (high performance)
- Maximum Operating Frequency: Up to 500 MHz
- Power Supply: 1.2V core, 3.3V I/O
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Package Details:
- Package Type: BG432 (Ball Grid Array)
- Pin Count: 432 pins
- Package Size: 27mm x 27mm
- Ball Pitch: 1.0mm
I/O Capabilities:
- User I/O Pins: 324 maximum
- Differential I/O Pairs: 162 pairs
- I/O Standards: Support for LVDS, SSTL, HSTL, and other high-speed standards
- High-speed serial transceivers for advanced connectivity
Pricing Information
The XCV400-5BG432C is competitively priced within the high-performance FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most current pricing information and volume discounts, please contact authorized Xilinx distributors or sales representatives. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Technical Documentation:
- XCV400-5BG432C Datasheet: Complete electrical and timing specifications
- Virtex-4 Family User Guide: Comprehensive architecture and design guidelines
- Package and Pinout Information: Detailed pin assignments and mechanical drawings
- Migration Guide: Assistance for upgrading from previous FPGA generations
Design Resources:
- Reference designs and application notes
- Timing and power estimation tools
- PCB layout guidelines and recommendations
- Thermal management documentation
Software Support:
- Xilinx ISE Design Suite compatibility
- Vivado Design Suite support for newer design flows
- IP core libraries and reference implementations
Related Resources
Development Tools:
- Xilinx ISE WebPACK (free version available)
- ModelSim simulation software compatibility
- ChipScope Pro for embedded logic analysis
- PlanAhead for design planning and implementation
Evaluation Platforms:
- Virtex-4 development boards and starter kits
- Third-party evaluation platforms
- Reference design demonstrations
- Academic program resources
Technical Support:
- Xilinx technical support services
- Community forums and knowledge base
- Training courses and webinars
- Application engineering support
Compatible Products:
- Other Virtex-4 family members for design scalability
- Spartan series for cost-optimized alternatives
- Zynq SoCs for ARM processor integration
- Kintex and Artix families for balanced performance
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free packaging available)
- WEEE directive compliance
- ISO 14001 environmental management standards
- Conflict minerals compliance reporting
Operating Conditions:
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: +125ยฐC maximum
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
Quality Standards:
- Automotive grade options available (extended temperature range)
- Military temperature grade variants
- Industrial grade specifications
- Quality management system ISO 9001 certified
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific part marking)
- Export license requirements may apply for certain destinations
Packaging Options:
- Moisture sensitivity level (MSL): Level 3
- Dry pack shipping available
- Anti-static packaging standard
- Tray and tape/reel packaging options
The XCV400-5BG432C represents a mature, proven FPGA solution that continues to serve critical applications across telecommunications, aerospace, defense, and industrial markets. Its combination of performance, flexibility, and extensive ecosystem support makes it a reliable choice for both new designs and legacy system maintenance.
