XCV300E-8FG256C – Xilinx Virtex-E FPGA High-Performance Programmable Logic Solution

1. Product Specifications

Core Architecture

• Logic Elements: 6,912 logic elements/cells
• Configurable Logic Blocks (CLBs): 1,536 CLBs
• System Gates: 411,955 gates equivalent
• Block RAM: 131,072 total RAM bits

I/O and Package Details

• User I/O Pins: 176 user I/O pins
• Package Type: 256-Ball Fine-pitch Ball Grid Array (FBGA)
• Package Dimensions: 17mm × 17mm
• Speed Grade: 8 (indicating high-performance timing characteristics)

Electrical Specifications

• Supply Voltage: 1.71V to 1.89V (1.8V nominal)
• Operating Temperature: 0°C to +85°C (TJ)
• Mounting Type: Surface Mount Technology (SMT)

Manufacturing Process

• Technology Node: 0.18μm CMOS with 6-layer metal process
• Architecture: Optimized for place-and-route efficiency

2. Pricing Information

Current Market Pricing

The XCV300E-8FG256C pricing varies by supplier and quantity requirements. Current pricing is available upon request (Call for Quote/RFQ) from authorized distributors.

Pricing Factors:

• Order quantity (volume discounts available)
• Lead time requirements
• Packaging options (tray vs. tape and reel)
• Geographic location and shipping

Stock Availability: Multiple suppliers report stock availability with quantities ranging from 133 to 2,829 pieces

Note: As this is a legacy/obsolete component, pricing may vary significantly based on remaining inventory levels.

3. Documents & Media

Official Documentation

• Primary Datasheet: Xilinx Virtex-E Family Data Sheet (DS003)
• Technical Reference Manual: Virtex-E 1.8V Field Programmable Gate Arrays
• Configuration Guide: Virtex-E Configuration User Guide
• Package Information: 256-FBGA Package specifications

Design Resources

• ECAD Models: Available for major CAD platforms
• IBIS Models: For signal integrity analysis
• Pin-out Diagrams: Detailed I/O pin assignments
• Timing Specifications: Speed grade 8 timing characteristics

Application Notes

• Place and route optimization techniques
• Power management strategies
• I/O standards implementation
• Clock management best practices

4. Related Resources

Compatible Development Tools

• Xilinx ISE Design Suite: Primary development environment
• ModelSim: HDL simulation software
• ChipScope Pro: On-chip debugging tool
• CORE Generator: IP core integration tool

Related Virtex-E Family Members

• XCV300E-8FG456C: 456-ball FBGA variant with 312 I/Os
• XCV300E-8PQ240C: 240-pin PQFP package option
• XCV300E-7FG256C: Speed grade 7 equivalent
• XCV300E-6FG256C: Speed grade 6 alternative

Development Boards

While specific XCV300E development boards are limited due to legacy status, compatible evaluation platforms include:

• Xilinx Spartan/Virtex evaluation boards
• Third-party FPGA development systems
• Custom prototyping boards

Technical Support Resources

• Xilinx Answer Database
• Community forums and user groups
• Application engineering support
• Legacy product documentation archive

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Contains lead / RoHS non-compliant (Legacy product manufactured before RoHS requirements)
• REACH Compliance: Subject to REACH regulations for certain substances
• Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act

Export Control Classifications

• ECCN (Export Control Classification Number): Subject to US Export Administration Regulations (EAR)
• Country of Origin: Manufactured in various locations depending on production timeframe
• Export Restrictions: May require export licenses for certain destinations

Environmental Operating Conditions

• Operating Temperature Range: 0°C to +85°C (Commercial grade)
• Storage Temperature: -65°C to +150°C
• Relative Humidity: 10% to 85% non-condensing
• Thermal Resistance: Package-dependent thermal characteristics

Package Environmental Specifications

• Moisture Sensitivity Level: MSL 3 (requires controlled storage conditions)
• ESD Sensitivity: ESD protection required during handling
• Soldering Profile: Compatible with standard lead-free reflow profiles

Lifecycle Status

• Product Status: Obsolete (No longer in active production)
• Last Time Buy: Completed (subject to remaining distributor inventory)
• Recommended Alternatives: Xilinx 7-Series or UltraScale families for new designs

Applications

The XCV300E-8FG256C excels in applications requiring high-performance programmable logic:

• Digital Signal Processing: High-speed filtering and signal manipulation
• Telecommunications: Protocol processing and data switching
• Industrial Automation: Real-time control systems
• Aerospace & Defense: Mission-critical embedded systems
• Medical Equipment: Advanced diagnostic and imaging systems
• Automotive Electronics: Safety and infotainment systems

Ordering Information

Part Number: XCV300E-8FG256C
Manufacturer: Xilinx (now AMD)
Category: Embedded – FPGAs (Field Programmable Gate Array)
Series: Virtex-E

For current availability, pricing, and technical support, contact authorized distributors or Xilinx/AMD directly. Due to the obsolete status, recommend evaluating current-generation alternatives for new design projects.