Product Specifications
Core Architecture Details
- Device Family: Xilinx Virtex-E Series FPGA
- System Gates: 300,000 equivalent gates
- Speed Grade: -6 (high-performance specification)
- Package: PQ240C (240-pin Plastic Quad Flat Pack, Commercial grade)
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Logic and Memory Configuration
- Configurable Logic Blocks (CLBs): High-density array architecture
- Block SelectRAM: Dedicated memory blocks for data storage
- Distributed RAM: Additional memory resources within CLBs
- Maximum User I/O: Up to 180 configurable I/O pins
- Input/Output Banks: Multiple independent I/O voltage domains
Performance Specifications
- Maximum Operating Frequency: 200+ MHz system clock rates
- Configuration Memory: SRAM-based reconfigurable architecture
- Power Supply Requirements:
- Core voltage: 1.8V ยฑ5%
- I/O voltage: 1.5V to 3.3V (selectable per bank)
- Configuration Time: Fast configuration via multiple interfaces
Advanced Features
- Clock Management: Integrated delay-locked loops (DLLs)
- I/O Standards Support: LVTTL, LVCMOS, LVDS, SSTL, HSTL
- Boundary Scan: IEEE 1149.1 JTAG compatible
- Readback Capability: Configuration verification support
Pricing Information
Current Market Pricing: XCV300E-6PQ240C pricing depends on order quantity, supplier relationships, and market availability. As a legacy Virtex-E series component, pricing typically ranges from $180-$450 per unit based on volume commitments.
Cost Considerations:
- Volume pricing available for quantities over 100 units
- Long-term availability contracts recommended for production designs
- Alternative sourcing through authorized distributors and component brokers
Budget Planning: Contact certified Xilinx distributors for accurate XCV300E-6PQ240C quotes, including:
- Current stock availability
- Lead time requirements
- Volume discount structures
- End-of-life planning guidance
Documents & Media
Essential Technical Documentation
- XCV300E-6PQ240C Datasheet: Complete electrical and timing specifications
- Virtex-E Family User Guide: Architecture overview and design guidelines
- Package Information: PQ240C mechanical drawings and pinout details
- Configuration Guide: Programming and bitstream generation procedures
Design Support Materials
- Application Notes: Best practices for XCV300E-6PQ240C implementation
- Reference Designs: Proven design examples and IP cores
- Timing Analysis Reports: Speed file data and constraint guidelines
- Power Estimation Tools: Spreadsheets and calculator utilities
Software Documentation
- ISE Design Suite Compatibility: Tool version requirements
- Constraint File Examples: UCF templates for common applications
- Simulation Libraries: Behavioral and timing simulation models
- Debug Resources: ChipScope Pro integration guidelines
Related Resources
Development Environment
- Xilinx ISE Design Suite: Primary development platform for XCV300E-6PQ240C
- WebPACK ISE: Free development tools (device-dependent licensing)
- ModelSim Integration: Third-party simulation environment support
- Synthesis Tools: Synplify Pro and Precision RTL compatibility
Hardware Development Support
- Evaluation Platforms: Development boards featuring XCV300E-6PQ240C
- Programming Cables: USB and parallel cable solutions
- Configuration Solutions: Serial PROMs and alternative boot methods
- Prototyping Boards: Custom PCB design references
Technical Support Resources
- Xilinx Answer Database: Searchable knowledge base for XCV300E-6PQ240C
- Community Forums: User-contributed solutions and discussions
- Application Engineers: Direct technical consultation services
- Training Materials: FPGA design methodology courses
Migration and Upgrade Paths
- Newer FPGA Families: Migration guides to current Xilinx architectures
- Pin Compatibility: Cross-reference tools for package migration
- Performance Comparison: Benchmarking against modern alternatives
- Legacy Support: Long-term maintenance strategies
Environmental & Export Classifications
Environmental Standards Compliance
- RoHS Directive: XCV300E-6PQ240C meets European RoHS requirements
- REACH Compliance: Conformity with EU chemical regulations
- Lead-Free Compatible: Suitable for Pb-free soldering processes
- Green Packaging: Environmentally conscious packaging materials
Operating Environmental Specifications
- Commercial Temperature Range: 0ยฐC to +85ยฐC ambient operation
- Storage Temperature: -65ยฐC to +150ยฐC non-operating
- Relative Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000 meters above sea level operational
Export Control and Trade Compliance
- Export Control Classification Number (ECCN): Verify current ECCN status
- Country of Origin Marking: Manufacturing location identification
- Trade Agreement Compliance: NAFTA, WTO, and bilateral trade agreements
- Dual-Use Technology: Subject to export administration regulations
Quality and Reliability Standards
- Manufacturing Standards: ISO 9001:2015 certified production facilities
- Quality Grade: Commercial screening and testing protocols
- Reliability Testing: Standard commercial reliability qualification
- Traceability: Full component genealogy and lot tracking
Package and Handling Requirements
- Moisture Sensitivity Level: MSL classification per JEDEC standards
- ESD Protection: Class 1 electrostatic discharge sensitive device
- Handling Procedures: Anti-static protocols required during assembly
- Storage Requirements: Controlled environment storage recommendations
Legacy Product Notice: The XCV300E-6PQ240C represents mature FPGA technology from Xilinx’s Virtex-E series. While this device continues to serve existing applications effectively, designers should evaluate current Xilinx FPGA families for new projects to benefit from enhanced performance, reduced power consumption, and extended product lifecycles.
Technical Consultation: For specific XCV300E-6PQ240C implementation questions, timing analysis, or migration planning, engage with authorized Xilinx technical support channels or certified design service providers.
