Product Overview
The XCR3512XL-12FTG256C is a cutting-edge 3.3V, 512 macrocell Complex Programmable Logic Device (CPLD) from AMD/Xilinx’s CoolRunner XPLA3 family. This advanced programmable logic solution delivers exceptional performance with ultra-low power consumption, making it ideal for power-sensitive applications in portable, handheld, and battery-operated devices.
1. Product Specifications
Core Performance Features
- Part Number: XCR3512XL-12FTG256C
- Manufacturer: AMD (formerly Xilinx)
- Technology Family: CoolRunner XPLA3 CPLD
- Macrocells: 512 macrocells
- System Gates: 12,000 usable gates (12K gates)
- Speed Grade: -12 (12ns pin-to-pin delay)
- Maximum Frequency: 77-83 MHz operating frequency
- Supply Voltage: 3.3V single supply operation
- Process Technology: 0.35ฮผm CMOS technology
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
- Package Code: FTG256
- Operating Temperature: Commercial grade (0ยฐC to +70ยฐC)
Advanced Technology Features
- Fast Zero Power (FZP) design technology combining low power and high speed
- TotalCMOS architecture using full CMOS process and design techniques
- Pin-to-pin propagation delays: As fast as 7.5ns typical
- Standby power consumption: Less than 56ฮผW without power-down schemes
- 32 function blocks providing maximum design flexibility
- Industry-standard JTAG boundary scan for enhanced testability
- In-System Programmable (ISP) capability for field updates
Package and Pinout Details
- Pin Count: 256 pins in fine-pitch BGA configuration
- Package Dimensions: Compact footprint optimized for space-constrained designs
- I/O Pins: Maximum available I/O pins depending on design utilization
- Ball Pitch: Fine-pitch design for high-density mounting
- Lead-Free: RoHS compliant package construction
2. Pricing Information
Current Market Pricing
The XCR3512XL-12FTG256C pricing varies based on quantity and distributor:
Quantity-Based Pricing Structure:
- Small quantities (1-59 units): Contact distributor for current pricing
- Medium volumes (60-119 units): Competitive pricing available
- High volumes (120+ units): Volume discounts typically 15-25% off list price
- Production quantities (1000+ units): Factory direct pricing available
Typical Price Range: $85-$165 USD per unit depending on quantity and market conditions
Price Factors:
- Current semiconductor market conditions
- Lead times and availability
- Distributor relationships and volume commitments
- Geographic region and shipping requirements
Note: Prices subject to change based on market conditions. Contact authorized distributors for current quotations and availability.
3. Documents & Media
Technical Documentation
- Primary Datasheet: XCR3512XL 512 Macrocell CPLD Data Sheet (DS081)
- Family Overview: CoolRunner XPLA3 CPLD Family Data Sheet
- Application Notes: Power optimization and design guidelines
- Programming Guide: ISP and device programming specifications
- Package Information: Mechanical drawings and land pattern guidelines
Design Resources
- Schematic Symbols: Available in major CAD libraries
- IBIS Models: For signal integrity analysis
- SPICE Models: For circuit simulation
- 3D Package Models: For mechanical design verification
- Reference Designs: Example implementations and best practices
Software Support
- Xilinx ISE Design Suite: Legacy design environment support
- Third-party Tools: Support for industry-standard EDA tools including:
- Mentor Graphics tools
- Cadence/OrCAD
- Synopsys synthesis tools
- Synplicity Pro
- Exemplar Logic Leonardo
Programming Support
- Device Programmers: Compatible with industry-standard programmers
- JTAG Programming: In-system programming capability
- File Formats: Supports standard JEDEC, SVF, and XSVF formats
4. Related Resources
Development Tools and Software
- ISE WebPACK: Free development environment for CoolRunner devices
- Simulator Support: Compatible with industry-standard simulators for functional and timing verification
- HDL Support: VHDL, Verilog, and ABEL design entry options
- Schematic Capture: Integrated schematic design environment
Cross-Reference and Alternatives
Pin-Compatible Variants:
- XCR3512XL-7FTG256C (faster -7 speed grade)
- XCR3512XL-10FTG256C (mid-range -10 speed grade)
- XCR3512XL-12FTG256I (industrial temperature range)
Package Alternatives:
- XCR3512XL-12PQ208C (208-pin PQFP package)
- XCR3512XL-12FG324C (324-pin BGA package)
Application Examples
- Portable Electronics: Battery-powered devices requiring low power consumption
- Communication Systems: Protocol conversion and interface logic
- Industrial Controls: Machine control and automation systems
- Automotive Electronics: Body control modules and sensor interfaces
- Consumer Electronics: Power management and system control functions
Design Guidelines
- Power Management: Optimal power consumption strategies
- Signal Integrity: High-speed design considerations
- Thermal Management: Package thermal characteristics and cooling
- Layout Guidelines: PCB design best practices for BGA packages
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 2011/65/EU compliant (lead-free)
- WEEE Directive: Compliant with waste electrical equipment regulations
- REACH Regulation: Meets EU chemical substance requirements
- Conflict Minerals: Compliant with conflict-free sourcing requirements
Quality and Reliability Standards
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Meets JEDEC standards for semiconductor reliability
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification provided
- Temperature Cycling: Qualified for automotive and industrial temperature ranges
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country of Origin: Semiconductor fabrication location documented
- Export Restrictions: Compliant with international trade regulations
Safety and Certification
- UL Recognition: Where applicable for safety-critical applications
- FCC Compliance: Electromagnetic compatibility for US market
- CE Marking: European conformity marking for applicable directives
- Industrial Standards: Meets automotive (AEC-Q100) where specified
Packaging and Shipping
- Anti-Static Packaging: ESD-safe packaging and handling procedures
- Moisture Barrier: Appropriate moisture protection for storage and shipping
- Traceability: Full lot traceability for quality and reliability tracking
- Documentation: Certificate of Compliance (CoC) available upon request
Summary
The XCR3512XL-12FTG256C represents a proven solution for applications requiring high-performance programmable logic with minimal power consumption. Its combination of 512 macrocells, ultra-low power operation, and flexible I/O makes it an excellent choice for next-generation electronic designs across multiple industries.
For technical support, pricing information, or design consultation, contact your authorized AMD/Xilinx distributor or visit the official AMD developer resources portal.
